公开(公告)号：US10096756B2

公开(公告)日：2018-10-09

申请号：US15201967

申请日：2016-07-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Wook Kim ,  Yoon Suk Han ,  Young Jae Song ,  Byung Man Kim ,  Jae Ky Roh ,  Seong Jae Hong

IPC: H01L33/62 ,  F21V8/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/54

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

公开(公告)号：US09935086B2

公开(公告)日：2018-04-03

申请号：US15342200

申请日：2016-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hyun Moon ,  Seong Jae Hong ,  Kyu Jong Cho ,  Seung Won Kang

IPC: H01L29/18 ,  H01L33/00 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L33/62 ,  H01L2224/16225

Abstract: Provided are a package substrate and a light emitting device package. The package substrate may include a base substrate having a plurality of mounting regions and a plurality of unit light emitting regions which include at least one of the plurality of mounting regions, a plurality of first circuit patterns disposed on the base substrate and connected to a plurality of light emitting devices in the plurality of mounting regions, a plurality of second circuit patterns connected to the plurality of unit light emitting regions, and a wire electrically connecting the plurality of second circuit patterns to the plurality of second circuit patterns, each of the plurality of second circuit patterns being connected to different unit light emitting regions, or electrically connecting the plurality of first circuit patterns to the plurality of second circuit patterns.

公开(公告)号：US09722146B2

公开(公告)日：2017-08-01

申请号：US14305187

申请日：2014-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Hoon Kwak ,  Il Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC: H01L33/50 ,  H01L23/00

CPC classification number: H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

公开(公告)号：US20160315239A1

公开(公告)日：2016-10-27

申请号：US15201967

申请日：2016-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang Wook Kim ,  Yoon Suk Han ,  Young Jae Song ,  Byung Man Kim ,  Jae Ky Roh ,  Seong Jae Hong

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  G02B6/0073 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/4554

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

公开(公告)号：US20140291705A1

公开(公告)日：2014-10-02

申请号：US14305187

申请日：2014-06-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： CHANG HOON KWAK ,  IL Woo Park ,  Kyu Jin Lee ,  Cheol Jun Yoo ,  Seong Jae Hong

IPC: H01L33/50

CPC classification number: H01L33/50 ,  B32B3/08 ,  B32B3/10 ,  B32B3/14 ,  B32B3/16 ,  B32B3/18 ,  B32B5/16 ,  B32B7/12 ,  B32B9/04 ,  B32B9/045 ,  B32B27/06 ,  B32B27/08 ,  B32B27/32 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2250/44 ,  B32B2266/025 ,  B32B2307/40 ,  B32B2307/422 ,  B32B2457/00 ,  C09K11/06 ,  H01L24/97 ,  H01L33/505 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/181 ,  H01L2933/0041 ,  H05B33/22 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24893 ,  Y10T428/24942 ,  Y10T428/31855 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005 ,  H01L2924/00012

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract translation: 提供了荧光体膜，其制造方法以及涂覆荧光体层的LED芯片的方法。 荧光体膜包括：基膜; 通过将部分固化的树脂材料中的荧光体粒子混合而形成在基底膜上的荧光体层; 以及形成在荧光体层上以保护荧光体层的覆盖膜。