公开(公告)号：US20210375540A1

公开(公告)日：2021-12-02

申请号：US17240656

申请日：2021-04-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Zhemin Zhang ,  Byron Lovell Williams ,  Dongbin Hou ,  Sombuddha Chakraborty

IPC: H01F41/04 ,  H01F17/00 ,  H01F17/04

Abstract: A laminate embedded core and coil structure comprises a magnetic core embedded in a laminate structure that includes two types of laminates. A first laminate embeds the coils of the structure and a second laminate fills space between the magnetic core and the first laminate, as well as space below the magnetic core and lower surface of the first laminate. The first and second laminates form a laminate structure that protects and improves isolation of the magnetic components. Solder resist encloses the laminate structure, magnetic core and coils. The laminate embedded core and coil structure may be assembled on a transformer leadframe of various types using non-conductive paste.

公开(公告)号：US20240428987A1

公开(公告)日：2024-12-26

申请号：US18826688

申请日：2024-09-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Dongbin Hou ,  Sombuddha Chakraborty ,  Kenji Kawano ,  Jeffrey Morroni ,  Yuki Sato

IPC: H01F27/34 ,  H01F27/02 ,  H01F27/24 ,  H01F27/28 ,  H01F41/00 ,  H02M3/158

Abstract: In one example, an apparatus includes a base, a first inductor, and a second inductor. The first inductor is on the base. The first inductor has a first winding extension, a second winding extension, and a first winding coupled between the first winding extension and the second winding extension, in which at least a part of the second winding extension is vertically between at least a part of the first winding extension and the base. Also, the second inductor is on the base. The second inductor has a third winding extension, a fourth winding extension, and a second winding coupled between the third winding extension and the fourth winding extension, in which at least a part of the fourth winding extension is vertically between at least a part of the third winding extension and the base, and the second winding is laterally adjacent to the first winding.

公开(公告)号：US20240170207A1

公开(公告)日：2024-05-23

申请号：US18427734

申请日：2024-01-30

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Zhemin Zhang ,  Yuki Sato ,  Kenji Otake ,  Vijaylaxmi Khanolkar

IPC: H01F41/04 ,  H01F27/28

CPC classification number: H01F41/041 ,  H01F27/2804

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

公开(公告)号：US11887776B2

公开(公告)日：2024-01-30

申请号：US16904875

申请日：2020-06-18

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Zhemin Zhang ,  Yuki Sato ,  Kenji Otake ,  Vijaylaxmi Khanolkar

IPC: H01F41/04 ,  H01F27/28

CPC classification number: H01F41/041 ,  H01F27/2804

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

公开(公告)号：US20210398736A1

公开(公告)日：2021-12-23

申请号：US16904875

申请日：2020-06-18

Applicant: Texas Instruments Incorporated

Inventor： Yi Yan ,  Zhemin Zhang ,  Yuki Sato ,  Kenji Otake ,  Vijaylaxmi Khanolkar

IPC: H01F27/26 ,  H01F27/28

Abstract: A method includes performing a printing process that deposits a magnetic paste onto a first side and into an opening of a laminate; curing the magnetic paste to form a first transformer core piece having a first portion along the first side and a second portion filling the opening of the laminate; joining a second transformer core piece to a side of the second portion of the first transformer core piece to form a transformer. A transformer includes a laminate; a first core piece; and a second core piece, the first core piece comprising: a cured magnetic paste, a first portion along a side of the laminate, and a second portion filling an opening of the laminate, the second core piece extending along a side of the second portion of the first transformer core piece, and the laminate having windings that encircle the opening.

公开(公告)号：US11869855B2

公开(公告)日：2024-01-09

申请号：US17953162

申请日：2022-09-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F27/28 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

CPC classification number: H01L23/645 ,  H01F17/04 ,  H01F27/022 ,  H01F27/28 ,  H01F41/0206 ,  H01F41/06 ,  H01L21/4842 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49503 ,  H01L28/10

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.

公开(公告)号：US20240006392A1

公开(公告)日：2024-01-04

申请号：US17852925

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Anton Winkler ,  Christopher Manack ,  Jeffrey Morroni ,  Hidetoshi Inoue ,  Yuki Sato ,  Kenji Otake

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L49/02 ,  H01L21/54 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01L25/165 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3128 ,  H01L23/295 ,  H01L28/10 ,  H01L28/40 ,  H01L24/29 ,  H01L24/81 ,  H01L24/94 ,  H01L21/54 ,  H01F27/292 ,  H01F27/327 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/2919 ,  H01L2224/29186 ,  H01L2224/81447 ,  H01F41/005

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects coupled between the semiconductor die and the substrate; an insulation layer coupled between the semiconductor die and the substrate, the insulation layer surrounding the metal interconnects; an inductor coupled to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, the metal interconnects and the insulation layer, the magnetic material having a different material from the insulation layer.

公开(公告)号：US20240006259A1

公开(公告)日：2024-01-04

申请号：US17852979

申请日：2022-06-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hidetoshi Inoue ,  Kenji Otake ,  Yuki Sato ,  Takafumi Ando ,  Jeffrey Morroni ,  Anton Winkler ,  Yi Yan

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16 ,  H01L49/02 ,  H01L21/56 ,  H01F27/32 ,  H01F41/00

CPC classification number: H01L23/295 ,  H01L24/16 ,  H01L23/3128 ,  H01L25/165 ,  H01L28/10 ,  H01L2224/81447 ,  H01L24/81 ,  H01L21/561 ,  H01F27/327 ,  H01F41/005 ,  H01L2224/16227 ,  H01L28/40

Abstract: In one example, an integrated circuit comprises: a substrate; a semiconductor die; metal interconnects, the semiconductor die being mounted to the substrate via the metal interconnects; an inductor mounted to the substrate; and a magnetic material encapsulating the semiconductor die, the inductor, and the metal interconnects, the magnetic material including: coated metal particles, which are coated with a first insulation material; and a second insulation material, in which the coated metal particles are suspended.

公开(公告)号：US20230013938A1

公开(公告)日：2023-01-19

申请号：US17947288

申请日：2022-09-19

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yuki Sato ,  Kenji Otake ,  Takafumi Ando ,  Jeffrey Morroni ,  Charles Allen Devries, JR. ,  Kristen Nguyen Parrish

IPC: H01L23/64 ,  H01L49/02 ,  H01L23/31 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

Abstract: An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.

公开(公告)号：US11488914B2

公开(公告)日：2022-11-01

申请号：US16581033

申请日：2019-09-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Zhemin Zhang ,  Kenji Otake ,  Yi Yan ,  Jeffrey Morroni ,  Yuki Sato ,  Takafumi Ando

IPC: H01L23/64 ,  H01F41/06 ,  H01F41/02 ,  H01F17/04 ,  H01F27/28 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H01L49/02 ,  H01F27/02

Abstract: In examples, a method of manufacturing a transformer device comprises providing a first magnetic member and providing a laminate member containing primary and secondary transformer windings wound around an orifice extending through the laminate member. The method further comprises positioning a build up film abutting the laminate member. The method also comprises positioning at least a portion of a second magnetic member in the orifice. The method further comprises heat pressing at least one of the first and second magnetic members such that a distance between the first and second magnetic members decreases and such that the build-up film melts, thereby producing a transformer device.