METHOD OF MANUFACTURING AN INK-JET PRINTHEAD
    1.
    发明申请
    METHOD OF MANUFACTURING AN INK-JET PRINTHEAD 审中-公开
    制造喷墨打印机的方法

    公开(公告)号:US20150258793A1

    公开(公告)日:2015-09-17

    申请号:US14660306

    申请日:2015-03-17

    Abstract: A method of manufacturing an ink jet printhead includes: providing a silicon substrate including active ejecting elements; providing a hydraulic structure layer; providing a silicon orifice plate having a plurality of nozzles for ejection of said ink; and assembling the silicon substrate with said hydraulic structure layer and said silicon orifice plate. Providing the silicon orifice plate comprises: providing a silicon wafer having a substantially planar extension delimited by a first and a second surfaces; performing a thinning step at the second surface so as to remove a central portion having a preset height; and forming in the silicon wafer a plurality of through holes, each defining a respective nozzle for ejection of the ink.

    Abstract translation: 制造喷墨打印头的方法包括:提供包含有效喷射元件的硅基板; 提供液压结构层; 提供具有用于喷射所述油墨的多个喷嘴的硅孔板; 以及将所述硅基板与所述液压结构层和所述硅孔板组装。 提供硅孔板包括:提供具有由第一和第二表面限定的基本平坦的延伸的硅晶片; 在所述第二表面上执行变薄步骤以去除具有预设高度的中心部分; 并在硅晶片上形成多个通孔,每个通孔限定用于喷射墨水的相应喷嘴。

    METHOD OF MANUFACTURING AN INK-JET PRINTHEAD

    公开(公告)号:US20180236767A1

    公开(公告)日:2018-08-23

    申请号:US15557354

    申请日:2016-03-10

    Abstract: The present application relates to a method of manufacturing an ink-jet printhead comprising: providing a silicon substrate (10) including active ejecting elements (11); providing a hydraulic structure layer (20) for defining hydraulic circuits configured to enable a guided flow of ink; providing a silicon orifice plate (30) having a plurality of nozzles (31) for ejection of the ink; assembling the silicon substrate (10) with the hydraulic structure layer (20) and the silicon orifice plate (30); wherein providing the silicon orifice plate (30) comprises: providing a silicon wafer (40) having a planar extension delimited by a first surface (41) and a second surface (42) on opposite sides of the silicon wafer (40); performing a thinning step at the second surface (42) so as to remove from the second surface (42) a central portion (43) having a preset height (H), the silicon wafer (40) being formed, following the thinning step, by a base portion (44) having a planar extension and a peripheral portion (45) extending from the base portion (44), transversally with respect to the planar extension of the base portion (44); and forming in the silicon wafer (40) a plurality of through holes, each defining a respective nozzle (31) for ejection of the ink. The method according to the present invention is characterized in that the silicon wafer (40) is a silicon-on-insulator wafer, wherein the silicon-on-insulator wafer comprises a silicon device layer (38) adjacent to the first surface (41), a silicon handle layer (37) adjacent to the second surface (42) and an insulator layer (39) in-between.

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