公开(公告)号：US20230127545A1

公开(公告)日：2023-04-27

申请号：US17694857

申请日：2022-03-15

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： H01L23/367 ,  H01L25/16 ,  H01L23/498 ,  H01L23/373 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

摘要： A miniaturized semiconductor package device with its own heat-dissipating ability includes a thermal conductive layer, a redistribution layer, an electronic device, a molding layer, and solder balls for connections. The redistribution layer includes a first surface, a second surface opposite to the first surface, and a circuit layer. The thermal conductive layer is disposed on the first surface of the redistribution layer. The electronic device includes an active region and a non-active region, and is disposed on the first surface of the redistribution layer and the thermal conductive layer. The molding layer is formed on the first surface and the thermal conductive layer, and surrounds the electronic device. The solder balls on the second surface of the redistribution layer electrically connect to the circuit layer.

公开(公告)号：US20230079384A1

公开(公告)日：2023-03-16

申请号：US17485811

申请日：2021-09-27

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： G01S7/481 ,  G01S17/08 ,  G01S7/4865

摘要： A high-precision optical sensor employed in time-of-flight distance detection avoids undesired light affecting the integrity of distance measurement and includes a substrate, a cover, a light emitter, and measurement and reference photodetectors. The substrate includes a surface and grooves. When in place, the cover forms an internal space. The cover has protrusions, a first light transmitting portion, and a second light transmitting portion. The protrusions extend toward the substrate and divide the internal space into interconnected first chamber and second chamber. The light emitter is arranged on the substrate and located in the first chamber, the measurement photodetector is disposed on the groove and located in the second chamber and the reference photodetector enables precise timing by being shielded against internal and unwanted stray light.

公开(公告)号：US20240038742A1

公开(公告)日：2024-02-01

申请号：US17891516

申请日：2022-08-19

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： H01L25/16 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L25/16 ,  H01L23/5386 ,  H01L23/5383 ,  H01L23/3128 ,  H01L21/56 ,  H01L23/49816

摘要： A miniaturized semiconductor package device using trenches for increased component density includes a redistribution layer, an electronic device, a molding layer, and conductive terminals. The redistribution layer includes a first surface, a second surface opposite to the first surface, a trench on the first surface, and a circuit layer. The electronic device is disposed in the trench and electrically connected to the circuit layer. The molding layer is formed on the first surface and covers the electronic device. The conductive terminals are disposed on the second surface of the redistribution layer and form electrical connections to the circuit layer.

公开(公告)号：US20220299639A1

公开(公告)日：2022-09-22

申请号：US17212011

申请日：2021-03-25

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： G01S17/08 ,  G01S17/894 ,  G01S7/4865 ,  G01S7/481 ,  H04B10/07

摘要： An optical sensor employed in time-of-flight distance detection which avoids undesired light affecting the integrity of distance measurement includes a substrate, a cover, a light emitter, a photodetector, and an optical blocking element. The cover is connected with the substrate and forms an internal space. The cover has a protrusion, a first light transmitting portion, and a second light transmitting portion. The protrusion extends toward the substrate and has a bottom, and divides the internal space into an interconnected first chamber and second chamber. The light emitter is arranged on the substrate and located in the first chamber. The photodetector is disposed on the substrate and located in the second chamber. The first optical blocking element is disposed on the photodetector and extends toward the cover and beyond the bottom of the protrusion.

公开(公告)号：US20240347484A1

公开(公告)日：2024-10-17

申请号：US18141202

申请日：2023-04-28

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： H01L23/66 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/66 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/11334 ,  H01L2224/16227 ,  H01L2224/81024 ,  H01L2224/81192 ,  H01L2924/182

摘要： The present disclosure provides a semiconductor package device and a manufacturing method for semiconductor packaging device, the device includes a circuit substrate comprising a first surface and a second surface opposite to the first surface, and a circuit layer disposed between the first surface and the second surface, wherein both the first surface and the second surface are provided with bonding pads; an electronic component disposed on the first surface and electrically connected to the bonding pads of the first surface; a plurality of antenna components spanning the electronic component in a copper bridge manner and electrically connected to the bonding pads on the first surface; and a molding layer formed on the first surface of the circuit substrate, wherein the molding layer surrounds and exposes the plurality of antenna components, and covers the electronic component.

