公开(公告)号：US20190067231A1

公开(公告)日：2019-02-28

申请号：US15687943

申请日：2017-08-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： KUAN-YU HUANG ,  TZU-KAI LAN ,  SHOU-CHIH YIN ,  SHU-CHIA HSU ,  PAI-YUAN LI ,  SUNG-HUI HUANG ,  HSIANG-FAN LEE ,  YING-SHIN HAN

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L25/18

CPC classification number: H01L24/17 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L25/03 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0603 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11013 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/16111 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor device includes a substrate, a package, first conductors and second conductors. The substrate includes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors are disposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.

公开(公告)号：US20190244925A1

公开(公告)日：2019-08-08

申请号：US16385399

申请日：2019-04-16

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： KUAN-YU HUANG ,  TZU-KAI LAN ,  SHOU-CHIH YIN ,  SHU-CHIA HSU ,  PAI-YUAN LI ,  SUNG-HUI HUANG ,  HSIANG-FAN LEE ,  YING-SHIN HAN

IPC: H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L25/18

CPC classification number: H01L24/17 ,  H01L21/4853 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L25/03 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/0603 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11013 ,  H01L2224/11502 ,  H01L2224/11849 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/14136 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/16111 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3841 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor device includes an electronic component, a package, a substrate and a plurality of first conductors and second conductors. The package is over the electronic component. T substrate is between the electronic component and the package. The substrate includes a first portion covered by the package, and a second portion protruding out of an edge of the package and uncovered by the package. The first conductors and second conductors are between and electrically connected to the electronic component and the substrate. A width of a second conductor of the plurality of second conductors is larger than a width of a first conductor of the plurality of first conductors, the first conductors are disposed between the second portion of the substrate and the electronic component, and the second conductors are disposed between the first portion of the substrate and the electronic component.

公开(公告)号：US20230178498A1

公开(公告)日：2023-06-08

申请号：US18162720

申请日：2023-02-01

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： KUAN-YU HUANG ,  SUNG-HUI HUANG ,  PAI-YUAN LI ,  SHU-CHIA HSU ,  HSIANG-FAN LEE ,  SZU-PO HUANG

IPC: H01L23/00 ,  H01L23/04

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L2224/73253 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/3511

Abstract: A semiconductor device includes a substrate, an electronic component, a stiffener ring and an adhesive ring. The substrate has a first surface and a second surface opposite to the first surface. The electronic component is over the first surface of the substrate. The stiffener ring is over the first surface of the substrate. The stiffener ring includes a plurality of side parts and a plurality of corner parts coupled to the side parts. Heights of the corner parts are less than heights of the side parts. The adhesive ring is interposed between the first surface of the substrate and the stiffener ring. The adhesive ring includes a plurality of side portions and a plurality of corner portions coupled to the side portions. Thicknesses of the side portions are less than thicknesses of the corner portions.

公开(公告)号：US20200251427A1

公开(公告)日：2020-08-06

申请号：US16854666

申请日：2020-04-21

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： KUAN-YU HUANG ,  SUNG-HUI HUANG ,  PAI-YUAN LI ,  SHU-CHIA HSU ,  HSIANG-FAN LEE ,  SZU-PO HUANG

IPC: H01L23/00 ,  H01L23/04

Abstract: A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.

公开(公告)号：US20250062250A1

公开(公告)日：2025-02-20

申请号：US18938319

申请日：2024-11-06

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： KUAN-YU HUANG ,  SUNG-HUI HUANG ,  PAI-YUAN LI ,  SHU-CHIA HSU ,  HSIANG-FAN LEE ,  SZU-PO HUANG

IPC: H01L23/00 ,  H01L23/04

Abstract: A semiconductor device includes a substrate, a stiffener ring over the substrate, and an adhesive ring between the substrate and the stiffener ring. The adhesive ring includes a first part, a second part and a third part disposed between the first part and the second part. The first part and the second part have a first thickness, and the third part has a second thickness greater than the first thickness. The third part of the adhesive ring is covered by the stiffener ring.

公开(公告)号：US20180261554A1

公开(公告)日：2018-09-13

申请号：US15713114

申请日：2017-09-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor： KUAN-YU HUANG ,  SUNG-HUI HUANG ,  PAI-YUAN LI ,  SHU-CHIA HSU ,  HSIANG-FAN LEE ,  SZU-PO HUANG

IPC: H01L23/00 ,  H01L23/04

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311

Abstract: A semiconductor device includes a substrate, an electronic component, a ring structure and an adhesive layer. The substrate has a first surface. The electronic component is over the first surface of the substrate. The ring structure is over the first surface of the substrate, wherein the ring structure includes a first part having a first height, and a second part recessed from the bottom surface and having a second height lower than the first height. The adhesive layer is interposed between the first part of the ring structure and the substrate, and between the second part of the ring structure and the substrate.