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公开(公告)号:US20200209751A1
公开(公告)日:2020-07-02
申请号:US16728153
申请日:2019-12-27
发明人: Kumiko Hayashi , Michihiro Sugo
IPC分类号: G03F7/075
摘要: A photosensitive resin composition comprising (A) a silicone skeleton-containing polymer, (B) a photoacid generator, and (C) a peroxide is coated to form a photosensitive resin coating which is unsusceptible to plastic deformation while maintaining flexibility. A pattern forming process using the composition is also provided.
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2.
公开(公告)号:US20240160105A1
公开(公告)日:2024-05-16
申请号:US18271908
申请日:2022-01-05
发明人: Hitoshi Maruyama , Kumiko Hayashi
CPC分类号: G03F7/0757 , C08G77/04 , G03F7/0045 , G03F7/168 , G03F7/2004
摘要: Provided is a photosensitive resin composition comprising: (A) a silicone resin having an epoxy group and/or a phenolic hydroxyl group; (B) a photoacid generator represented by formula (B); and (C) a carboxylic acid quaternary ammonium compound.
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公开(公告)号:US20220236644A1
公开(公告)日:2022-07-28
申请号:US17626544
申请日:2020-07-13
发明人: Kumiko Hayashi , Kyoko Soga
摘要: Provided is a photosensitive resin composition comprising (A) a polymer including a silicone skeleton and (B) photo-acid generators, wherein the photo-acid generators (B) comprise (B1) a photo-acid generator which is an onium salt and (B2) a photo-acid generator which is not an onium salt.
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公开(公告)号:US11294282B2
公开(公告)日:2022-04-05
申请号:US16114474
申请日:2018-08-28
发明人: Kumiko Hayashi , Hitoshi Maruyama , Kazunori Kondo , Hideto Kato
IPC分类号: G03F7/075 , C08L61/28 , G03F7/039 , C08L63/00 , C08L83/04 , C08G77/52 , C08G59/30 , G03F7/038 , C09D183/14 , C08K5/00 , H01L21/47
摘要: A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.
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5.
公开(公告)号:US20240288772A1
公开(公告)日:2024-08-29
申请号:US18568131
申请日:2022-03-31
发明人: Hitoshi Maruyama , Kumiko Hayashi
CPC分类号: G03F7/0757 , G03F7/0045 , G03F7/0751
摘要: Provided is a photosensitive resin composition comprising: (A) a silicone resin having an epoxy group and/or a phenolic hydroxyl group; (B) a photoacid generator represented by formula (B); and (C) a benzotriazole compound.
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公开(公告)号:US20190352466A1
公开(公告)日:2019-11-21
申请号:US16476368
申请日:2018-01-16
发明人: Akira Uta , Kumiko Hayashi , Tomoki Akiba
IPC分类号: C08G77/52
摘要: Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), R1 is a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and R2 is a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH═CH2) or —Si(CH3)2(CH2—CH═CH2).
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公开(公告)号:US12055853B2
公开(公告)日:2024-08-06
申请号:US16728153
申请日:2019-12-27
发明人: Kumiko Hayashi , Michihiro Sugo
CPC分类号: G03F7/0757 , G03F7/162 , G03F7/20 , G03F7/30
摘要: A photosensitive resin composition comprising (A) a silicone skeleton-containing polymer, (B) a photoacid generator, and (C) a peroxide is coated to form a photosensitive resin coating which is unsusceptible to plastic deformation while maintaining flexibility. A pattern forming process using the composition is also provided.
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8.
公开(公告)号:US20240210831A1
公开(公告)日:2024-06-27
申请号:US18285408
申请日:2022-03-04
发明人: Hitoshi Maruyama , Kumiko Hayashi
CPC分类号: G03F7/0757 , G03F7/0045 , G03F7/0048
摘要: Provided is a photosensitive resin composition containing: (A) a silicone resin containing an acid-crosslinkable group; (B) an alicyclic epoxy compound represented by formula (B1) or (B2); med (C) a photo-acid-generating agent.
(In the formula, R11 through R46 are each independently a hydrogen atom or a C1-8 saturated hydrocarbyl group.)-
公开(公告)号:US11142612B2
公开(公告)日:2021-10-12
申请号:US16476368
申请日:2018-01-16
发明人: Akira Uta , Kumiko Hayashi , Tomoki Akiba
摘要: Provided is a thermoplastic elastomer comprising a mesogen-silicon compound (co)polymer which is represented by formula (1) below and has a number average molecular weight of 1,000-500,000. The thermoplastic elastomer has transparency and rubber properties (rubber elasticity) and can be (repeatedly) molded thermally and reversibly, and thus can be suitably used in potting materials or various sealing materials. In formula (1), Ar represents a mesogenic group selected from among structures represented by formula (2) below, a represents an integer of 0.5-1, b represents a number of 0-0.5 (a and b respectively represent the ratio of the number of respective repeating units to the sum of all the repeating units in the molecule, and a+b=1), R1 is a monovalent hydrocarbon group that does not contain a C1-8 aliphatic unsaturated bond, and R2 is a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH═CH2) or —Si(CH3)2(CH2—CH═CH2).
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公开(公告)号:US20190064666A1
公开(公告)日:2019-02-28
申请号:US16114474
申请日:2018-08-28
发明人: Kumiko Hayashi , Hitoshi Maruyama , Kazunori Kondo , Hideto Kato
摘要: A photosensitive resin composition comprising an isocyanurate-modified silicone resin containing an epoxy group in the molecule is easy to form a resin coating which has high transparency, light resistance and heat resistance, is amenable to micro-processing, and is useful in applications for protecting and encapsulating optical devices. The coating can be processed in thick film form to define a pattern having a fine size and perpendicularity, and becomes a cured coating which has improved adhesion to substrates, electronic parts, semiconductor devices, and supports for circuit boards, mechanical properties, electric insulation, and crack resistance, and is reliable as an insulating protective film.
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