公开(公告)号：US20230077919A1

公开(公告)日：2023-03-16

申请号：US17748680

申请日：2022-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinkyu KIM ,  Hyeokseon YU

IPC: G06F1/08 ,  G06F1/20

Abstract: An electronic device according to various embodiments may include: a temperature sensor; a sensor unit; and at least one processor. The at least one processor may be configured to determine that a temperature value detected by the temperature sensor exceeds a temperature threshold value; determine whether a condition is satisfied, the condition being related to at least one of a flexible state of the electronic device, whether a cover case is mounted on the electronic device, or a distance between a user's contact position on the electronic device and a position of the at least one processor; based on the condition being satisfied, operate according to a first clock level corresponding to the temperature value; and based on the condition not being satisfied, operate according to a second clock level higher than the first clock level.

公开(公告)号：US20220295009A1

公开(公告)日：2022-09-15

申请号：US17828599

申请日：2022-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewon DO ,  Jinkyu KIM ,  Shiva Prasad CHANDURI ,  Vinayak GOYAL ,  Yongtae KIM

IPC: H04N5/77 ,  H04N5/92

Abstract: A portable communication device supporting video calls is provided. The portable communication device can be configured to perform a video call on the basis of a first video codec and a first audio codec, receive, through a touch display, a request for recording the video call, and, if the first audio codec is not supported by a designated media container, record the video call on the basis of the first video codec and a second audio codec supported by the media container.

公开(公告)号：US20250157195A1

公开(公告)日：2025-05-15

申请号：US18897759

申请日：2024-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Korea University Research and Business Foundation

Inventor： Sujin JANG ,  Sangpil KIM ,  Jinkyu KIM ,  Won Jeong RYOO ,  Dongwook LEE ,  Gyusam CHANG ,  Dae Hyun JI

IPC: G06V10/774 ,  G06V10/77

Abstract: A processor-implemented method including text-guided training using a pre-trained text-guided model and an image feature extractor based on one or more text inputs and one or more image inputs corresponding to the one or more text inputs, light detection and ranging (LiDAR)-guided training using a point cloud encoder and a bird's-eye view (BEV) encoder, and training an object detection model based on a result of the text-guided training and a result of the LiDAR-guided training, and the text-guided training includes outputting one or more text-image features that are used to train the object detection model by using the text-guided model and the image feature extractor.

公开(公告)号：US20240161442A1

公开(公告)日：2024-05-16

申请号：US18451287

申请日：2023-08-17

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  Korea University Research and Business Foundation

Inventor： Sujin JANG ,  Sangpil KIM ,  Jinkyu KIM ,  Wonseok ROH ,  Gyusam CHANG ,  Dongwook LEE ,  Dae Hyun JI

IPC: G06V10/25 ,  G01S17/86 ,  G01S17/89 ,  G06V10/44 ,  G06V10/74 ,  G06V10/764 ,  G06V10/82

CPC classification number: G06V10/25 ,  G01S17/86 ,  G01S17/89 ,  G06V10/44 ,  G06V10/761 ,  G06V10/764 ,  G06V10/82 ,  G06V2201/07

Abstract: A method and apparatus with object detector training is provided. The method includes obtaining first input data and second input data from a target object; obtaining second additional input data by performing data augmentation on the second input data; extracting a first feature to a shared embedding space by inputting the first input data to a first encoder; extracting a second feature to the shared embedding space by inputting the second input data to a second encoder; extracting a second additional feature to the shared embedding space by inputting thesecond additional input data to the second encoder; identifying a first loss function based on the first feature, the second feature, and the second additional feature; identifying a second loss function based on the second feature and the second additional feature; and updating a weight of the second encoder based on the first loss function and the second loss function.

公开(公告)号：US20170149961A1

公开(公告)日：2017-05-25

申请号：US15352755

申请日：2016-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinkyu KIM ,  Sangwook SHIN ,  Sungwan YOUN

IPC: H04M1/725 ,  H04M3/428

CPC classification number: H04M1/72597 ,  H04M1/72519 ,  H04M3/4288 ,  H04M2201/60 ,  H04M2250/62 ,  H04M2250/74

Abstract: A call service providing method and an electronic device thereof are provided. The electronic device includes: at least one communication circuit supporting at least one communication protocol; a display; a microphone; a speaker; an input device which is configured with or separated from the display; a control circuit electrically coupled to the communication circuit, the display, the microphone, the speaker, and the input device; and a memory electrically coupled to the control circuit. The memory stores instructions executable by the control circuit to: receive a first call from a first external electronic device via the at least one communication circuit; during the first call, receive a request for a second call from a second external electronic device via the at least one communication circuit; receive the second call based on input via the input device; convert a first voice data from the second external electronic device to a first text data and display the first text data on the display; and convert a second text data inputted via the input device to a second voice data and transmit the second voice data to the second external electronic device. Various other embodiments are provided.

