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公开(公告)号：US20210226110A1
公开(公告)日：2021-07-22
申请号：US17223592
申请日：2021-04-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： JI-HOON YUN , Jong-sup Song , Seol-young Choi
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US11677059B2
公开(公告)日：2023-06-13
申请号：US17223592
申请日：2021-04-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
CPC classification number: H01L33/62 , H01L24/16 , H01L24/17 , H01L33/486 , H01L33/502 , H01L33/60 , H01L24/13 , H01L27/0248 , H01L27/0255 , H01L29/866 , H01L2224/13101 , H01L2224/16245 , H01L2224/16257 , H01L2224/17106 , H01L2224/81011 , H01L2224/81385 , H01L2224/81815 , H01L2924/12041 , H01L2924/3512 , H01L2933/0033
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US10510936B2
公开(公告)日：2019-12-17
申请号：US15796190
申请日：2017-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US10408430B2
公开(公告)日：2019-09-10
申请号：US15713072
申请日：2017-09-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung-gyun Jung , Won-soo Ji , Jong-sup Song , Sang-woo Ha
IPC: F21V5/04 , F21V15/01 , F21K9/68 , F21V7/00 , G02B3/00 , G02B19/00 , F21S8/08 , F21V5/00 , F21V5/08 , F21W131/103 , F21Y105/16 , F21Y115/10
Abstract: There are provided a lighting lens, a lighting lens array, and a lighting apparatus. The lighting lens may include an incidence part to receive light from a light source and an emission part to emit light provided from the incidence part. The incidence part may have a concave region that contains a light source and a first protrusion at a rear side of the light source that protrudes downwards from a top surface of the concave region. The emission part may include a dome-shaped part that encloses the incidence part and a second protrusion at the rear side of the light source that protrudes upwards from a top surface of the dome-shaped part. A lowermost portion of the emission part may be formed at a first plane, and an angle between an outer surface of the emission part and the first plane is an obtuse angle.
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Patent Agency Ranking
公开(公告)号：US10971668B2
公开(公告)日：2021-04-06
申请号：US16853991
申请日：2020-04-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US10892391B2
公开(公告)日：2021-01-12
申请号：US16550816
申请日：2019-08-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US20180315912A1
公开(公告)日：2018-11-01
申请号：US15796190
申请日：2017-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
CPC classification number: H01L33/62 , H01L24/13 , H01L24/16 , H01L24/17 , H01L27/0248 , H01L27/0255 , H01L29/866 , H01L33/486 , H01L33/502 , H01L33/60 , H01L2224/13101 , H01L2224/16245 , H01L2224/16257 , H01L2224/17106 , H01L2224/81011 , H01L2224/81385 , H01L2224/81815 , H01L2924/12041 , H01L2924/3512 , H01L2933/0033 , H01L2924/014 , H01L2924/00014
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US10014454B2
公开(公告)日：2018-07-03
申请号：US15412320
申请日：2017-01-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung-wook Hwang , Min-gyeong Gwon , Sae-sil Kim , Eun-joo Shin , Yu-ri Jung , Won-soo Ji , Jong-sup Song
CPC classification number: H01L33/60 , H01L33/44 , H01L33/46 , H01L33/507 , H01L33/58
Abstract: A light-emitting device includes a light-emitting structure, a lens, and a reflective layer. The light-emitting structure includes a light-emitting stack structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, which are stacked, a first electrode layer electrically connected to the first-conductivity-type semiconductor layer, and a second electrode layer electrically connected to the second-conductivity-type semiconductor layer. The lens is located on the light-emitting structure. The reflective layer is located on the lens.
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公开(公告)号：US20170324011A1
公开(公告)日：2017-11-09
申请号：US15412320
申请日：2017-01-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kyung-wook Hwang , Min-gyeong Gwon , Sae-sil Kim , Eun-joo Shin , Yu-ri Jung , Won-soo Ji , Jong-sup Song
CPC classification number: H01L33/60 , H01L33/44 , H01L33/507
Abstract: A light-emitting device includes a light-emitting structure, a lens, and a reflective layer. The light-emitting structure includes a light-emitting stack structure including a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer, which are stacked, a first electrode layer electrically connected to the first-conductivity-type semiconductor layer, and a second electrode layer electrically connected to the second-conductivity-type semiconductor layer. The lens is located on the light-emitting structure. The reflective layer is located on the lens.
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