VERTICAL TRANSISTORS HAVING P-TYPE GALLIUM NITRIDE CURRENT BARRIER LAYERS AND METHODS OF FABRICATING THE SAME
    1.
    发明申请
    VERTICAL TRANSISTORS HAVING P-TYPE GALLIUM NITRIDE CURRENT BARRIER LAYERS AND METHODS OF FABRICATING THE SAME 审中-公开
    具有P型氮化镓电流阻挡层的垂直晶体管及其制造方法

    公开(公告)号:US20150014699A1

    公开(公告)日:2015-01-15

    申请号:US14327204

    申请日:2014-07-09

    摘要: A vertical transistor includes a drain electrode disposed on a first region of a substrate, a drift layer disposed on a second region of the substrate spaced apart from the first region, and P-type gallium nitride current barrier layers disposed on the drift layer and comprising a current aperture disposed between current barrier layers. A channel layer is disposed on the drift layer and the current barrier layers. A semiconductor layer is disposed on the channel layer and configured to induce formation of a two-dimension electron gas layer adjacent to a top surface thereof. Metal contact plugs are disposed in the channel layer and contact the current barrier layers. A source electrode is disposed on the contact plugs and the channel layer. A gate insulation layer and a gate electrode are sequentially disposed on a top surface of the semiconductor layer opposite to the channel layer.

    摘要翻译: 垂直晶体管包括设置在衬底的第一区域上的漏极电极,设置在与第一区域间隔开的衬底的第二区域上的漂移层以及设置在漂移层上的P型氮化镓电流势垒层, 设置在电流阻挡层之间的电流孔。 沟道层设置在漂移层和电流阻挡层上。 半导体层设置在沟道层上并且被配置为引起邻近其顶表面的二维电子气层的形成。 金属接触插塞设置在通道层中并接触电流阻挡层。 源电极设置在接触插塞和沟道层上。 栅极绝缘层和栅电极依次设置在与沟道层相对的半导体层的顶表面上。

    NITRIDE-BASED TRANSISTORS AND METHODS OF FABRICATING THE SAME
    6.
    发明申请
    NITRIDE-BASED TRANSISTORS AND METHODS OF FABRICATING THE SAME 审中-公开
    基于氮化物的晶体管及其制造方法

    公开(公告)号:US20150060943A1

    公开(公告)日:2015-03-05

    申请号:US14470164

    申请日:2014-08-27

    摘要: A method of fabricating a nitride-based transistor includes sequentially forming a first nitride-based semiconductor layer doped with first type dopant, a second nitride-based semiconductor layer doped with at least one of a second type dopant, and a third nitride-based semiconductor layer doped with at least one of the first type dopants. A first trench is formed to penetrate the third and second nitride-based semiconductor layers and to extend into the first nitride-based semiconductor layer. A fourth nitride-based semiconductor layer doped with the first type dopants is formed to fill the first trench. A second trench is formed in the fourth nitride-based semiconductor layer. A gate electrode is formed in the second trench. A source electrode is formed to be electrically connected to at least one of the third and fourth nitride-based semiconductor layers, and a drain electrode is formed to be electrically connected to the first nitride-based semiconductor layer.

    摘要翻译: 一种制造氮化物基晶体管的方法包括:顺序地形成掺杂有第一类型掺杂剂的第一氮化物基半导体层,掺杂有第二类型掺杂剂中的至少一种的第二氮化物基半导体层和第三氮化物基半导体 层中掺杂有至少一种第一类型掺杂剂。 形成第一沟槽以穿透第三和第二氮化物基半导体层并延伸到第一氮化物基半导体层中。 掺杂有第一类型掺杂剂的第四氮化物基半导体层被形成以填充第一沟槽。 在第四氮化物基半导体层中形成第二沟槽。 在第二沟槽中形成栅电极。 源电极形成为与第三氮化物类半导体层和第四氮化物系半导体层中的至少一方电连接,并且形成漏电极以与第一氮化物基半导体层电连接。