公开(公告)号：US11161932B2

公开(公告)日：2021-11-02

申请号：US16733046

申请日：2020-01-02

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Yoichiro Ichioka ,  Tamotsu Oowada

IPC: C08G59/30 ,  C08G59/24 ,  C08G59/62 ,  H01L21/56

Abstract: A resin composition including the following (A) to (D): (A) a resin containing epoxy groups in the range of 140 to 5000 g/eq as an epoxy equivalent; (B) a phenolic curing agent; (C) a curing accelerator; and (D) at least one compound selected among what is expressed by the following formulae (0-1) to (0-5). This provides a resin composition having small warpage and excellent adhesive force, a high adhesion resin composition film made into a film form from the composition, a semiconductor laminate having a cured product of the film and its production method, a semiconductor device obtained by dicing the semiconductor laminate into individual chips and its production method.

公开(公告)号：US10428239B2

公开(公告)日：2019-10-01

申请号：US15477521

申请日：2017-04-03

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Kazunori Kondo ,  Yoichiro Ichioka

IPC: C09D183/06 ,  C08G77/14 ,  C08G59/42 ,  C08K3/36 ,  C08K7/18 ,  C08L63/00 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  C08G77/52 ,  C09D183/14 ,  C08G77/42 ,  C08L83/14

Abstract: The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.

公开(公告)号：US11294283B2

公开(公告)日：2022-04-05

申请号：US16299702

申请日：2019-03-12

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Yoichiro Ichioka

IPC: G03F7/07 ,  G03F7/075 ,  G03F7/004 ,  G03F7/038 ,  G03F7/105 ,  C08G73/10 ,  G03F7/11 ,  G03F7/115

Abstract: A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 μm, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.

公开(公告)号：US20190294045A1

公开(公告)日：2019-09-26

申请号：US16299702

申请日：2019-03-12

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Yoichiro Ichioka

IPC: G03F7/075 ,  G03F7/038 ,  G03F7/004

Abstract: A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 μm, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.

公开(公告)号：US10308787B2

公开(公告)日：2019-06-04

申请号：US15466270

申请日：2017-03-22

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Kazunori Kondo ,  Yoichiro Ichioka ,  Michihiro Sugo

IPC: C08G77/14 ,  C08K3/36 ,  C08J5/18 ,  C09J183/04 ,  H01L21/683 ,  H01L21/78 ,  C08G59/32 ,  C08G59/42 ,  C08G59/50 ,  C08G59/62 ,  C09D183/10 ,  C09D183/14 ,  C08L83/10 ,  C08L83/14 ,  H01L23/29 ,  C08G77/52 ,  C08G77/455

Abstract: The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000, (B) an epoxy resin-curing agent; and (C) a filler. This can provide a resin composition and a resin film that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection performance, good adhesion properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably. The present invention also provides a method for producing the resin film, a semiconductor device molded with the resin film, and a method for producing the semiconductor device.

公开(公告)号：US11518876B2

公开(公告)日：2022-12-06

申请号：US16666757

申请日：2019-10-29

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Yoichiro Ichioka ,  Kazunori Kondo

IPC: C08L65/02 ,  C08G59/14 ,  C08J7/18 ,  C08K5/00 ,  C08L63/00 ,  C08L83/04

Abstract: A photosensitive resin composition is provided comprising (A) 100 pbw of a phenolic hydroxyl group-containing resin, and (B) 0.1-18 pbw of an epoxy additive in the form of a compound containing 1-8 epoxy groups per molecule, containing nitrogen, sulfur or phosphorus, and having a molecular weight of 50-6,000. The composition has an improved bonding force to metal wirings.

公开(公告)号：US10730273B2

公开(公告)日：2020-08-04

申请号：US16114569

申请日：2018-08-28

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Yoichiro Ichioka ,  Naoyuki Kushihara ,  Kazunori Kondo ,  Kazuaki Sumita

IPC: B32B27/26 ,  C08K3/36 ,  C08L83/06 ,  H01L21/02 ,  C08K5/13 ,  B32B27/38 ,  C08L63/10 ,  C08G77/52 ,  C08L63/00 ,  C08G59/22 ,  C08G59/30 ,  C09D183/16 ,  C08G77/60 ,  C08G59/32 ,  C08G77/44 ,  C08L83/00 ,  C08G77/50 ,  C08K5/15 ,  H01L33/56

Abstract: The present invention is a resin composition including: (A) an epoxy resin; (B) an epoxy compound shown by the following formula (1) and/or formula (2); (C) an epoxy compound shown by the following formula (3); (D) a phenolic curing agent; and (E) a curing accelerator, wherein “A” represents a single bond or a divalent organic group selected from the following formulae. This provides a resin composition with improved strength, reduced warpage, and excellent adhesion, a resin film with improved strength formed from the composition, a semiconductor laminate containing the cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device into which the semiconductor laminate is diced and a method for manufacturing the same.

