公开(公告)号：US10833034B2

公开(公告)日：2020-11-10

申请号：US16046739

申请日：2018-07-26

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Shih-Cheng Chang

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/522

摘要： The present disclosure provides a semiconductor package, including a substrate, an active region in the substrate, an interconnecting layer over the active region, a conductive pad over the interconnecting layer, surrounded by a dielectric layer. At least two discrete regions of the conductive pad are free from coverage of the dielectric layer. A method of manufacturing the semiconductor package is also disclosed.

公开(公告)号：US20160315050A1

公开(公告)日：2016-10-27

申请号：US15201122

申请日：2016-07-01

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Shih-Cheng Chang ,  Liang-Chen Lin ,  Fu-Tsai Hou ,  Tung-Chin Yeh ,  Shih-Kai Lin ,  Gia-Her Lu ,  Jyun-Lin Wu ,  Hsien-Pin Hu

IPC分类号： H01L23/525 ,  H01L23/528 ,  H01L23/522

CPC分类号： H01L23/5256 ,  H01L23/5223 ,  H01L23/5286 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry has a first power node and a second power node. The first capacitor is coupled to the first fuse serially to form a first segment. The second capacitor is coupled to the second fuse serially to form a second segment. The first segment and the second segment are coupled together in parallel and between the first power node and the second power node.

摘要翻译： 一个实施例是电路。 该电路包括有源电路，第一电容器，第一保险丝，第二电容器和第二保险丝。 有源电路具有第一功率节点和第二功率节点。 第一电容器连续地连接到第一保险丝以形成第一段。 第二电容器连续地连接到第二保险丝以形成第二段。 第一段和第二段并联在第一功率节点和第二功率节点之间。

公开(公告)号：US09385079B2

公开(公告)日：2016-07-05

申请号：US14334389

申请日：2014-07-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Shih-Cheng Chang ,  Liang-Chen Lin ,  Fu-Tsai Hou ,  Tung-Chin Yeh ,  Shih-Kai Lin ,  Gia-Her Lu ,  Jyun-Lin Wu ,  Hsien-Pin Hu

IPC分类号： H01L23/525 ,  H01L23/522 ,  H01L23/532 ,  H01L23/528

CPC分类号： H01L23/5256 ,  H01L23/5223 ,  H01L23/5286 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry has a first power node and a second power node. The first capacitor is coupled to the first fuse serially to form a first segment. The second capacitor is coupled to the second fuse serially to form a second segment. The first segment and the second segment are coupled together in parallel and between the first power node and the second power node.

摘要翻译： 一个实施例是电路。 该电路包括有源电路，第一电容器，第一保险丝，第二电容器和第二保险丝。 有源电路具有第一功率节点和第二功率节点。 第一电容器连续地连接到第一保险丝以形成第一段。 第二电容器连续地连接到第二保险丝以形成第二段。 第一段和第二段并联在第一功率节点和第二功率节点之间。

公开(公告)号：US10014252B2

公开(公告)日：2018-07-03

申请号：US15201122

申请日：2016-07-01

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Shih-Cheng Chang ,  Liang-Chen Lin ,  Fu-Tsai Hou ,  Tung-Chin Yeh ,  Shih-Kai Lin ,  Gia-Her Lu ,  Jyun-Lin Wu ,  Hsien-Pin Hu

IPC分类号： H01L23/525 ,  H01L23/522 ,  H01L23/532 ,  H01L23/528

CPC分类号： H01L23/5256 ,  H01L23/5223 ,  H01L23/5286 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry has a first power node and a second power node. The first capacitor is coupled to the first fuse serially to form a first segment. The second capacitor is coupled to the second fuse serially to form a second segment. The first segment and the second segment are coupled together in parallel and between the first power node and the second power node.

公开(公告)号：US20150214150A1

公开(公告)日：2015-07-30

申请号：US14334389

申请日：2014-07-17

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Shih-Cheng Chang ,  Liang-Chen Lin ,  Fu-Tsai Hou ,  Tung-Chin Yeh ,  Shih-Kai Lin ,  Gia-Her Lu ,  Jyun-Lin Wu ,  Hsien-Pin Hu

IPC分类号： H01L23/525 ,  H01L27/01

CPC分类号： H01L23/5256 ,  H01L23/5223 ,  H01L23/5286 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry has a first power node and a second power node. The first capacitor is coupled to the first fuse serially to form a first segment. The second capacitor is coupled to the second fuse serially to form a second segment. The first segment and the second segment are coupled together in parallel and between the first power node and the second power node.

摘要翻译： 一个实施例是电路。 该电路包括有源电路，第一电容器，第一保险丝，第二电容器和第二保险丝。 有源电路具有第一功率节点和第二功率节点。 第一电容器连续地连接到第一保险丝以形成第一段。 第二电容器连续地连接到第二保险丝以形成第二段。 第一段和第二段并联在第一功率节点和第二功率节点之间。

公开(公告)号：US11824027B2

公开(公告)日：2023-11-21

申请号：US17092142

申请日：2020-11-06

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Shih-Cheng Chang

IPC分类号： H01L23/48 ,  H01L23/00 ,  H01L23/522

CPC分类号： H01L24/14 ,  H01L23/5226 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/10 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/0221 ,  H01L2224/02145 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/06051 ,  H01L2224/11462 ,  H01L2224/11912 ,  H01L2224/13007 ,  H01L2224/13018 ,  H01L2224/13082 ,  H01L2224/13147 ,  H01L2224/13655 ,  H01L2224/16227 ,  H01L2924/3511

摘要： The present disclosure provides a semiconductor package including a semiconductor chip and a package substrate. The semiconductor chip includes a substrate, a plurality of conductive pads in the substrate, and a plurality of conductive bumps. Each of the conductive bumps is over corresponding conductive pad. At least one of the conductive bumps proximity to an edge of the semiconductor chip is in contact with at least two discrete regions of the corresponding conductive pad. The package substrate has a concave surface facing the semiconductor chip and joining the semiconductor chip through the plurality of conductive bumps.