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公开(公告)号：US20210351166A1
公开(公告)日：2021-11-11
申请号：US17241324
申请日：2021-04-27
IPC分类号： H01L25/075 , H01L33/00 , H01L21/68
摘要： A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
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公开(公告)号：US11545474B2
公开(公告)日：2023-01-03
申请号：US17241324
申请日：2021-04-27
IPC分类号： H01L25/075 , H01L33/00 , H01L21/68
摘要： A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
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3.发明申请公开(公告)号：US20220359785A1
公开(公告)日：2022-11-10
申请号：US17868949
申请日：2022-07-20
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US12002792B2
公开(公告)日：2024-06-04
申请号：US17989770
申请日：2022-11-18
IPC分类号： H01L25/075 , H01L21/68 , H01L33/00
CPC分类号： H01L25/0753 , H01L21/68 , H01L33/0093
摘要： A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
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5.发明公开公开(公告)号：US20240072203A1
公开(公告)日：2024-02-29
申请号：US18387129
申请日：2023-11-06
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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6.发明授权公开(公告)号：US11862755B2
公开(公告)日：2024-01-02
申请号：US17868949
申请日：2022-07-20
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US11862754B2
公开(公告)日：2024-01-02
申请号：US17740729
申请日：2022-05-10
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
CPC分类号： H01L33/20 , H01L33/0093 , H01L33/0095 , H01L33/44 , H01L2933/0025
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US20230134997A1
公开(公告)日：2023-05-04
申请号：US17989770
申请日：2022-11-18
IPC分类号： H01L25/075 , H01L21/68 , H01L33/00
摘要： A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
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9.发明授权公开(公告)号：US11417799B2
公开(公告)日：2022-08-16
申请号：US16987478
申请日：2020-08-07
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
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公开(公告)号：US20130146939A1
公开(公告)日：2013-06-13
申请号：US13762880
申请日：2013-02-08
发明人： Naoki YAMAKAWA , Kei Miyoshi , Toshiyuki Ozai , Yoshinori Ogawa
IPC分类号： H01L33/56
CPC分类号： H01L33/56 , C09J183/14
摘要： A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.
摘要翻译： 一种用于半导体元件的硅粘合剂，其适合作为用于将发光二极管芯片固定到基板的芯片接合材料。 粘合剂包括（a）在25℃下的粘度为100Pa·s以下的加成反应固化型有机硅树脂组合物，在150℃加热3小时时产生固化物， JIS K6253规定的D硬度为30以上，（b）平均粒径小于1μm的白色颜料粉末，（c）平均粒径为1μm以上的白色或无色透明粉末 但少于10个妈妈。 粘合剂显示出高水平的隐蔽性，有效地反映了从LED芯片发出的光，并且还显示出有利的芯片定位性能，优异的粘合强度和优异的耐久性。
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