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公开(公告)号：US20240344226A1
公开(公告)日：2024-10-17
申请号：US18411467
申请日：2024-01-12
发明人： Hong XU
IPC分类号： C25D7/00 , A61M11/00 , B05B17/00 , B41J2/16 , C25D1/00 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/54 , C25D5/00 , C25D5/02 , C25D5/10 , C25D5/34 , C25D5/48 , C25D5/54
CPC分类号： C25D7/00 , A61M11/005 , B05B17/0646 , B41J2/162 , B41J2/1625 , B41J2/1629 , B41J2/1631 , C25D1/003 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/54 , C25D5/022 , C25D5/10 , C25D5/34 , C25D5/48 , C25D5/54 , C25D5/611
摘要： In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.
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公开(公告)号：US20160130715A1
公开(公告)日：2016-05-12
申请号：US15001551
申请日：2016-01-20
发明人： Hong XU
IPC分类号： C25D7/00 , C25D5/48 , C25D5/34 , C25D3/54 , C25D3/48 , C25D3/46 , C25D3/38 , C25D5/02 , C25D5/54
摘要： A method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described.
摘要翻译： 用于制造孔板的方法包括在衬底上沉积可释放种子层，在可释放种子层上方施加第一图案化光刻掩模，将第一图案化光刻掩模具有到所需孔径图案的负图案，将第一材料电镀在第 所述可释放种子层的暴露部分并由所述第一掩模限定，在所述第一材料上方施加第二光刻掩模，所述第二光刻掩模具有负图案到第一空腔，在所述第一材料的暴露部分上方电镀第二材料，以及 由第二掩模限定，去除两个掩模，以及蚀刻可释放种子层以释放第一材料和第二材料。 第一和第二材料形成用于雾化液体的孔板。 描述了其他孔板和制造孔板的方法。
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公开(公告)号：US20230080331A1
公开(公告)日：2023-03-16
申请号：US17808432
申请日：2022-06-23
发明人： Hong XU
IPC分类号： C25D7/00 , B41J2/16 , C25D5/02 , C25D5/10 , C25D1/00 , C25D5/00 , A61M11/00 , C25D5/54 , B05B17/00 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/54 , C25D5/34 , C25D5/48
摘要： In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.
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公开(公告)号：US20230032517A1
公开(公告)日：2023-02-02
申请号：US17818484
申请日：2022-08-09
发明人： Brendan HOGAN , Hong XU
摘要： An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.
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公开(公告)号：US20200347507A1
公开(公告)日：2020-11-05
申请号：US16852692
申请日：2020-04-20
发明人： Hong XU
IPC分类号： C25D7/00 , B41J2/16 , C25D5/02 , C25D5/10 , C25D1/00 , B05B17/00 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/54 , C25D5/34 , C25D5/48 , C25D5/54
摘要： In one embodiment, a method for manufacturing an aperture plate includes depositing a releasable seed layer above a substrate, applying a first patterned photolithography mask above the releasable seed layer, the first patterned photolithography mask having a negative pattern to a desired aperture pattern, electroplating a first material above the exposed portions of the releasable seed layer and defined by the first mask, applying a second photolithography mask above the first material, the second photolithography mask having a negative pattern to a first cavity, electroplating a second material above the exposed portions of the first material and defined by the second mask, removing both masks, and etching the releasable seed layer to release the first material and the second material. The first and second material form an aperture plate for use in aerosolizing a liquid. Other aperture plates and methods of producing aperture plates are described according to other embodiments.
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公开(公告)号：US20150336115A1
公开(公告)日：2015-11-26
申请号：US14719036
申请日：2015-05-21
发明人： Brendan HOGAN , Hong XU
CPC分类号： B05B1/02 , A61M11/005 , A61M15/0085 , A61M2207/00 , B05B17/0638 , B05B17/0653 , C25D1/08 , C25D7/04
摘要： An aperture plate is manufactured by plating metal around a mask of resist columns having a desired size, pitch, and profile, which yields a wafer about 60 μm thickness. This is approximately the full desired target aperture plate thickness. The plating is continued so that the metal overlies the top surfaces of the columns until the desired apertures are achieved. This needs only one masking/plating cycle to achieve the desired plate thickness. Also, the plate has passageways formed beneath the apertures, formed as an integral part of the method, by mask material removal. These are suitable for entrainment of aerosolized droplets exiting the apertures.
摘要翻译： 通过在具有期望的尺寸，间距和轮廓的抗蚀剂柱的掩模上镀覆金属来制造孔板，其产生约60μm厚度的晶片。 这大约是完全期望的目标孔板厚度。 继续进行电镀，使得金属覆盖在柱的顶表面上，直到达到所需的孔。 这只需要一个掩模/电镀周期来实现所需的板厚度。 此外，板具有形成在孔下方的通道，其形成为该方法的整体部分，通过掩模材料去除。 这些适合于夹带离开孔的雾化液滴。
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