公开(公告)号：US20250126860A1

公开(公告)日：2025-04-17

申请号：US18738594

申请日：2024-06-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehyun AHN ,  Jinkyu KIM ,  Hidenobu FUKUTOME ,  Jeewoong KIM ,  Yunsuk NAM

IPC: H01L29/08 ,  H01L23/528 ,  H01L27/088 ,  H01L29/06 ,  H01L29/417 ,  H01L29/423 ,  H01L29/775 ,  H01L29/786

Abstract: An integrated circuit device includes: a substrate including a first surface and a second surface; a fin-type active area extending on the first surface of the substrate in a first horizontal direction, and including a first area and a second area that are adjacent to each other; a first source/drain area arranged on the first area of the fin-type active area; a second source/drain area arranged on the second area of the fin-type active area; and a first filling insulating layer extending between the first source/drain area and the second source/drain area, wherein the first area includes a first conductivity type, wherein the second area includes a second conductivity type that is different from the first conductivity type, and wherein a boundary between the first area and the second area includes a portion that is substantially perpendicular to the first horizontal direction, and overlaps the filling insulating layer.

公开(公告)号：US20240332358A1

公开(公告)日：2024-10-03

申请号：US18380711

申请日：2023-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungmin CHA ,  Jinkyu KIM ,  Yunsuk NAM

IPC: H01L29/06 ,  H01L23/48 ,  H01L27/092 ,  H01L29/08 ,  H01L29/417 ,  H01L29/423 ,  H01L29/775 ,  H01L29/786

CPC classification number: H01L29/0673 ,  H01L23/481 ,  H01L27/092 ,  H01L29/0847 ,  H01L29/41733 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/78696

Abstract: A semiconductor device includes: a first substrate that includes a first region and a second region; an active pattern disposed on the first region; a source/drain pattern disposed on the active pattern; a through contact disposed on the second region; a first metal layer disposed on the through contact; a second substrate disposed on the first metal layer, wherein the second substrate includes an impurity region; a lower bonding pad disposed between the first metal layer and the second substrate; an upper bonding pad disposed on the lower bonding pad; and a power delivery network layer disposed on a bottom surface of the first substrate, wherein the lower bonding pad and the upper bonding pad are in contact with each other, wherein the through contact is connected to the lower bonding pad, and wherein the impurity region is connected to the upper bonding pad.

公开(公告)号：US20250167113A1

公开(公告)日：2025-05-22

申请号：US18754295

申请日：2024-06-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeewoong KIM ,  Jinkyu KIM ,  Yunsuk NAM ,  Yoonbeom PARK ,  Keunhwi CHO

IPC: H01L23/528 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L29/775 ,  H01L29/786

Abstract: Provided is an integrated circuit device including first and second power lines each overlapping a first cell region, an inter-cell separation region, and a second cell region on a substrate in a vertical direction to the substrate, a first power tap cell penetrating through the substrate and receiving a first voltage from the first power line, a second power tap cell penetrating through the substrate and receiving, from the second power line, a second voltage different from the first voltage, and a dummy gate insulating bridge including first and second dummy gate insulating lines, which are apart from each other with the first and second power tap cells therebetween, and defining a vacuum space, and connected to the first and second dummy gate insulating lines.

公开(公告)号：US20250110536A1

公开(公告)日：2025-04-03

申请号：US18977918

申请日：2024-12-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinkyu KIM ,  Hyeokseon YU

IPC: G06F1/26

Abstract: An electronic device according to one embodiment may comprise a PMIC, a memory, and a processor. The processor can identify, in response to an input indicating booting of the processor, whether to acquire driving information on the basis of the frequency of the processor. The processor controls the PMIC in a state designated for acquiring the driving information on the basis of the frequency of the processor, and thus can change respective frequencies of different circuits in the processor by using a designated data set. The processor can acquire the driving information about the circuits in the processor for the frequencies on the basis of a hit rate indicating the number of operations performed by the plurality of circuits for each of the changed frequencies of the circuits.

公开(公告)号：US20210160783A1

公开(公告)日：2021-05-27

申请号：US17104471

申请日：2020-11-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghui PARK ,  Minsoo KIM ,  Chanhun YUN ,  Jinkyu KIM ,  Jiwoo LEE ,  Yeunwook LIM

IPC: H04W52/02 ,  H04W4/80

Abstract: The disclosure relates to a method for providing hardware reset in an electronic device having at least one non-physical key and the electronic device thereof, and an operating method of the electronic device may include detecting a current amount supplied to a processor, detecting whether wireless power is input, generating a hardware reset signal based on the detected current amount and the wireless power input, and transmitting the generated hardware reset signal to the processor.