公开(公告)号：US20020074244A1

公开(公告)日：2002-06-20

申请号：US10002039

申请日：2001-11-02

Applicant: Shipley Company, L.L.C.

Inventor： Wade Sonnenberg ,  Mark J. Kapeckas ,  David L. Jacques ,  Raymond Cruz ,  Leon R. Barstad ,  Elie H. Najjar ,  Eugene N. Step ,  Robert A. Binstead

IPC: G01N027/48

CPC classification number: G01N27/42 ,  C25D21/12

Abstract: Disclosed are methods for determining the quantity of leveler in an electroplating bath in the presence of other organic additives, such as accelerators, brighteners and suppressors. Such methods are fast, work over a broad concentration range of components and can be performed in real-time.

Abstract translation: 公开了用于在存在其它有机添加剂如加速剂，增白剂和抑制剂的情况下确定电镀浴中的矫光机的量的方法。 这样的方法是快速的，在广泛的组分范围内工作，并且可以实时地执行。

公开(公告)号：US20020000382A1

公开(公告)日：2002-01-03

申请号：US09738551

申请日：2000-12-15

Applicant: Shipley Company, L.L.C. of Marlborough

Inventor： Denis Morrissey ,  David Merricks ,  Leon R. Barstad ,  Eugene N. Step ,  Jeffrey M. Calvert ,  Robert A. Schetty III ,  James G. Shelnut ,  Mark Lefebvre ,  Martin W. Bayes ,  Donald E. Storjohann

IPC: C25D005/00 ,  C25D003/38 ,  C25D005/48 ,  C25D005/34 ,  B32B015/04 ,  H01L021/44

CPC classification number: C25D3/38 ,  C25D5/34 ,  C25D7/123 ,  H01L21/76861 ,  H01L21/76868 ,  H01L21/76873

Abstract: Disclosed are methods of repairing metal seed layers prior to subsequent metallization. Such repair methods provide metal seed layers disposed on a substrate that are substantially free of metal oxide and substantially free of discontinuities.

Abstract translation: 公开了在随后的金属化之前修复金属种子层的方法。 这种修复方法提供了设置在基底上的金属种子层，其基本上不含金属氧化物并且基本上没有不连续性。