公开(公告)号：US09521756B2

公开(公告)日：2016-12-13

申请号：US14339080

申请日：2014-07-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki Lee ,  Sun Woo Yun ,  Jun Woo Myung

IPC: H05K3/00 ,  H01L25/07 ,  H01L23/433 ,  H01L23/495 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K3/0014 ,  H01L23/4334 ,  H01L23/49575 ,  H01L25/07 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/181 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/0154 ,  H05K2201/066 ,  Y10T29/41 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed herein is a power module package including a heat radiating plate including a step difference portion around an edge portion thereof, a semiconductor chip mounted on a mounting surface of the heat radiating plate, an external connection terminal disposed on an outer periphery of the heat radiating plate, electrically connected to the semiconductor chip, and protruding outwards, a wire for electrical connection between the semiconductor chip and the external connection terminal; and a molding portion for encapsulation of the semiconductor chip and a portion of the heat radiating plate, and in particular, the molding portion does not intrude over an exposed surface of the lower portion of the heat radiating plate through the step difference portion. In addition, disclosed herein is a fabricating method for preventing flush of the molding portion on the exposed surface.

Abstract translation: 这里公开了一种功率模块封装，其包括散热板，该散热板包括围绕其边缘部分的台阶差部分，安装在散热板的安装表面上的半导体芯片，设置在散热板外周上的外部连接端子 板，电连接到半导体芯片，并向外突出，用于在半导体芯片和外部连接端子之间电连接的导线; 以及用于封装半导体芯片和散热板的一部分的模制部分，特别地，模制部分不会通过台阶差部分侵入散热板的下部的暴露表面。 此外，本文公开了一种用于防止模制部分在暴露表面上的冲洗的制造方法。

公开(公告)号：US09318352B2

公开(公告)日：2016-04-19

申请号：US13973644

申请日：2013-08-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Jin Suk Son

IPC: H01L23/495 ,  H01L25/07 ,  H01L21/50 ,  H01L23/433 ,  H01L23/24 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/50 ,  H01L21/565 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Abstract translation: 这里公开了功率模块封装及其制造方法。 功率模块封装包括彼此相对设置的第一和第二引线框架; 形成在所述第一引线框架和所述第二引线框架中的两个或第二引线框架中的一个的一个第一表面的一部分上; 以及安装在第一和第二引线框架的第二表面上的半导体器件。

公开(公告)号：US09258879B2

公开(公告)日：2016-02-09

申请号：US13961398

申请日：2013-08-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki Lee ,  Bum Seok Suh ,  Chang Seob Hong ,  Joon Seok Chae ,  Kwang Soo Kim

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/05 ,  H01L25/16 ,  H01L33/64

CPC classification number: H05K1/0201 ,  H01L25/167 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/05 ,  H05K2201/09845 ,  H05K2201/09972 ,  H05K2203/0323 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract translation: 本发明公开了一种散热基板，其特征在于，包括：散热板，其散热板的一侧和另一侧的厚度彼此不同; 导体图案层，形成在所述散热板上并且包括其上安装有控制装置和功率器件的安装焊盘和电路图案; 以及形成在散热板和导体图案层之间的绝缘层。

公开(公告)号：US20150156909A1

公开(公告)日：2015-06-04

申请号：US14270167

申请日：2014-05-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Hoon Kwak ,  Chang Seob Hong ,  Young Ki Lee

IPC: H05K7/14

CPC classification number: H01L23/053 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/04042 ,  H01L2224/48227 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Disclosed herein is a power semiconductor module including a module housing comprising an accommodation space formed therein and fixing portions formed on an external surface thereof, a printed circuit board included in the module housing, exposed through the accommodation space, and comprising circuit patterns (Cu patterns) on which power devices are arranged, and a terminal fixedly coupled to the fixing portion, and comprising an input end for receiving power and leads adhered to a circuit pattern between the power devices and for distribution of supplied current. Accordingly, stray inductance may be effectively reduced, and thus, current distribution between power devices may be balanced, thereby effectively preventing a surge voltage from increasing.

