INK RESERVOIR WITH BACK PRESSURE SYSTEM
    4.
    发明申请

    公开(公告)号:US20180319173A1

    公开(公告)日:2018-11-08

    申请号:US15577589

    申请日:2016-03-31

    Inventor: Silvano TORI

    Abstract: The present invention provides an ink reservoir 5 including an ink supply interface 2, a duct 3 forming a connection between the ink reservoir 5 and the ink supply interface 2 and a back pressure system. The back pressure system comprises an anisotropic fibrous member 9 for retaining solvent-based ink located within the ink reservoir 5, wherein the fibrous member 9 is established by a plurality of fibers 8. At least some of the fibers are facing the duct 3 leading to the ink supply interface 2.

    A MULTI-CHIP MODULE (MCM) ASSEMBLY

    公开(公告)号:US20210323305A1

    公开(公告)日:2021-10-21

    申请号:US17265144

    申请日:2019-07-15

    Abstract: A multi-chip module (MCM) assembly comprising: a graphite substrate having a front surface and a back surface and comprising a plurality of silicon chips mounted on the front surface, a Printed Wiring Board (PWB) attached to the graphite substrate and provided with openings surrounding outer profiles of the silicon chips, the graphite substrate comprises one or more ink channels on the back surface and one or more ink feeding slots passing through the graphite substrate and being in fluidic communication with the respective one or more ink channels, so that each of the silicon chips can be fed with one or more different types of inks, the MCM assembly further comprises a graphite cover plate configured to cover the one or more ink channels of the graphite substrate.

Patent Agency Ranking