知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

6 条记录 (耗时 0.015 秒)

    Copolymerized Polyamide Resin, Method for Preparing the Same and Molded Article Comprising the Same
    1.
    发明申请
    Copolymerized Polyamide Resin, Method for Preparing the Same and Molded Article Comprising the Same 有权
    共聚聚酰胺树脂，其制备方法及其成型品

    公开(公告)号：US20160090448A1

    公开(公告)日：2016-03-31

    申请号：US14583429

    申请日：2014-12-26

    申请人： Samsung SDI Co., Ltd.

    发明人： So Young KWON ,  Jin Kyu KIM ,  Young Sub JIN ,  Joon Sung KIM ,  Ki Yon LEE ,  Suk Min JUN

    IPC分类号： C08G69/26 ,  C08G69/30

    CPC分类号： C08G69/265 ,  C08G69/30

    摘要： A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R1 is independently a C1 to C5 alkyl group and a is an integer from 0 to 4, and a diamine component comprising m-xylene diamine and a diamine represented by Formula 2, wherein A is a single bond or a C1 to C10 hydrocarbon group, R2 and R3 are each independently a C1 to C5 alkyl group, and b and c are each independently an integer from 0 to 4, wherein the copolymerized polyamide resin has a difference between a melting temperature (Tm) and a crystallization temperature (Tc) of about 50° C. or more. The copolymerized polyamide resin may have excellent heat resistance and reduced or no gel generation and yellowing phenomenon in a molding process.

    摘要翻译： 共聚聚酰胺树脂包括单体混合物的聚合物，其包含包含己二酸和由式1表示的二羧酸的二羧酸组分的单体混合物，其中每个R 1独立地为C 1至C 5烷基，a为0至4的整数，并且 包含间二甲苯二胺和由式2表示的二胺的二胺组分，其中A是单键或C1至C10烃基，R2和R3各自独立地为C1至C5烷基，b和c各自独立地为 0〜4的整数，其中共聚聚酰胺树脂的熔融温度（Tm）和结晶温度（Tc）之差在约50℃以上。 共聚聚酰胺树脂可以在成型工艺中具有优异的耐热性和减少的或没有凝胶产生和泛黄现象。

    Polyamide Resin, Method for Preparing the Same, and Molded Article Including the Same
    2.
    发明申请
    Polyamide Resin, Method for Preparing the Same, and Molded Article Including the Same 审中-公开
    聚酰胺树脂，其制备方法以及包含其的成型品

    公开(公告)号：US20160096924A1

    公开(公告)日：2016-04-07

    申请号：US14598506

    申请日：2015-01-16

    申请人： SAMSUNG SDI CO., LTD.

    发明人： Jin Kyu KIM ,  So Young KWON ,  Young Sub JIN ,  Joon Sung KIM ,  Su Yeong SON ,  Ki Yon LEE ,  Sang Kyun IM ,  Suk Min JUN

    IPC分类号： C08G69/30

    CPC分类号： C08G69/30 ,  C08G69/26

    摘要： A polyamide resin is a polymer of an adipic acid-containing dicarboxylic acid component and an m-xylenediamine-containing diamine component, wherein the polymer includes about 100 ppm or less of phosphorus and about 100 ppm or less of sodium (Na), and has a gel content of about 0.5% or less as measured on a specimen prepared by melting about 10 g of the polymer at about 260° C., maintaining the molten polymer for about 30 minutes, and then cooling the molten polymer to room temperature. The polyamide resin can exhibit excellent heat resistance and can reduce or prevent gel generation upon polymerization or molding.

    摘要翻译： 聚酰胺树脂是含己二酸的二羧酸成分和含有间二甲苯胺的二胺成分的聚合物，其中聚合物包含约100ppm以下的磷和约100ppm以下的钠（Na），并且具有 在通过在约260℃熔化约10g聚合物制备的样品上测量的凝胶含量为约0.5％或更低，保持熔融聚合物约30分钟，然后将熔融聚合物冷却至室温。 聚酰胺树脂可以表现出优异的耐热性，并且可以减少或防止聚合或模塑时的凝胶生成。

    Continuous Solid-State Polymerization Device and Method
    4.
    发明申请
    Continuous Solid-State Polymerization Device and Method 有权
    连续固态聚合装置及方法

    公开(公告)号：US20160136611A1

    公开(公告)日：2016-05-19

    申请号：US14902076

    申请日：2013-11-21

    申请人： SAMSUNG SDI CO., LTD.

    发明人： Sang Kyun IM ,  Ki Yon LEE ,  Shin Hyo BAE ,  Young Jun KIM ,  Kyoung Kyun PARK ,  Young Sub JIN ,  Sang Hyun JEON

    IPC分类号： B01J19/28 ,  C08G64/20 ,  C08G63/78 ,  C08G63/80 ,  B01J19/00 ,  C08G69/06

    CPC分类号： B01J19/28 ,  B01J19/0073 ,  B01J2219/00094 ,  B01J2219/00159 ,  B01J2219/00162 ,  B01J2219/0204 ,  B01J2219/0245 ,  C08G63/785 ,  C08G63/80 ,  C08G64/205 ,  C08G69/06 ,  C08G69/30 ,  Y02P20/149

    摘要： A continuous solid-state polymerization device according to the present invention comprises: a feeder for injecting a prepolymer continuously; a transverse reactor connected to the feeder via a first connector to receive the prepolymer from the feeder and to perform solid-state polymerization, the reactor itself rotating; and a chamber connected to the transverse reactor via a second connector to receive a polymer, which has been discharged from the transverse reactor, and solid-state polymerization of which has been completed, and to discharge the polymer, wherein the transverse reactor has a demolding coating film formed on the inner wall thereof, and the feeder, the transverse reactor and the chamber are in a vacuum state. The continuous solid-state polymerization device can prevent formation of an interval, in which the prepolymer stagnates, and can perform solid-state polymerization continuously in a vacuum state without using inert gas.

