SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20170054075A1

    公开(公告)日:2017-02-23

    申请号:US15344772

    申请日:2016-11-07

    IPC分类号: H01L45/00 H01L27/24

    摘要: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device may include a selection element, a lower electrode pattern provided on the selection element to include a horizontal portion and a vertical portion; and a phase-changeable pattern on the lower electrode pattern. The vertical portion may extend from the horizontal portion toward the phase-changeable pattern and have a top surface, whose area is smaller than that of a bottom surface of the phase-changeable pattern.

    摘要翻译: 提供半导体器件及其制造方法。 半导体器件可以包括选择元件,设置在选择元件上以包括水平部分和垂直部分的下电极图案; 和在下电极图案上的相变图案。 垂直部分可以从水平部分向相变图案延伸,并且具有面积小于可相变图案底面的面积。

    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME 有权
    半导体器件及其制造方法

    公开(公告)号:US20160056376A1

    公开(公告)日:2016-02-25

    申请号:US14746039

    申请日:2015-06-22

    IPC分类号: H01L45/00 H01L27/24

    摘要: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device may include a selection element, a lower electrode pattern provided on the selection element to include a horizontal portion and a vertical portion; and a phase-changeable pattern on the lower electrode pattern. The vertical portion may extend from the horizontal portion toward the phase-changeable pattern and have a top surface, whose area is smaller than that of a bottom surface of the phase-changeable pattern.

    摘要翻译: 提供半导体器件及其制造方法。 半导体器件可以包括选择元件,设置在选择元件上以包括水平部分和垂直部分的下电极图案; 和在下电极图案上的相变图案。 垂直部分可以从水平部分向相变图案延伸,并且具有面积小于可相变图案底面的面积。

    MEMORY DEVICE
    4.
    发明申请
    MEMORY DEVICE 审中-公开

    公开(公告)号:US20190148456A1

    公开(公告)日:2019-05-16

    申请号:US16226855

    申请日:2018-12-20

    IPC分类号: H01L27/24 H01L45/00

    摘要: A memory device includes a plurality of word lines extending along a first direction and spaced apart from each other along a second direction that is perpendicular to the first direction; a plurality of bit lines extending along the second direction and spaced apart from each other in the first direction, the plurality of bit lines being spaced apart from the plurality of word lines in a third direction that is perpendicular to both the first and second directions; and a plurality of memory cells being respectively arranged between the corresponding word and bit lines. Each of the memory cells includes a selection device layer, and a variable resistance layer, wherein the selection device layer includes a chalcogenide switching material having a composition according to a particular chemical formula.

    Method of manufacturing a phase change memory device
    6.
    发明授权
    Method of manufacturing a phase change memory device 有权
    相变存储器件的制造方法

    公开(公告)号:US09318700B2

    公开(公告)日:2016-04-19

    申请号:US14740929

    申请日:2015-06-16

    IPC分类号: H01L21/20 H01L45/00

    摘要: In a method of manufacturing a phase change memory device, an insulating interlayer having a through opening is formed on a substrate, at least one conformal phase change material layer pattern is formed along the sides of the opening, and a plug-like phase change material pattern having a composition different from that of each conformal phase change material layer pattern is formed on the at least one conformal phase change material layer pattern as occupying a remaining portion of the opening. Energy is applied to the phase change material layer patterns to form a mixed phase change material layer pattern including elements from the conformal and plug-like phase change material layer patterns.

    摘要翻译: 在相变存储装置的制造方法中,在基板上形成具有通孔的绝缘中间层,沿开口侧形成至少一个共形相变材料层图案,并且形成插塞状相变材料 具有不同于每个共形相变材料层图案的组成的图案形成在占据开口的剩余部分的至少一个共形相变材料层图案上。 将能量施加到相变材料层图案以形成包括来自保形和插塞状相变材料层图案的元件的混合相变材料层图案。

    Semiconductor device including data storage material pattern

    公开(公告)号:US11387410B2

    公开(公告)日:2022-07-12

    申请号:US16800123

    申请日:2020-02-25

    IPC分类号: H01L27/24 H01L45/00

    摘要: A semiconductor device includes a base structure comprising a semiconductor substrate, a first conductive structure disposed on the base structure, and extending in a first direction, the first conductive structure including lower layers, and at least one among the lower layers including carbon, and a data storage pattern disposed on the first conductive structure. The semiconductor device further includes an intermediate conductive pattern disposed on the data storage pattern, and including intermediate layers, at least one among the intermediate layers including carbon, a switching pattern disposed on the intermediate conductive pattern, and a switching upper electrode pattern disposed on the switching pattern, and including carbon. The semiconductor device further includes a second conductive structure disposed on the switching upper electrode pattern, and extending in a second direction intersecting the first direction, and a hole spacer disposed on a side surface of the data storage pattern.

    Memory device including a variable resistance material layer

    公开(公告)号:US10403681B2

    公开(公告)日:2019-09-03

    申请号:US15832958

    申请日:2017-12-06

    IPC分类号: H01L27/24 H01L45/00

    摘要: A memory device is provided. The memory device includes a variable resistance layer. A selection device layer is electrically connected to the variable resistance layer. The selection device layer includes a chalcogenide switching material having a composition according to chemical formula 1 below, [GeASeBTeC](1-U)[X]U  (1) where 0.20≤A≤0.40, 0.40≤B≤0.70, 0.05≤C≤0.25, A+B+C=1, 0.0≤U≤0.20, and X is at least one selected from boron (B), carbon (C), nitrogen (N), oxygen (O), phosphorus (P), or sulfur (S).

    Memory device
    10.
    发明授权

    公开(公告)号:US10546894B2

    公开(公告)日:2020-01-28

    申请号:US16226855

    申请日:2018-12-20

    IPC分类号: H01L27/24 H01L45/00

    摘要: A memory device includes a plurality of word lines extending along a first direction and spaced apart from each other along a second direction that is perpendicular to the first direction; a plurality of bit lines extending along the second direction and spaced apart from each other in the first direction, the plurality of bit lines being spaced apart from the plurality of word lines in a third direction that is perpendicular to both the first and second directions; and a plurality of memory cells being respectively arranged between the corresponding word and bit lines. Each of the memory cells includes a selection device layer, and a variable resistance layer, wherein the selection device layer includes a chalcogenide switching material having a composition according to a particular chemical formula.