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1.发明申请公开(公告)号：US20220359785A1
公开(公告)日：2022-11-10
申请号：US17868949
申请日：2022-07-20
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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2.发明公开公开(公告)号：US20240072203A1
公开(公告)日：2024-02-29
申请号：US18387129
申请日：2023-11-06
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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3.发明授权公开(公告)号：US11862755B2
公开(公告)日：2024-01-02
申请号：US17868949
申请日：2022-07-20
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US11862754B2
公开(公告)日：2024-01-02
申请号：US17740729
申请日：2022-05-10
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US20220271198A1
公开(公告)日：2022-08-25
申请号：US17740729
申请日：2022-05-10
发明人： Chen-Fu Chu , SHIH-KAI CHAN , YI-FENG SHIH , DAVID TRUNG DOAN , TRUNG TRI DOAN , YOSHINORI OGAWA , KOHEl OTAKE , KAZUNORI KONDO , KEIJI OHORI , TAICHI KITAGAWA , NOBUAKI MATSUMOTO , TOSHIYUKI OZAi , SHUHEI UEDA
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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6.发明授权公开(公告)号：US11417799B2
公开(公告)日：2022-08-16
申请号：US16987478
申请日：2020-08-07
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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7.发明申请公开(公告)号：US20210066541A1
公开(公告)日：2021-03-04
申请号：US16987478
申请日：2020-08-07
发明人： Chen-Fu Chu , Shih-Kai CHAN , Yi-Feng SHIH , David Trung DOAN , Trung Tri DOAN , Yoshinori OGAWA , Kohei OTAKE , Kazunori KONDO , Keiji OHORI , Taichi KITAGAWA , Nobuaki MATSUMOTO , Toshiyuki OZAI , Shuhei UEDA
IPC分类号： H01L33/00
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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8.发明公开公开(公告)号：US20240063339A1
公开(公告)日：2024-02-22
申请号：US18384020
申请日：2023-10-26
发明人： Chen-Fu Chu , SHIH-KAI CHAN , YI-FENG SHIH , DAVID TRUNG DOAN , TRUNG TRI DOAN , YOSHINORI OGAWA , KOHEI OTAKE , KAZUNORI KONDO , KEIJI OHORI , TAICHI KITAGAWA , NOBUAKI MATSUMOTO , TOSHIYUKI oZAI , SHUHEI UEDA
CPC分类号： H01L33/20 , H01L33/0095 , H01L33/44 , H01L33/0093 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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