公开(公告)号：US20220411848A1

公开(公告)日：2022-12-29

申请号：US17648336

申请日：2022-01-19

Applicant: Shi-Lung LIN ,  Sam LIN ,  Chun-Hung LIN

Inventor： Shi-Lung LIN ,  Sam LIN ,  Chun-Hung LIN

IPC: C12Q1/686 ,  C12N9/12

Abstract: This invention generally relates to a novel RNA/mRNA production and amplification method using viral RNA replicase and/or RNA-dependent RNA polymerase (RdRp) enzymes as well as the associated mRNAs thereof. The present invention can be used for manufacturing and amplifying all varieties of RNA/mRNA sequences carrying at least an RdRp-binding site in the 5′- or 3′-end, or both. The RNA/mRNA so obtained is useful for not only producing mRNA vaccines and/or RNA-based medicines but also for generating the mRNA-associated proteins, peptides, and/or antibodies under an in-vitro as well as in-cell translation condition. Principally, the present invention is a novel RNA replicase-mediated RNA/mRNA amplification method, namely Replicase Cycling Reaction (RCR). The RNA replicases involved in RCR include but not limited to viral and/or bacteriophage RNA-dependent RNA polymerases (RdRp), particularly coronaviral and hepatitis C viral (HCV) RdRp enzymes.

公开(公告)号：US20220396778A1

公开(公告)日：2022-12-15

申请号：US17648340

申请日：2022-01-19

Applicant: Shi-Lung LIN ,  Sam LIN ,  Chun-Hung LIN

Inventor： Shi-Lung LIN ,  Sam LIN ,  Chun-Hung LIN

IPC: C12N5/074 ,  C12N15/113 ,  C12N9/12 ,  A61K31/713 ,  A61K38/45

Abstract: This invention generally relates to a novel RNA composition and its production method useful for generating and expanding induced pluripotent stem cells (iPS cells; iPSC) as well as adult stem cells (ASC). The RNA composition so defined can be used for producing not only non-transgenic but also tumor-free iPS cells. The defined RNA composition contans at least two types of different RNA constructs; one is “miR-302 precursor RNA (pre-miR-302)” and the other is “RNA-dependent RNA polymerase (RdRp)” mRNA. Both of pre-miR-302 and RdRp mRNA contain highly structured RNA comformations, such as hairpin and stem-loop structures. To produce highly structured RNAs, a novel PCR-IVT methodology has been developed and used with a specially designed RNA polymerase-helicase mixture activity.

公开(公告)号：US20130221522A1

公开(公告)日：2013-08-29

申请号：US13406031

申请日：2012-02-27

Applicant: Yu-Feng CHEN ,  Chun-Hung LIN ,  Han-Ping PU ,  Ming-Da CHENG ,  Kai-Chiang WU

Inventor： Yu-Feng CHEN ,  Chun-Hung LIN ,  Han-Ping PU ,  Ming-Da CHENG ,  Kai-Chiang WU

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L25/0657 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03334 ,  H01L2224/0384 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05075 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05571 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13078 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/207 ,  H01L2924/206 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The described embodiments of mechanisms of forming connectors for package on package enable smaller connectors with finer pitch, which allow smaller package size and additional connections. The conductive elements on one package are partially embedded in the molding compound of the package to bond with contacts or metal pads on another package. By embedding the conductive elements, the conductive elements may be made smaller and there are is gaps between the conductive elements and the molding compound. A pitch of the connectors can be determined by adding a space margin to a maximum width of the connectors. Various types of contacts on the other package can be bonded to the conductive elements.

Abstract translation: 所描述的形成用于封装封装的连接器的机构的实施例使得具有更细间距的较小连接器能够实现更小的封装尺寸和附加的连接。 一个封装上的导电元件部分地嵌入封装的模制化合物中，以与另一封装上的触点或金属焊盘结合。 通过嵌入导电元件，可以使导电元件更小，并且在导电元件和模塑料之间存在间隙。 可以通过将连接器的最大宽度添加空间余量来确定连接器的间距。 另一个封装上的各种类型的触点可以结合到导电元件上。

公开(公告)号：US20130037241A1

公开(公告)日：2013-02-14

申请号：US13206359

申请日：2011-08-09

Applicant: Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

Inventor： Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

IPC: F28D15/04

CPC classification number: F28D15/046 ,  F28D15/0233

Abstract: The heat pipe of the invention includes an evaporation section and two condensation sections. The evaporation section is located at a part of the heat pipe. The two condensation sections are separately located at two opposite sides of the evaporation section. The evaporation section and the two condensation sections communicate with each other, and a peripheral size of the evaporation section is larger than that of each of the condensation sections.