公开(公告)号：US10035912B2

公开(公告)日：2018-07-31

申请号：US15342479

申请日：2016-11-03

Applicant: Shin-Etsu Chemical Co., Ltd.

Inventor： Kazunori Kondo ,  Yoichiro Ichioka

IPC: C08L83/06 ,  C08L61/14 ,  C08G77/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  C08G77/52 ,  C08G59/24 ,  C08K3/36 ,  C09D163/00 ,  C09D183/14 ,  C08G77/14 ,  C08L63/00 ,  C08L83/14 ,  H01L23/29

CPC classification number: C08L83/06 ,  C08G59/24 ,  C08G77/14 ,  C08G77/485 ,  C08G77/52 ,  C08K3/36 ,  C08L63/00 ,  C08L83/14 ,  C08L2201/02 ,  C08L2203/16 ,  C08L2203/206 ,  C08L2205/03 ,  C09D163/00 ,  C09D183/14 ,  H01L21/56 ,  H01L21/78 ,  H01L23/296 ,  H01L23/562 ,  C08L61/14

Abstract: A flame retardant resin composition comprising (A) a silicone resin, (B) a triazine-modified phenol novolak compound, and (C) a filler can be formed in film form. The resin film possesses satisfactory covering or encapsulating performance to large size/thin wafers.

公开(公告)号：US10026650B2

公开(公告)日：2018-07-17

申请号：US15136551

申请日：2016-04-22

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Kazunori Kondo ,  Yoichiro Ichioka ,  Hideto Kato

IPC: C08L83/04 ,  H01L21/78 ,  C08K3/36 ,  C08L83/06 ,  C08K5/13 ,  H01L23/29 ,  C08G59/02 ,  C08G59/32 ,  C08G59/50 ,  C08G59/62 ,  C08K3/013 ,  C08L63/00 ,  C08L83/14

CPC classification number: H01L21/78 ,  C08G59/02 ,  C08G59/3281 ,  C08G59/5073 ,  C08G59/621 ,  C08G77/14 ,  C08G77/26 ,  C08G77/28 ,  C08K3/013 ,  C08K3/36 ,  C08K5/13 ,  C08L63/00 ,  C08L83/04 ,  C08L83/14 ,  C08L2201/08 ,  C08L2203/206 ,  C09D183/06 ,  C09D183/08 ,  H01L23/296 ,  C08L83/10

Abstract: A film-forming resin composition for use in encapsulating large-diameter thin-film wafers includes (A) a silicone resin having a weight-average molecular weight of 3,000 to 500,000 and containing repeating units of formula (1) wherein R1 to R4 are monovalent hydrocarbon groups, but R3 and R4 are not both methyl, m and n are integers of 0 to 300, R5 to R8 are divalent hydrocarbon groups, a and b are positive numbers such that a+b=1, and X is a specific divalent organic moiety; (B) a phenolic compound of formula (7) wherein Y is a carbon atom or a tetravalent hydrocarbon group of 2 to 20 carbon atoms, and R13 to R16 are monovalent hydrocarbon groups or hydrogen atoms; and (C) a filler.

公开(公告)号：US09890254B2

公开(公告)日：2018-02-13

申请号：US15113556

申请日：2015-01-07

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： Kazunori Kondo ,  Yoichiro Ichioka

IPC: C08L63/00 ,  C08G77/48 ,  C08G77/52 ,  C08G59/32 ,  C08K3/36 ,  H01L23/29 ,  C09D163/00 ,  C08L83/14 ,  C09D183/14 ,  H01L21/56 ,  H01L21/78 ,  C08G59/30

CPC classification number: C08G77/48 ,  C08G59/306 ,  C08G59/32 ,  C08G77/52 ,  C08J5/18 ,  C08J2383/14 ,  C08K3/013 ,  C08K3/36 ,  C08K5/0025 ,  C08K5/09 ,  C08K5/13 ,  C08K5/17 ,  C08L63/00 ,  C08L83/14 ,  C09D163/00 ,  C09D183/14 ,  H01L21/561 ,  H01L21/563 ,  H01L21/78 ,  H01L23/295 ,  H01L23/296 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1), component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging.