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公开(公告)号：US11156919B2
公开(公告)日：2021-10-26
申请号：US16232377
申请日：2018-12-26
发明人： Hitoshi Maruyama , Kazunori Kondo
IPC分类号： G03F7/075 , G03F7/30 , C08G77/12 , C08G77/20 , H01L21/027 , C08L63/00 , C08G59/30 , G03F7/038 , G03F7/32 , G03F7/16 , G03F7/20
摘要： A photosensitive resin composition comprising a dual end alicyclic epoxy-modified silicone resin having formula (A1) and a photoacid generator is provided. In formula (A1), R1 to R4 are a C1-C20 monovalent hydrocarbon group and n is an integer of 1-600. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance.
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公开(公告)号：US10982053B2
公开(公告)日：2021-04-20
申请号：US16414281
申请日：2019-05-16
发明人： Hitoshi Maruyama , Hideto Kato , Michihiro Sugo
摘要： A novel polymer containing silphenylene and polyether structures in the backbone is used to formulate a photosensitive composition having improved reliability.
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公开(公告)号：US20200026189A1
公开(公告)日：2020-01-23
申请号：US16459905
申请日：2019-07-02
发明人： Hitoshi Maruyama , Tamotsu Oowada
摘要： A white photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) a photoacid generator, and (C) a white pigment has a sufficient reflectivity, good reliability with respect to adhesion and crack resistance, resolution, flexibility, and light resistance.
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公开(公告)号：US10538630B2
公开(公告)日：2020-01-21
申请号：US15886198
申请日：2018-02-01
IPC分类号： C08G81/02 , C08G77/442 , C08F226/06 , C08K5/5419 , C08F224/00 , C08G77/04 , C08G77/00
摘要： A silicone-modified polybenzoxazole resin comprising repeating units of formulae (1a) and (1b) is prepared by addition polymerization. R1 to R4 are a C1-C8 monovalent hydrocarbon group, m and n are integers of 0-300, R5 is C1-C8 alkylene or phenylene, a and b are positive numbers of less than 1, a+b=1, and X1 is a divalent linker of formula (2). The resin is flexible, soluble in organic solvents, and easy to use.
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5.发明申请公开(公告)号：US20190354014A1
公开(公告)日：2019-11-21
申请号：US16411472
申请日：2019-05-14
发明人： Hitoshi Maruyama , Hideto Kato , Michihiro Sugo
摘要： A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.
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6.发明公开公开(公告)号：US20240288772A1
公开(公告)日：2024-08-29
申请号：US18568131
申请日：2022-03-31
发明人： Hitoshi Maruyama , Kumiko Hayashi
CPC分类号： G03F7/0757 , G03F7/0045 , G03F7/0751
摘要： Provided is a photosensitive resin composition comprising: (A) a silicone resin having an epoxy group and/or a phenolic hydroxyl group; (B) a photoacid generator represented by formula (B); and (C) a benzotriazole compound.
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公开(公告)号：US11262655B2
公开(公告)日：2022-03-01
申请号：US16411472
申请日：2019-05-14
发明人： Hitoshi Maruyama , Hideto Kato , Michihiro Sugo
IPC分类号： C08G77/60 , G03F7/075 , G03F7/004 , G03F7/038 , G03F7/40 , H01L23/00 , C08G77/00 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/38
摘要： A photosensitive resin composition comprising (A) a silphenylene and polyether structure—containing polymer and (B) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved substrate adhesion, a pattern forming ability, crack resistance, and reliability as protective film.
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公开(公告)号：US11119409B2
公开(公告)日：2021-09-14
申请号：US16674384
申请日：2019-11-05
发明人： Hitoshi Maruyama , Kyoko Soga
IPC分类号： G03F7/075 , C08G77/48 , C08G77/14 , C08K5/00 , C08L83/06 , G03F7/00 , H01L29/12 , C09D183/14 , G03F7/32 , G03F7/038
摘要： A polymer comprising polysiloxane, silphenylene, isocyanuric acid, and norbornene skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency, light resistance, and heat resistance.
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9.发明申请公开(公告)号：US20200026190A1
公开(公告)日：2020-01-23
申请号：US16502283
申请日：2019-07-03
发明人： Hitoshi Maruyama , Tamotsu Oowada
IPC分类号： G03F7/075 , C08L83/04 , G03F7/16 , C08L63/00 , C08L61/06 , C08L61/28 , C08K3/04 , G03F7/004 , C08L83/16
摘要： A black photosensitive resin composition comprising (A) an acid crosslinkable group-containing silicone resin, (B) carbon black, and (C) a photoacid generator is coated onto a substrate to form a photosensitive resin coating which has improved reliability with respect to adhesion and crack resistance, resolution and flexibility while maintaining satisfactory light shielding properties.
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10.发明申请公开(公告)号：US20190196331A1
公开(公告)日：2019-06-27
申请号：US16232377
申请日：2018-12-26
发明人： Hitoshi Maruyama , Kazunori Kondo
IPC分类号： G03F7/075 , C08G77/12 , C08G77/20 , H01L21/027
CPC分类号： G03F7/0757 , C08G59/306 , C08G77/12 , C08G77/20 , C08L63/00 , G03F7/038 , G03F7/0755 , G03F7/16 , G03F7/20 , G03F7/32 , H01L21/0274
摘要： A photosensitive resin composition comprising a dual end alicyclic epoxy-modified silicone resin having formula (A1) and a photoacid generator is provided. In formula (A1), R1 to R4 are a C1-C20 monovalent hydrocarbon group and n is an integer of 1-600. The composition enables pattern formation using radiation of widely varying wavelength, and the patterned film has high transparency, light resistance, and heat resistance.
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