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公开(公告)号：US10096756B2
公开(公告)日：2018-10-09
申请号：US15201967
申请日：2016-07-05
发明人： Chang Wook Kim , Yoon Suk Han , Young Jae Song , Byung Man Kim , Jae Ky Roh , Seong Jae Hong
摘要： A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.
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公开(公告)号：USRE46851E1
公开(公告)日：2018-05-15
申请号：US14710262
申请日：2015-05-12
发明人： Seon Goo Lee , Chang Wook Kim , Kyung Taeg Han
CPC分类号： H01L33/62 , H01L33/60 , H01L2924/0002 , H01L2924/12041 , H01L2924/00
摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.
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公开(公告)号：US20160315239A1
公开(公告)日：2016-10-27
申请号：US15201967
申请日：2016-07-05
发明人： Chang Wook Kim , Yoon Suk Han , Young Jae Song , Byung Man Kim , Jae Ky Roh , Seong Jae Hong
CPC分类号： H01L33/62 , G02B6/0073 , H01L33/483 , H01L33/54 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48471 , H01L2224/73265 , H01L2924/00014 , H01L2924/00 , H01L2224/48227 , H01L2224/4554
摘要： A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.
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