    摘要翻译： 根据本发明的连续固态聚合装置包括：用于连续注入预聚物的进料器; 通过第一连接器连接到进料器的横向反应器以从进料器接收预聚物并进行固态聚合，反应器本身旋转; 以及通过第二连接器连接到横向反应器的室，以接收已经从横向反应器排出的聚合物，并且固体聚合已经完成，并且排出聚合物，其中横向反应器具有脱模 在其内壁上形成的涂膜，并且进料器，横向反应器和室处于真空状态。 连续固态聚合装置可以防止间歇形成，其中预聚物停滞，并且可以在真空状态下连续进行固态聚合而不使用惰性气体。

    Polyamide Ester Resin, Method for Preparing the Same, and Molded Article Including the Same
    5.
    发明申请
    Polyamide Ester Resin, Method for Preparing the Same, and Molded Article Including the Same 有权
    聚酰胺酯树脂，其制备方法和包含其的成型品

    公开(公告)号：US20160083509A1

    公开(公告)日：2016-03-24

    申请号：US14685927

    申请日：2015-04-14

    申请人： Samsung SDI Co., Ltd.

    发明人： Sang Kyun IM ,  Shin Hyo BAE ,  Su Yeong SON ,  Ki Yon LEE ,  So Young KWON ,  Joon Sung KIM ,  Jin Kyu KIM ,  Tae Joon PARK ,  Young Sub JIN

    IPC分类号： C08G63/60

    CPC分类号： C08G69/44

    摘要： A polyamide ester resin includes: a repeat unit derived from a dicarboxylic acid; a repeat unit derived from a diamine; and a repeat unit represented by the following Formula 1, wherein the polyamide ester resin has a melting temperature (Tm) of about 280° C. or more. The polyamide ester resin can exhibit excellent properties in terms of moisture absorption resistance, heat resistance, discoloration resistance, fluidity and the like by using a cyclic ester. wherein R1 is a C3 to C12 linear, branched or cyclic alkylene group.

    摘要翻译： 聚酰胺酯树脂包括：衍生自二羧酸的重复单元; 衍生自二胺的重复单元; 和由下式1表示的重复单元，其中聚酰胺酯树脂的熔融温度（Tm）为约280℃以上。 通过使用环状酯，聚酰胺酯树脂在耐吸湿性，耐热性，耐变色性，流动性等方面表现出优异的性能。 其中R1是C3-C12直链，支链或环状的亚烷基。

    Copolymerized Polyamide Resin, Method for Preparing the Same and Article Comprising the Same
    6.
    发明申请
    Copolymerized Polyamide Resin, Method for Preparing the Same and Article Comprising the Same 审中-公开
    共聚聚酰胺树脂，其制备方法及其制品

    公开(公告)号：US20160032051A1

    公开(公告)日：2016-02-04

    申请号：US14566813

    申请日：2014-12-11

    申请人： Samsung SDI Co., Ltd.

    发明人： So Young KWON ,  Joon Sung KIM ,  Eun Ju LEE ,  Ki Yon LEE ,  Sung Chul CHOI

    IPC分类号： C08G69/26 ,  C08G69/30

    CPC分类号： C08G69/265 ,  C08G69/30 ,  C08L77/06

    摘要： A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component and a diamine component including about 4 mol % to about 20 mol % of an alicyclic diamine represented by the Formula 1, wherein the polyamide resin has a melting temperature (Tm) from about 280 to about 330° C. and a crystallization temperature (Tc) from about 250 to about 300° C.: wherein, R1 and R2 are the same or different and are each independently a C1 to C5 alkyl group or a C6 to C10 aryl group, X is a C1 to C10 hydrocarbon group, and m and n are the same or different and are each independently an integer from 0 to 4. The copolymerized polyamide resin can exhibit excellent properties, such as crystallinity, heat resistance, processability and discoloration resistance, and an excellent balance therebetween.

    摘要翻译： 共聚聚酰胺树脂包括包含二羧酸组分和包含约4mol％至约20mol％由式1表示的脂环族二胺的二胺组分的单体混合物的聚合物，其中聚酰胺树脂具有熔融温度（Tm ），约280至约330℃的结晶温度（Tc）为约250至约300℃。其中，R 1和R 2相同或不同，并且各自独立地为C 1至C 5烷基或C 6 至C10芳基，X为C1〜C10烃基，m和n相同或不同，各自独立地为0〜4的整数。共聚聚酰胺树脂的结晶性，耐热性， 加工性和耐变色性，以及它们之间的良好平衡。