公开(公告)号：US20230350023A1

公开(公告)日：2023-11-02

申请号：US17743158

申请日：2022-05-12

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： G01S7/481 ,  G01S7/4865

CPC分类号： G01S7/4813 ,  G01S7/4865

摘要： A more accurate and durable optical sensor employed in time-of-flight distance detection includes a substrate, a cover, a light emitter, and measurement and reference photodetectors. The substrate includes grooves and the cover includes sidewalls having an extension portion. The cover extends into the grooves to connect with the substrate and forms an internal space. The cover has a first light transmitting portion, a second light transmitting portion, and a protrusion extending toward the substrate and dividing the internal space into first and second chambers. The light emitter is arranged on the substrate in the first chamber, the receiving photodetector is disposed on the groove and in the second chamber. The reference photodetector enables precise timing by shielding against internal and unwanted stray light. A method for making the optical sensor is also disclosed.

公开(公告)号：US20220291378A1

公开(公告)日：2022-09-15

申请号：US17212008

申请日：2021-03-25

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： G01S17/08 ,  G01S17/894 ,  G01S7/4865 ,  G01S7/481 ,  H04B10/07

摘要： An optical sensor employed in time-of-flight distance detection which avoids undesired light affecting the integrity of distance measurement includes a substrate, a cover, a light emitter, a measurement photodetector, and an optical blocking device. The cover is connected with the substrate and forms an internal space. The cover has a protrusion, a first light transmitting portion, and a second light transmitting portion. The protrusion extends toward the substrate and has a bottom, and divides the internal space into an interconnected first chamber and second chamber. The light emitter is arranged on the substrate and located in the first chamber. The measurement photodetector is disposed on the substrate and located in the second chamber. The optical blocking device is connected to the substrate and extends toward the cover and beyond the bottom of the protrusion.

公开(公告)号：US20240363994A1

公开(公告)日：2024-10-31

申请号：US18225711

申请日：2023-07-25

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： H01Q1/22 ,  H01L21/56 ,  H01L21/60 ,  H01L23/00 ,  H01L23/498 ,  H01L23/66 ,  H01Q1/38 ,  H01Q9/04

CPC分类号： H01Q1/2283 ,  H01L21/56 ,  H01L21/60 ,  H01L23/49816 ,  H01L23/66 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01Q1/38 ,  H01Q9/0414 ,  H01L2021/60262 ,  H01L2223/6677 ,  H01L2224/08112 ,  H01L2224/08113 ,  H01L2224/12105 ,  H01L2224/13023 ,  H01L2224/16113

摘要： An antenna device and a method of manufacturing the antenna device are provided. The antenna device includes a circuit board, a chip, an encapsulation layer, and an antenna. The circuit board includes an insulation substrate having an upper surface, a lower surface, and a groove formed on the upper surface; a conductive circuit disposed in the insulation substrate; a first conductive pad disposed in the insulation substrate, connected to the conductive circuit, and exposed from the lower surface; a second conductive pad connected to the conductive circuit, and exposed from the groove; and a third conductive pad exposed from the groove. The chip is disposed in the groove, connected to the second conductive pad, and coupled to the third conductive pad. The encapsulation layer is disposed in the groove, and covers the chip.

公开(公告)号：US20240030164A1

公开(公告)日：2024-01-25

申请号：US17891466

申请日：2022-08-19

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L23/66 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L21/4857 ,  H01L21/565 ,  H01L2223/6677 ,  H01Q1/2283

摘要： A miniaturized semiconductor package device with enhanced functionality includes a redistribution layer, an electronic device, electronic components, a molding layer, an antenna element, and conductive terminals. The redistribution layer includes a first surface, a second surface opposite to the first surface, and a circuit layer. The electronic device and the electronic components are disposed on the first surface of the redistribution layer. The molding layer is formed on a first area of the first surface and covers the electronic device and the electronic components but does not cover a second area of the first surface. The antenna element is disposed on the second area of the first surface. The conductive terminals are disposed on the second surface of the redistribution layer and form electrical connections to the circuit layer.

公开(公告)号：US20230130923A1

公开(公告)日：2023-04-27

申请号：US17552911

申请日：2021-12-16

申请人： SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED

发明人： SHUN-HSING LIAO

IPC分类号： H01L23/373 ,  H01L21/48 ,  H01L23/498 ,  H01L25/16

摘要： A miniaturized and high-power semiconductor package device with its own heat-dissipating ability includes a heat conducting carrier, a redistribution layer, an electronic device, electronic components, a molding layer, and a solder ball. The heat conducting carrier includes an opening. The redistribution layer is formed on the heat conducting carrier. The redistribution layer has a circuit layer. The electronic device and the electronic components are disposed on a first surface of the redistribution layer away from the heat conducting carrier. The molding layer surrounds the electronic device and covers the electronic component. The solder balls are disposed in the opening, are in contact with a second surface of the redistribution layer opposite to the first surface, and are electrically connected to the circuit layer.