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    INTEGRATED CIRCUIT DEVICE
    2.
    发明公开
    INTEGRATED CIRCUIT DEVICE 审中-公开

    公开(公告)号：US20240096796A1

    公开(公告)日：2024-03-21

    申请号：US18219244

    申请日：2023-07-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yongjin KIM ,  Sanghoon AHN

    IPC: H01L23/528 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

    CPC classification number: H01L23/5283 ,  H01L21/76816 ,  H01L21/76831 ,  H01L21/76832 ,  H01L21/76846 ,  H01L23/5226 ,  H01L23/53238 ,  H01L23/53266 ,  H01L23/53295 ,  H01L21/31105

    Abstract: An integrated circuit device includes a plurality of wiring structures on a substrate and extending in a first direction parallel to an upper surface of the substrate and each including a wiring layer on the substrate and extending in a direction perpendicular to the upper surface of the substrate; an insulating pattern surrounding a sidewall of the wiring layer and including a first insulating material; and a capping layer on an upper surface of the wiring layer and including a conductive material; a via layer on the wiring structures, the via layer being electrically connected to one wiring structure; and an interlayer insulating layer covering a sidewall of the insulating pattern between each wiring structure of the plurality of wiring structures, the interlayer insulating layer having an upper surface higher than an upper surface of each wiring layer and an upper surface of each insulating pattern.

    SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MODULE INCLUDING THE SAME
    3.
    发明申请
    SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MODULE INCLUDING THE SAME 有权

    公开(公告)号：US20210111094A1

    公开(公告)日：2021-04-15

    申请号：US17019522

    申请日：2020-09-14

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Youngja KIM ,  Yongjin KIM

    IPC: H01L23/367 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10

    Abstract: A semiconductor package includes a circuit substrate including a ground pad. At least one semiconductor chip is disposed on the circuit substrate and is electrically connected to the circuit substrate. An encapsulation layer encapsulates the at least one semiconductor chip. A heat spreader surrounds the encapsulation layer. The heat spreader includes a side heat spreader disposed on a first surface of the circuit substrate and lateral side surfaces of the encapsulation layer. The side heat spreader is connected to the ground pad. A surface heat spreader is disposed on an upper surface of the encapsulation layer.

    APPLICATION EXECUTION METHOD AND APPARATUS
    5.
    发明申请
    APPLICATION EXECUTION METHOD AND APPARATUS 审中-公开
    申请执行方法和装置

    公开(公告)号：US20140164632A1

    公开(公告)日：2014-06-12

    申请号：US14097673

    申请日：2013-12-05

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Yongjin KIM ,  Kyungah CHANG

    IPC: H04L29/06

    CPC classification number: H04L65/403 ,  G06F3/03545 ,  G06F3/0488 ,  G06F9/485 ,  H04L67/1095 ,  H04L67/2819 ,  H04L67/34

    Abstract: A method and an apparatus for executing an application are provided. The application execution method of the present disclosure includes connecting a first external device, receiving, from the first external device, connection information for use in connecting to a second external device, connecting to the second external device using the connection information, and transmitting, when a transfer command is received, application execution state information to the second external device. The application execution method of the present disclosure is capable of allowing the user to execute the application conveniently.

    Abstract translation: 提供了一种用于执行应用程序的方法和装置。 本公开的应用执行方法包括连接第一外部设备，从第一外部设备接收用于连接到第二外部设备的连接信息，使用连接信息连接到第二外部设备，以及何时发送 接收到传送命令，将应用执行状态信息发送到第二外部设备。 本公开的应用执行方法能够允许用户方便地执行应用。

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