Abstract translation: 本发明的热管包括蒸发部和两个冷凝部。 蒸发段位于热管的一部分。 两个冷凝部分分别位于蒸发部分的相对两侧。 蒸发部和两个冷凝部彼此连通，蒸发部的周边尺寸大于各冷凝部的周长。

公开(公告)号：US20130000872A1

公开(公告)日：2013-01-03

申请号：US13198230

申请日：2011-08-04

Applicant: Chun-Hung LIN

Inventor： Chun-Hung LIN

IPC: F28D15/04 ,  B21D53/02

CPC classification number: B21D53/08 ,  B21D53/022 ,  F28D15/0275 ,  F28D2021/0029 ,  F28F1/32 ,  F28F2240/00 ,  Y10T29/4935

Abstract: The invention relates to the technical field of heat sinks, in particular to a fin heat sink with an improved structure and a processing method thereof. The fin heat sink with the improved structure comprises a pedestal and a plurality of cooling fins, wherein roots of the cooling fins are connected with the pedestal and provided with clamping grooves the bottoms of which are opened; clamping pieces corresponding to the clamping grooves are extended out of the pedestal; the cooling fins are clamped and connected with the clamping pieces through the clamping grooves; and the plurality of the cooling fins are subjected to layered arrangement to form a cooling fin group. The clamping grooves at the roots of the cooling fins are easy to mold through a die; the clamping pieces extended out of the pedestal are simple and convenient to process; the clamping grooves are connected with the clamping pieces by means of clamping, so the connection between the clamping grooves and the clamping pieces is reliable; and the clamping process can be completed through a stamping die. Therefore, compared with the prior art, the fin heat sink with the improved structure and the processing method thereof, which are provided by the invention, overcome the technical prejudice and can greatly reduce the processes, reduce the production cost and improve the production efficiency.

Abstract translation: 本发明涉及散热片的技术领域，特别涉及具有改进结构的散热片散热片及其加工方法。 具有改进结构的翅片散热器包括基座和多个散热片，其中散热片的根部与基座连接并设置有底部开口的夹紧槽; 对应于夹紧槽的夹紧件延伸出基座; 冷却翅片夹紧并通过夹紧槽与夹紧件连接; 并且多个散热片经受分层布置以形成散热片组。 散热片根部的夹紧槽容易通过模具成型; 从基座伸出的夹紧件简单方便; 夹紧槽通过夹紧与夹紧件连接，因此夹紧槽和夹紧件之间的连接是可靠的; 并且夹紧过程可以通过冲压模具完成。 因此，与现有技术相比，本发明提供的具有改进的结构及其加工方法的散热片散热器克服了技术偏见，可以大大降低工艺，降低生产成本，提高生产效率。

公开(公告)号：US20130025830A1

公开(公告)日：2013-01-31

申请号：US13191612

申请日：2011-07-27

Applicant: Chun-Hung LIN ,  Yen-Hsiang CHIU ,  Tung-Yang SHIEH ,  Chun-Yi LEE

Inventor： Chun-Hung LIN ,  Yen-Hsiang CHIU ,  Tung-Yang SHIEH ,  Chun-Yi LEE

IPC: F28D15/04

CPC classification number: F28D15/0275 ,  F28D2021/0029 ,  F28F1/32 ,  F28F2275/04 ,  F28F2275/122

Abstract: A heat sink assembly includes a fin module, heat pipes, and a pair of side plates. The fin module is composed of a plurality of fins and has a flat side formed with a trough and two recesses. Each of the heat pipes has an evaporation section. The evaporation sections are parallelly accommodated in the trough and in contact with each other. The side plates are separately fixed in the recesses and protrude from the flat side. The evaporation sections are formed with a flat surface coplanar with the side plates. By this arrangement, the thermal contact area between the heat pipes and a heat source is increased to thereby improve the heat-dissipating efficiency of the heat sink assembly.

Abstract translation: 散热器组件包括翅片模块，热管和一对侧板。 翅片模块由多个翅片组成，并且具有形成有凹槽和两个凹部的平坦侧。 每个热管具有蒸发部。 蒸发部分平行地容纳在槽中并彼此接触。 侧板分别固定在凹部中并从平坦侧突出。 蒸发部分形成有与侧板共面的平坦表面。 通过这种布置，热管和热源之间的热接触面积增加，从而提高散热器组件的散热效率。

公开(公告)号：US20120045192A1

公开(公告)日：2012-02-23

申请号：US13288133

申请日：2011-11-03

Applicant: Jui-Cheng PENG ,  Tzung-Chi FU ,  Chin-Hsiang LIN ,  Chien-Hsun LIN ,  Chun-Hung LIN ,  Yao-Wen GUO ,  Shy-Jay LIN ,  Heng-Hsin LIU

Inventor： Jui-Cheng PENG ,  Tzung-Chi FU ,  Chin-Hsiang LIN ,  Chien-Hsun LIN ,  Chun-Hung LIN ,  Yao-Wen GUO ,  Shy-Jay LIN ,  Heng-Hsin LIU

IPC: G03B29/00

CPC classification number: G03F7/70875 ,  G03F7/70341 ,  G03F7/70783

Abstract: System and method for improving immersion scanner overlay performance are described. One embodiment is a method of improving overlay performance of an photolithography immersion scanner comprising a wafer table having lens cooling water (“LCW”) disposed in a water channel therein, the wafer table having an input for receiving the LCW into the water channel and an output for expelling the LCW from the water channel. The method comprises providing a water tank at at least one of the wafer table input and the wafer table output; monitoring a pressure of water in the water tank; and maintaining the pressure of the water in the water tank at a predetermined level.

