公开(公告)号：US20240224530A1

公开(公告)日：2024-07-04

申请号：US18215533

申请日：2023-06-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungdam HYUN ,  Kyunghun KIM ,  Sunho KIM ,  Hyungyung KIM ,  Kwangmin PARK ,  Seungyeul YANG ,  Gukhyon YON ,  Minhyun LEE ,  Seokhoon CHOI ,  Hoseok HEO

IPC: H10B43/35 ,  G11C16/04 ,  H01L29/423 ,  H10B43/10 ,  H10B43/27

CPC classification number: H10B43/35 ,  G11C16/0483 ,  H01L29/4234 ,  H10B43/10 ,  H10B43/27

Abstract: A vertical NAND flash memory device includes a plurality of cell arrays, where each cell array of the plurality of cell arrays includes a channel layer, a charge trap layer provided on the channel layer, the charge trap layer including a matrix comprising a dielectric and a charge trap material in the matrix and including anti-ferroelectric nanocrystals or ferroelectric nanocrystals, and a plurality of gate electrodes provided on the charge trap layer.

公开(公告)号：US20240221834A1

公开(公告)日：2024-07-04

申请号：US18357407

申请日：2023-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hoseok HEO ,  Hyungyung KIM ,  Seungdam HYUN ,  Kyunghun KIM ,  Seungyeul YANG ,  Gukhyon YON ,  Minhyun LEE ,  Seokhoon CHOI

IPC: G11C16/04 ,  H10B43/27

CPC classification number: G11C16/0483 ,  H10B43/27

Abstract: A vertical non-volatile memory device and an electronic apparatus including the vertical non-volatile memory device are provided. The vertical non-volatile memory device includes a pillar, a channel layer surrounding a side surface of the pillar, a charge tunneling layer surrounding a side surface of the channel layer, a charge trap layer surrounding a side surface of the charge tunneling layer and including an amorphous oxynitride, a charge blocking layer surrounding a side surface of the charge trap layer, and a plurality of separation layers and a plurality of gate electrodes surrounding a side surface of the charge blocking layer and alternately arranged along the side surface of the charge blocking layer.

公开(公告)号：US20250029656A1

公开(公告)日：2025-01-23

申请号：US18774249

申请日：2024-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yumin KIM ,  Seyun KIM ,  Garam PARK ,  Hyunjae SONG ,  Seungyeul YANG ,  Seungdam HYUN

IPC: G11C13/00

Abstract: A memory device including a variable serial resistive element having a voltage dividing effect and an operating method thereof are disclosed. The memory device includes a memory unit, a variable serial resistive element connected to the memory unit, a controller connected to the variable serial resistive element and configured to control a resistance of the variable serial resistive element, and a power source connected to the variable serial resistive element. The operating method of the memory device includes maintaining a resistance of a serial resistive element connected to a memory element as a first resistance during a first operation of the memory element and maintaining the resistance of the serial resistive element as a second resistance during a second operation of the memory element, wherein the serial resistive element includes a variable resistive element.

公开(公告)号：US20240196763A1

公开(公告)日：2024-06-13

申请号：US18214755

申请日：2023-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yumin KIM ,  Seyun KIM ,  Garam PARK ,  Hyunjae SONG ,  Seungyeul YANG ,  Seungdam HYUN ,  Jooheon KANG ,  Jinwoo LEE

IPC: H10N70/00 ,  H10B63/00

CPC classification number: H10N70/826 ,  H10B63/84 ,  H10N70/8833

Abstract: A variable resistance memory device includes a pillar, a resistance change layer provided at a side surface of the pillar, a semiconductor layer provided at a side surface of the resistance change layer, a gate insulating layer provided at a side surface of the semiconductor layer, a plurality of isolating layers and a plurality of gate electrodes alternately arranged along a surface of the gate insulating layer, and an internal resistance layer between the resistance change layer and the semiconductor layer, where a resistance of the internal resistance layer is greater than a resistance of the semiconductor layer when the semiconductor layer includes conductor characteristics and the resistance of the internal resistance layer is less than the resistance of the semiconductor layer when the semiconductor layer includes insulator characteristics.