公开(公告)号：US20150262841A1

公开(公告)日：2015-09-17

申请号：US14568603

申请日：2014-12-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee Jeong KIM ,  Yong Kwan LEE

IPC: H01L21/48 ,  H05K3/06 ,  H01L25/00 ,  H01L25/065 ,  H01L21/52 ,  H01L23/00

CPC classification number: H05K3/06 ,  H01L21/486 ,  H01L21/52 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/43 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/29036 ,  H01L2224/32135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/49176 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/152 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H05K1/144 ,  H05K1/183 ,  H05K3/4697 ,  H05K2201/041 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012

Abstract: A method of manufacturing a circuit board may include: preparing a circuit board body including an insulating layer having a first surface and a second surface opposite to the first surface and a first conductive thin film layer disposed on the first surface of the insulating layer and having a convex portion which is disposed on a first surface of the first conductive thin film layer and is embedded in the insulating layer; removing the convex portion to form a cavity corresponding to the convex portion in the insulating layer; and forming one or more first wiring patterns on the first surface of the insulating layer by removing first portions of the first conductive thin film layer. The one or more first wiring patterns correspond to second portions of the first conductive thin film layer not removed.

Abstract translation: 制造电路板的方法可以包括：制备电路板主体，其包括具有第一表面和与第一表面相对的第二表面的绝缘层，以及设置在绝缘层的第一表面上的第一导电薄膜层，并且具有 凸部，其设置在所述第一导电性薄膜层的第一表面上并嵌入所述绝缘层中; 去除所述凸部以形成与所述绝缘层中的所述凸部对应的空腔; 以及通过去除第一导电薄膜层的第一部分，在绝缘层的第一表面上形成一个或多个第一布线图案。 一个或多个第一布线图案对应于未被去除的第一导电薄膜层的第二部分。