公开(公告)号：US20180166351A1

公开(公告)日：2018-06-14

申请号：US15616908

申请日：2017-06-07

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ying-Shin HAN ,  Yen-Miao LIN ,  Chung-Chih CHEN ,  Hsien-Liang MENG

IPC: H01L23/10 ,  H01L21/48 ,  H01L23/053 ,  H01L23/00

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/145 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The cap portion and the foot portion define a recess, and the integrated circuit die is accommodated in the recess. The adhesive includes a sidewall portion and a bottom portion. The sidewall portion contacts a sidewall of the foot portion. The bottom portion extends from the sidewall portion to between a bottom surface of the foot portion and the substrate.

公开(公告)号：US20190252277A1

公开(公告)日：2019-08-15

申请号：US16391190

申请日：2019-04-22

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ying-Shin HAN ,  Yen-Miao LIN ,  Chung-Chih CHEN ,  Hsien-Liang MENG

IPC: H01L23/10 ,  H01L21/48 ,  H01L23/053

CPC classification number: H01L23/10 ,  H01L21/4817 ,  H01L23/053 ,  H01L23/145 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/16251 ,  H01L2924/163 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/35121 ,  H01L2924/00

Abstract: A method of forming a semiconductor package includes dispensing an adhesive on a substrate that has an integrated circuit die attached thereon, placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the adhesive, and pressing the lid against the substrate such that a portion of the adhesive is squeezed from a space between the bottom surface of the lid and the substrate onto a sidewall of the lid.