SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
    1.
    发明申请
    SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20160141381A1

    公开(公告)日:2016-05-19

    申请号:US14816568

    申请日:2015-08-03

    CPC classification number: H01L29/66545 H01L29/7848 H01L29/785

    Abstract: Semiconductor devices and methods for fabricating the same are provided. The semiconductor devices include a fin active pattern formed to project from a substrate, a gate electrode formed to cross the fin active pattern on the substrate, a gate spacer formed on a side wall of the gate electrode and having a low dielectric constant and an elevated source/drain formed on both sides of the gate electrode on the fin active pattern. The gate spacer includes first, second and third spacers that sequentially come in contact with each other in a direction in which the gate spacer goes out from the gate electrode, and a carbon concentration of the second spacer is lower than carbon concentrations of the first and third spacers.

    Abstract translation: 提供半导体器件及其制造方法。 半导体器件包括从衬底突出形成的鳍状有源图案,形成为跨越衬底上的鳍状活性图案的栅极电极,形成在栅电极的侧壁上并具有低介电常数和升高的栅极间隔 源极/漏极形成在鳍状物图案上的栅电极的两侧。 栅极间隔物包括在栅极间隔物从栅电极出来的方向上依次相互接触的第一,第二和第三间隔物,第二间隔物的碳浓度低于第一和第二间隔物的碳浓度, 第三间隔物。

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