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1.发明公开公开(公告)号：US20240072203A1
公开(公告)日：2024-02-29
申请号：US18387129
申请日：2023-11-06
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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2.发明授权公开(公告)号：US11862755B2
公开(公告)日：2024-01-02
申请号：US17868949
申请日：2022-07-20
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US11862754B2
公开(公告)日：2024-01-02
申请号：US17740729
申请日：2022-05-10
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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4.发明申请公开(公告)号：US20220359785A1
公开(公告)日：2022-11-10
申请号：US17868949
申请日：2022-07-20
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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5.发明授权公开(公告)号：US11417799B2
公开(公告)日：2022-08-16
申请号：US16987478
申请日：2020-08-07
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US11294282B2
公开(公告)日：2022-04-05
申请号：US16114474
申请日：2018-08-28
发明人： Kumiko Hayashi , Hitoshi Maruyama , Kazunori Kondo , Hideto Kato
IPC分类号： G03F7/075 , C08L61/28 , G03F7/039 , C08L63/00 , C08L83/04 , C08G77/52 , C08G59/30 , G03F7/038 , C09D183/14 , C08K5/00 , H01L21/47
摘要： A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.
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公开(公告)号：US10428239B2
公开(公告)日：2019-10-01
申请号：US15477521
申请日：2017-04-03
发明人： Kazunori Kondo , Yoichiro Ichioka
IPC分类号： C09D183/06 , C08G77/14 , C08G59/42 , C08K3/36 , C08K7/18 , C08L63/00 , H01L21/56 , H01L23/29 , H01L23/31 , C08G77/52 , C09D183/14 , C08G77/42 , C08L83/14
摘要： The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.
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公开(公告)号：US20190049844A1
公开(公告)日：2019-02-14
申请号：US16056711
申请日：2018-08-07
发明人： Hitoshi Maruyama , Kazunori Kondo
IPC分类号： G03F7/075 , C08G77/52 , G03F7/004 , G03F7/16 , G03F7/40 , G03F7/20 , G03F7/38 , G03F7/32 , G03F7/11 , H01L23/00
摘要： A photosensitive resin composition comprising a silicone structure-containing polymer having crosslinking groups or crosslinking reaction-susceptible reactive sites in the molecule is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, heat resistance, and reliability as protective film.
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公开(公告)号：US11518876B2
公开(公告)日：2022-12-06
申请号：US16666757
申请日：2019-10-29
发明人： Yoichiro Ichioka , Kazunori Kondo
摘要： A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.
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10.发明授权公开(公告)号：US11156919B2
公开(公告)日：2021-10-26
申请号：US16232377
申请日：2018-12-26
发明人： Hitoshi Maruyama , Kazunori Kondo
IPC分类号： G03F7/075 , G03F7/30 , C08G77/12 , C08G77/20 , H01L21/027 , C08L63/00 , C08G59/30 , G03F7/038 , G03F7/32 , G03F7/16 , G03F7/20
摘要： A photosensitive resin composition comprising a dual end alicyclic epoxy-modified silicone resin having formula (A1) and a photoacid generator is provided. In formula (A1), R1 to R4 are a C1-C20 monovalent hydrocarbon group and n is an integer of 1-600. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance.
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