公开(公告)号：US20160032051A1

公开(公告)日：2016-02-04

申请号：US14566813

申请日：2014-12-11

申请人： Samsung SDI Co., Ltd.

发明人： So Young KWON ,  Joon Sung KIM ,  Eun Ju LEE ,  Ki Yon LEE ,  Sung Chul CHOI

IPC分类号： C08G69/26 ,  C08G69/30

CPC分类号： C08G69/265 ,  C08G69/30 ,  C08L77/06

摘要： A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component and a diamine component including about 4 mol % to about 20 mol % of an alicyclic diamine represented by the Formula 1, wherein the polyamide resin has a melting temperature (Tm) from about 280 to about 330° C. and a crystallization temperature (Tc) from about 250 to about 300° C.: wherein, R1 and R2 are the same or different and are each independently a C1 to C5 alkyl group or a C6 to C10 aryl group, X is a C1 to C10 hydrocarbon group, and m and n are the same or different and are each independently an integer from 0 to 4. The copolymerized polyamide resin can exhibit excellent properties, such as crystallinity, heat resistance, processability and discoloration resistance, and an excellent balance therebetween.

摘要翻译： 共聚聚酰胺树脂包括包含二羧酸组分和包含约4mol％至约20mol％由式1表示的脂环族二胺的二胺组分的单体混合物的聚合物，其中聚酰胺树脂具有熔融温度（Tm ），约280至约330℃的结晶温度（Tc）为约250至约300℃。其中，R 1和R 2相同或不同，并且各自独立地为C 1至C 5烷基或C 6 至C10芳基，X为C1〜C10烃基，m和n相同或不同，各自独立地为0〜4的整数。共聚聚酰胺树脂的结晶性，耐热性， 加工性和耐变色性，以及它们之间的良好平衡。