Abstract translation: 描述了用于提高浸没式扫描仪覆盖性能的系统和方法。 一个实施例是一种提高光刻浸没式扫描仪的覆盖性能的方法，其包括设置在其中的水通道中的透镜冷却水（“LCW”）的晶片台，晶片台具有用于将LCW接收到水通道中的输入端， 输出用于从水道排出LCW。 该方法包括在晶片台输入和晶片台输出中的至少一个上提供水箱; 监测水箱内的水压; 并且将水箱中的水的压力保持在预定水平。

公开(公告)号：US20090004620A1

公开(公告)日：2009-01-01

申请号：US11892853

申请日：2007-08-28

Applicant: Chi-Hung LIU ,  Chun-Hung LIN ,  Chun-Hsien SU ,  Wen-Tung HSU

Inventor： Chi-Hung LIU ,  Chun-Hung LIN ,  Chun-Hsien SU ,  Wen-Tung HSU

IPC: A61C17/00

CPC classification number: A61B18/042 ,  A61C5/00 ,  A61C19/066

Abstract: A surface treating method for treating a tooth surface and a surface treating device thereof are provided. First, a working gas is filled into a tube. Next, a voltage is provided to the working gas for exciting the working gas into plasma. After that, the plasma is discharged through an opening of the tube for contacting the tooth surface.

Abstract translation: 提供了一种用于处理牙齿表面的表面处理方法及其表面处理装置。 首先，将工作气体填充到管中。 接下来，向工作气体提供用于将工作气体激发成等离子体的电压。 之后，等离子体通过用于与齿面接触的管的开口排出。

公开(公告)号：US20130048249A1

公开(公告)日：2013-02-28

申请号：US13218580

申请日：2011-08-26

Applicant: Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

Inventor： Chun-Hung LIN ,  Han-Lin Chen ,  Chang-Yin Chen

IPC: F28D15/00 ,  B21D53/02 ,  F28D15/04

CPC classification number: F28D15/0233 ,  F28D15/046 ,  H01L21/4871 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A heat pipe includes a step pipe and a sintered powder structure. The inner wall of the step pipe has a plurality of grooves. The step pipe has an evaporating section and two condensing sections. The condensing sections are on the two ends of the step pipe, respectively. The evaporating section lies between the two condensing sections. The inner spaces of the two condensing sections and the evaporating section are interconnected. The peripheral dimension of the evaporating section is larger than the peripheral dimension of each of the condensing sections. The sintered powder structure is bounded inside each of the condensing sections, improving the heat pipe's inner air flow rate and heat conduction efficiency.

Abstract translation: 热管包括台阶管和烧结粉末结构。 台阶管的内壁具有多个槽。 步进管具有蒸发段和两个冷凝段。 冷凝段分别位于台阶管的两端。 蒸发部分位于两个冷凝部分之间。 两个冷凝部分和蒸发部分的内部空间相互连接。 蒸发部分的周边尺寸大于每个冷凝部分的周边尺寸。 烧结粉末结构限制在每个冷凝段内，提高热管的内部空气流速和导热效率。

公开(公告)号：US20140078647A1

公开(公告)日：2014-03-20

申请号：US13620591

申请日：2012-09-14

Applicant: Chi-Hao CHIU ,  Kun-Huang CHANG ,  Chun-Hung LIN

Inventor： Chi-Hao CHIU ,  Kun-Huang CHANG ,  Chun-Hung LIN

IPC: H01G4/228 ,  B32B37/14

CPC classification number: H01G9/0032 ,  B32B2457/16 ,  H01G9/012 ,  H01G9/08 ,  H01G9/15 ,  H01G9/26 ,  Y10T156/1002

Abstract: A stacked-type solid electrolytic capacitor package structure includes a capacitor unit, a package unit and a conductive unit. The conductive unit includes a plurality of stacked-type capacitors stacked on top of one another and electrically connected with each other, and each stacked-type capacitor has a positive portion and a negative portion. The package unit includes a package body for enclosing the capacitor unit. The conductive unit includes a first conductive terminal and a second conductive terminal. The first conductive terminal has a first embedded portion electrically connected to the positive portion and enclosed by the package body and a first lateral exposed portion connected to the first embedded portion. The second conductive terminal has a second lateral exposed portion, a second front exposed portion, a second rear exposed portion, and a second embedded portion electrically connected to the negative portion and enclosed by the package body.

Abstract translation: 叠层型固体电解电容器封装结构包括电容器单元，封装单元和导电单元。 导电单元包括堆叠在彼此顶部并彼此电连接的多个层叠型电容器，并且每个堆叠型电容器具有正部分和负极部分。 封装单元包括用于封闭电容器单元的封装体。 导电单元包括第一导电端子和第二导电端子。 第一导电端子具有电连接到正部分并由封装主体封闭的第一嵌入部分和连接到第一嵌入部分的第一横向暴露部分。 第二导电端子具有第二横向暴露部分，第二前部暴露部分，第二后部暴露部分和与该负极部分电连接并被封装主体封闭的第二嵌入部分。