公开(公告)号：US11205611B1

公开(公告)日：2021-12-21

申请号：US16901310

申请日：2020-06-15

申请人： Texas Instruments Incorporated

发明人： Vijaylaximi Khanolkar ,  Sreeram Subramanyam Nasum ,  Tarunvir Singh

IPC分类号： H01L23/49 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/492

摘要： An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

公开(公告)号：US20210391240A1

公开(公告)日：2021-12-16

申请号：US16901310

申请日：2020-06-15

申请人： Texas Instruments Incorporated

发明人： Vijaylaximi Khanolkar ,  Sreeram Subramanyam Nasum ,  Tarunvir Singh

IPC分类号： H01L23/495 ,  H01L23/492 ,  H01L21/56 ,  H01L23/00

摘要： An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.