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公开(公告)号：US20030085132A1
公开(公告)日：2003-05-08
申请号：US09970271
申请日：2001-10-02
Applicant: Shipley Company, L.L.C.
Inventor： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC: C25C007/00 , C25B009/00 , C25D017/00 , C25D003/00 , C25D003/54 , C25D003/46 , C25D003/50 , C25D003/48
Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The Metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
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公开(公告)号：US20040104124A1
公开(公告)日：2004-06-03
申请号：US10720647
申请日：2003-11-24
Applicant: Shipley Company, L.L.C.
Inventor： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC: C25D003/38 , C09D005/00
Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as ductility, micro-throwing power and micro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
Abstract translation: 金属电镀浴和金属镀层的方法，其中金属电镀浴含有预防或抑制金属电镀浴添加剂消耗的杂原子有机化合物。 金属电镀浴添加剂提高镀金的亮度以及电镀液的延展性，微投能力和微投能力。 添加消耗抑制杂原子有机化合物的添加改善了电镀金属的物理性能以及电镀工艺的效率。 杂原子有机化合物可以含有硫，氧或氮杂原子。
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公开(公告)号：US20030070934A1
公开(公告)日：2003-04-17
申请号：US09970348
申请日：2001-10-02
Applicant: Shipley Company, L.L.C.
Inventor： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC: B05B001/00 , C23C016/00 , C09D005/00 , B22F007/00
Abstract: A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
Abstract translation: 金属电镀浴和金属镀金属的方法，其中金属电镀浴含有防止或抑制金属电镀浴添加剂消耗的杂原子化合物。 金属电镀浴添加剂可以提高电镀金属的亮度，以及镀浴的延展性，微投能力和抛光力。 添加消耗抑制杂原子有机化合物的添加改善了电镀金属的物理性能以及电镀工艺的效率。 杂原子有机化合物可以含有硫，氧或氮杂原子。
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公开(公告)号：US20040074778A1
公开(公告)日：2004-04-22
申请号：US10684148
申请日：2003-10-10
Applicant: Shipley Company, L.L.C.
Inventor： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC: C25D003/00
Abstract: A metal plating bath and metal plating process that contains aldehyde compounds that prevent or reduce the consumption of metal plating bath additives. The metal plating baths provide for an efficient plating method because the plating process need not be interrupted to replenish the plating bath with additives. The metal plating baths may be employed to plate metals such as copper, gold, silver, palladium, platinum, cobalt, chromium, cadmium, bismuth, indium, rhodium, iridium, and ruthenium.
Abstract translation: 金属镀液和金属电镀工艺，含有醛类化合物，可防止或减少金属电镀浴添加剂的消耗。 金属电镀浴提供有效的电镀方法，因为不需要中断电镀工艺以补充镀液。 金属电镀液可用于镀铜，金，银，钯，铂，钴，铬，镉，铋，铟，铑，铱和钌等金属。
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Patent Agency Ranking
公开(公告)号：US20030102226A1
公开(公告)日：2003-06-05
申请号：US09970224
申请日：2001-10-02
Applicant: Shipley Company, L.L.C.
Inventor： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
IPC: B05B001/00 , C09D005/00 , C09D005/10 , B22F007/00 , C23C016/00
Abstract: A metal plating bath containing alcohol compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The alcohol compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the alcohol compounds that inhibit or retard additive consumption can be employed to plate copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
Abstract translation: 含有抑制或延缓电镀浴添加剂消耗的醇化合物的金属电镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的酒精化合物会增加镀液的使用寿命，并提高电镀工艺的效率。 可以使用含有抑制或延迟添加剂消耗的醇化合物的电镀浴来镀铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。
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公开(公告)号：US20030066756A1
公开(公告)日：2003-04-10
申请号：US09971300
申请日：2001-10-04
Applicant: Shipley Company, L.L.C.
