公开(公告)号：US10096756B2

公开(公告)日：2018-10-09

申请号：US15201967

申请日：2016-07-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Wook Kim ,  Yoon Suk Han ,  Young Jae Song ,  Byung Man Kim ,  Jae Ky Roh ,  Seong Jae Hong

IPC: H01L33/62 ,  F21V8/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/54

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.

公开(公告)号：US20160315239A1

公开(公告)日：2016-10-27

申请号：US15201967

申请日：2016-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang Wook Kim ,  Yoon Suk Han ,  Young Jae Song ,  Byung Man Kim ,  Jae Ky Roh ,  Seong Jae Hong

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/62 ,  G02B6/0073 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/4554

Abstract: A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.