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Patent Agency Ranking
公开(公告)号：US10510936B2
公开(公告)日：2019-12-17
申请号：US15796190
申请日：2017-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US11677059B2
公开(公告)日：2023-06-13
申请号：US17223592
申请日：2021-04-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
CPC classification number: H01L33/62 , H01L24/16 , H01L24/17 , H01L33/486 , H01L33/502 , H01L33/60 , H01L24/13 , H01L27/0248 , H01L27/0255 , H01L29/866 , H01L2224/13101 , H01L2224/16245 , H01L2224/16257 , H01L2224/17106 , H01L2224/81011 , H01L2224/81385 , H01L2224/81815 , H01L2924/12041 , H01L2924/3512 , H01L2933/0033
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US10971668B2
公开(公告)日：2021-04-06
申请号：US16853991
申请日：2020-04-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US10892391B2
公开(公告)日：2021-01-12
申请号：US16550816
申请日：2019-08-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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公开(公告)号：US20180315912A1
公开(公告)日：2018-11-01
申请号：US15796190
申请日：2017-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ji-hoon Yun , Jong-sup Song , Seol-young Choi
CPC classification number: H01L33/62 , H01L24/13 , H01L24/16 , H01L24/17 , H01L27/0248 , H01L27/0255 , H01L29/866 , H01L33/486 , H01L33/502 , H01L33/60 , H01L2224/13101 , H01L2224/16245 , H01L2224/16257 , H01L2224/17106 , H01L2224/81011 , H01L2224/81385 , H01L2224/81815 , H01L2924/12041 , H01L2924/3512 , H01L2933/0033 , H01L2924/014 , H01L2924/00014
Abstract: A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
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