Inventor： David R. Gabe , Andrew J. Cobley , Leon R. Barstad , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Thomas Buckley
IPC: C25D003/56 , C25D003/60 , C25D003/58 , C25D003/62 , C25D003/00 , C25D003/46 , C25D003/50 , C25D003/48 , C25D003/12 , C25D003/26 , C25D003/10 , C25D003/38
Abstract: A metal plating bath and method for plating a metal on a substrate. The metal plating bath contains hydroxylamines that inhibit the consumption of additive bath components to improve the efficiency of metal plating processes. The additive bath components are added to metal plating baths to improve brightness of plated metal as well as the micro-throwing and macro-throwing power of the bath. In addition to brighteners, the additive bath components may include levelers, suppressors, hardeners, and the like. The hydroxylamines that inhibit additive consumption may be employed in metal plating baths for plating copper, gold, silver, platinum, palladium, cobalt, cadmium, nickel, bismuth, indium, tin, rhodium, iridium, ruthenium and alloys thereof.
Abstract translation: 一种金属电镀浴和在基板上镀金属的方法。 金属镀浴含有抑制添加剂浴组分消耗的羟胺，以提高金属电镀工艺的效率。 将添加剂浴组分添加到金属电镀浴中以改善电镀金属的亮度以及镀液的微投掷和投掷抛光力。 除了增白剂之外，添加剂浴组分可以包括矫平剂，抑制剂，硬化剂等。 抑制添加剂消耗的羟胺可以用于镀铜，金，银，铂，钯，钴，镉，镍，铋，铟，锡，铑，铱，钌及其合金的金属电镀浴中。
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公开(公告)号：US20040206631A1
公开(公告)日：2004-10-21
申请号：US09970171
申请日：2001-10-02
Applicant: Shipley Company, L.L.C.
Inventor： Andrew J. Cobley , Mark J. Kapeckas , Erik Reddington , Wade Sonnenberg , Leon R. Barstad , Thomas Buckley
IPC: C25D003/38
Abstract: A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
Abstract translation: 含有抑制或延缓电镀浴添加剂消耗的有机化合物的金属镀液。 添加剂是改善电镀金属的亮度，电镀金属的物理性质，特别是相对于延展性和微投能力以及电镀液的宏投射功率的化学化合物。 抑制或延缓添加剂消耗的有机化合物可增加电镀液的使用寿命，提高电镀工艺的效率。 含有抑制或延迟添加剂消耗的有机化合物的电镀液可以用于铜，金，银，钯，铂，钴，镉，铬，铋，铟，铑，钌和铱。
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公开(公告)号：US20020074244A1
公开(公告)日：2002-06-20
申请号：US10002039
申请日：2001-11-02
Applicant: Shipley Company, L.L.C.
Inventor： Wade Sonnenberg , Mark J. Kapeckas , David L. Jacques , Raymond Cruz , Leon R. Barstad , Elie H. Najjar , Eugene N. Step , Robert A. Binstead
IPC: G01N027/48
Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.
Abstract translation: 公开了用于在存在其它有机添加剂如加速剂，增白剂和抑制剂的情况下确定电镀浴中的矫光机的量的方法。 这样的方法是快速的，在广泛的组分范围内工作，并且可以实时地执行。
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公开(公告)号：US20020000382A1
公开(公告)日：2002-01-03
申请号：US09738551
申请日：2000-12-15
Applicant: Shipley Company, L.L.C. of Marlborough
Inventor： Denis Morrissey , David Merricks , Leon R. Barstad , Eugene N. Step , Jeffrey M. Calvert , Robert A. Schetty III , James G. Shelnut , Mark Lefebvre , Martin W. Bayes , Donald E. Storjohann
IPC: C25D005/00 , C25D003/38 , C25D005/48 , C25D005/34 , B32B015/04 , H01L021/44
CPC classification number: C25D3/38 , C25D5/34 , C25D7/123 , H01L21/76861 , H01L21/76868 , H01L21/76873
Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.
Abstract translation: 公开了在随后的金属化之前修复金属种子层的方法。 这种修复方法提供了设置在基底上的金属种子层，其基本上不含金属氧化物并且基本上没有不连续性。
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