公开(公告)号：US09659852B2

公开(公告)日：2017-05-23

申请号：US14957053

申请日：2015-12-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tongsuk Kim ,  HyunJong Moon ,  Tai-Hyun Eum ,  Heeseok Lee ,  Keung Beum Kim ,  Yonghoon Kim ,  Yoonha Jung ,  Seung-Yong Cha

IPC: H01L23/52 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49894 ,  H01L24/00 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package may include a package substrate with a top surface and a bottom surface opposite to the top surface, the top surface of the package substrate configured to have a semiconductor chip mounted thereon, a power block and a ground block in the package substrate, the power block configured as a power pathway penetrating the package substrate, and the ground block configured as a ground pathway penetrating the package substrate, first vias extended from the power block and the ground block, and the first vias electrically connected to the semiconductor chip, second vias extended from the power block and the ground block toward the bottom surface of the package substrate, and block vias to penetrate the power block and the ground block, the block vias electrically connected to the semiconductor chip and electrically separated from the power block and the ground block.

公开(公告)号：US08940584B2

公开(公告)日：2015-01-27

申请号：US14272681

申请日：2014-05-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Tongsuk Kim ,  Jangwoo Lee ,  Heeseok Lee ,  Kyoungsei Choi

IPC: H01L21/44 ,  H01L23/06 ,  H01L23/10 ,  H01L23/31 ,  H01L23/552 ,  H01L23/498 ,  H01L21/56 ,  H01L23/34 ,  H01L25/065 ,  H01L23/36 ,  H01L23/42

CPC classification number: H01L23/06 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49816 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06568 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16251 ,  H01L2924/00

Abstract: A semiconductor package including a package substrate having a chip mounting region and a peripheral region and including a ground layer formed in the peripheral region, first solder balls on the package substrate in the chip mounting region, second solder balls on the ground layer, at least one semiconductor chip stacked on the package substrate in the chip mounting region, and a package cap covering the semiconductor chip and contacting the package substrate in the peripheral region may be provided. The package cap is electrically connected to the second solder balls. Methods of fabricating the semiconductor package are also provided.

Abstract translation: 一种半导体封装，包括具有芯片安装区域和周边区域的封装基板，并且包括形成在周边区域中的接地层，在芯片安装区域中的封装基板上的第一焊球，接地层上的第二焊球，至少 可以提供在芯片安装区域中堆叠在封装基板上的一个半导体芯片，以及覆盖半导体芯片并且在周边区域中与封装基板接触的封装帽。 封装帽电连接到第二焊球。 还提供了制造半导体封装的方法。

公开(公告)号：US20230361054A1

公开(公告)日：2023-11-09

申请号：US18115545

申请日：2023-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yongjin SEOL ,  Jungeun Koo ,  Tongsuk Kim ,  Youngjun Yoon ,  Mijeong Jeong ,  Younghun Jung

IPC: H01L23/58 ,  H01L23/31 ,  H01L23/498 ,  H01L25/16 ,  H01Q9/04

CPC classification number: H01L23/585 ,  H01L23/3128 ,  H01L23/49822 ,  H01L25/16 ,  H01Q9/0407

Abstract: Provided is a semiconductor package including a redistribution structure including first surface and a second surface opposite to each other, the redistribution structure including a redistribution layer, a semiconductor chip on the first surface of the redistribution structure, the semiconductor chip being electrically connected to the redistribution layer, an encapsulant on the semiconductor chip, at least one antenna pattern on the encapsulant, a side wiring line extending along a surface of the encapsulant from one end of the antenna pattern to the redistribution layer, and electronic devices on the second surface of the redistribution structure, the electronic devices being electrically connected to the redistribution layer, wherein the semiconductor chip and the antenna pattern are configured to transmit and receive a signal to and from each other through the electronic devices.