Abstract translation: 本文公开了一种功率半导体模块，包括模块壳体，其包括形成在其中的容纳空间和形成在其外表面上的固定部分，包括在模块壳体中的印刷电路板通过容纳空间暴露，并且包括电路图案（Cu图案 ）和固定地连接到固定部分的端子，并且包括用于接收电力的输入端和附着到电力设备之间的电路图案并且用于分配供电电流的引线。 因此，可以有效地减小杂散电感，从而可以平衡功率器件之间的电流分布，从而有效地防止浪涌电压增加。

公开(公告)号：US20140117525A1

公开(公告)日：2014-05-01

申请号：US14065039

申请日：2013-10-28

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Young Ki Lee ,  Kwang Soo Kim ,  Young Hoon Kwak ,  Sun Woo Yun

IPC: H01L23/495 ,  H01L21/50

CPC classification number: H01L23/49811 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/49844 ,  H01L24/34 ,  H01L24/37 ,  H01L24/72 ,  H01L2224/371 ,  H01L2224/37599 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Disclosed herein is a power module package including: a base substrate; a metal layer including a circuit pattern and a connection pad formed on the base substrate; a semiconductor device including a plurality of electrodes mounted on the circuit pattern of the metal layer; and a plurality of lead frames formed on the connection pad of the metal layer and respectively connected to the plurality of electrodes of the semiconductor device.

Abstract translation: 本文公开了一种功率模块封装，包括：基底; 包括电路图案的金属层和形成在所述基底基板上的连接焊盘; 包括安装在金属层的电路图案上的多个电极的半导体器件; 以及形成在金属层的连接焊盘上并分别连接到半导体器件的多个电极的多个引线框架。

公开(公告)号：US20140001619A1

公开(公告)日：2014-01-02

申请号：US13846591

申请日：2013-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Do Jae Yoo ,  Young Ki Lee ,  Bum Seok Suh ,  Joon Seok Chae

IPC: H01L23/495 ,  H01L21/50

CPC classification number: H01L23/495 ,  H01L21/50 ,  H01L23/055 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/12042 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

Abstract: Disclosed herein is a power module package including an external connection terminal, a substrate in which a fastening unit allowing one end of the external connection terminal to be insertedly fastened thereinto is formed to penetrate in a thickness direction thereof, and a semiconductor chip mounted on one surface of the substrate.

公开(公告)号：US09076660B2

公开(公告)日：2015-07-07

申请号：US14103574

申请日：2013-12-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae Hyun Kim ,  Kwang Soo Kim ,  Sun Woo Yun ,  Young Ki Lee ,  Do Jae Yoo

IPC: H01L23/12 ,  H01L23/34 ,  H01L23/053 ,  H01L23/373

CPC classification number: H01L23/053 ,  H01L23/3735 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Disclosed herein is a power module package including: a first module configured of a first substrate having one surface and the other surface, a first semiconductor chip mounted on one surface of the first substrate, and a first sealing member formed to cover the first semiconductor chip mounted on one surface of the first substrate from both sides in a thickness direction of the first substrate and expose the other surface of the first substrate; and a case enclosing the first module.

Abstract translation: 本文公开了一种功率模块封装，包括：第一模块，其由具有一个表面和另一个表面的第一衬底构成，安装在第一衬底的一个表面上的第一半导体芯片和形成为覆盖第一半导体芯片的第一密封构件 在第一基板的厚度方向上从两侧安装在第一基板的一个表面上，并露出第一基板的另一个表面; 以及包围第一模块的壳体。

公开(公告)号：USD719113S1

公开(公告)日：2014-12-09

申请号：US29450491

申请日：2013-03-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Designer： Young Ho Sohn ,  Si Joong Yang ,  Young Ki Lee ,  Jin Su Kim ,  Dong Hwan Kim ,  Jong Man Kim ,  Kee Ju Um ,  Hyo Jin Lee ,  Young Hoon Kwak

公开(公告)号：US20130337613A1

公开(公告)日：2013-12-19

申请号：US13973644

申请日：2013-08-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Jin Suk Son

IPC: H01L21/50

CPC classification number: H01L21/50 ,  H01L21/565 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

公开(公告)号：US10992033B1

公开(公告)日：2021-04-27

申请号：US16789968

申请日：2020-02-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hong Seok Lee ,  Bo Hyun Seo ,  Sung Youl Choi ,  Young Ki Lee ,  Tae Gyu Ryu ,  Seog Moon Choi

IPC: H01Q1/32 ,  H01Q13/02

Abstract: An antenna apparatus includes a substrate, a transmission antenna disposed on the substrate, and an auxiliary substrate disposed in an upper portion of the transmission antenna and having a radio wave guide unit having a horn shape. The auxiliary substrate further includes an insulator and a second metal pattern disposed in the radio wave guide unit on the insulator.