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公开(公告)号：US12052513B2
公开(公告)日：2024-07-30
申请号：US18450629
申请日：2023-08-16
发明人： Seok Hyun Lee , Whee Woong Lee , Kyung Ah Jeong
摘要： Image processor circuitry includes a memory storing a program of instructions, and processing circuitry configured to execute the program of instructions to receive input data from an image sensor and detect an operation mode of the image sensor based on the input data, provide configuration data determined in association with the operation mode of the image sensor, and process image data in the input data in accordance with the operation mode and the configuration data.
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公开(公告)号：US11652090B2
公开(公告)日：2023-05-16
申请号：US16885391
申请日：2020-05-28
发明人： Min Jun Bae , Dong Kyu Kim , Jin-Woo Park , Seok Hyun Lee
IPC分类号： H01L25/10 , H01L25/065 , H01L25/00
CPC分类号： H01L25/105 , H01L25/0652 , H01L25/50 , H01L2225/0651 , H01L2225/06506 , H01L2225/06562 , H01L2225/06582 , H01L2225/1035 , H01L2225/1041
摘要： A semiconductor package includes a first redistribution layer. A plurality of posts is disposed on the first redistribution layer. A semiconductor chip is disposed on the first redistribution layer between the plurality of posts. A second redistribution layer is formed on the plurality of posts and the semiconductor chip. A first memory stack is disposed on the second redistribution layer. A height of each of the plurality of posts extends from an upper surface of the first redistribution layer to a lower surface of the second redistribution layer.
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公开(公告)号：US11322368B2
公开(公告)日：2022-05-03
申请号：US17037003
申请日：2020-09-29
发明人： Jung-Ho Park , Jin-Woo Park , Seok Hyun Lee , Jae Gwon Jang , Gwang Jae Jeon
IPC分类号： H01L21/48 , H01L21/52 , H01L25/00 , H01L21/56 , H01L23/498
摘要： A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.
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公开(公告)号：US11715645B2
公开(公告)日：2023-08-01
申请号：US17656695
申请日：2022-03-28
发明人： Jung-Ho Park , Jin-Woo Park , Seok Hyun Lee , Jae Gwon Jang , Gwang Jae Jeon
IPC分类号： H01L21/48 , H01L21/52 , H01L25/00 , H01L21/56 , H01L23/498
CPC分类号： H01L21/4853 , H01L21/52 , H01L21/565 , H01L23/49816 , H01L25/50
摘要： A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.
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公开(公告)号：US20240222299A1
公开(公告)日：2024-07-04
申请号：US18402021
申请日：2024-01-02
发明人： Hwan Young CHOI , Seok Hyun Lee , Cheol Kim , Seok Geun Ahn
IPC分类号： H01L23/00 , H01L23/48 , H01L23/522
CPC分类号： H01L24/08 , H01L23/481 , H01L23/5226 , H01L24/05 , H01L24/80 , H01L2224/05017 , H01L2224/05147 , H01L2224/05644 , H01L2224/08145 , H01L2224/80379 , H01L2224/80895 , H01L2224/80896
摘要： A semiconductor package comprises a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a first substrate, a first semiconductor device layer disposed on the first substrate, a first chip wiring layer disposed on the first semiconductor device layer, and a first bonding pad directly connected to the first chip wiring layer and that includes a first dishing formed thereon. The second semiconductor chip includes a second substrate, a first through-via that penetrates through the second substrate, and a second bonding pad directly connected to the first through-via and that includes a second dishing formed thereon. The first semiconductor chip and the second semiconductor chip are bonded to each other and the first bonding pad and the second bonding pad face each other, and a gold bonding layer fills the first dishing of the first bonding pad and the second dishing of the second bonding pad.
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公开(公告)号：US11758284B2
公开(公告)日：2023-09-12
申请号：US17328147
申请日：2021-05-24
发明人： Seok Hyun Lee , Whee Woong Lee , Kyung Ah Jeong
摘要： Image processor circuitry includes a memory storing a program of instructions, and processing circuitry configured to execute the program of instructions to receive input data from an image sensor and detect an operation mode of the image sensor based on the input data, provide configuration data determined in association with the operation mode of the image sensor, and process image data in the input data in accordance with the operation mode and the configuration data.
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公开(公告)号：US11025816B2
公开(公告)日：2021-06-01
申请号：US16668798
申请日：2019-10-30
发明人： Seok Hyun Lee , Whee Woong Lee , Kyung Ah Jeong
摘要： Image processor circuitry includes a memory storing a program of instructions, and processing circuitry configured to execute the program of instructions to receive input data from an image sensor and detect an operation mode of the image sensor based on the input data, provide configuration data determined in association with the operation mode of the image sensor, and process image data in the input data in accordance with the operation mode and the configuration data.
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