公开(公告)号：US20250011932A1

公开(公告)日：2025-01-09

申请号：US18535442

申请日：2023-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junho Lee ,  Yeontae Kim ,  Yihwan Kim ,  Youngbok Lee ,  Sangchul Han

IPC: C23C16/455

Abstract: A showerhead includes a showerhead body positioned at an upper surface of a reaction chamber and configured to inject a reaction gas toward a substrate in the reaction chamber and at least one groove in a lower surface of the showerhead body, where the showerhead body is oriented toward the substrate and the lower surface of the showerhead body includes a slanted structure.

公开(公告)号：US20250046635A1

公开(公告)日：2025-02-06

申请号：US18666563

申请日：2024-05-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangchul Han ,  Yihwan Kim ,  Youngbok Lee ,  Junho Lee ,  SeokJun Hong

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/687

Abstract: A method of processing a substrate includes locating a substrate in a substrate processing apparatus, fixing the substrate in the substrate processing apparatus, processing the substrate, and checking a fixed state of the substrate. The substrate processing apparatus includes a process chamber, a stage supporting the substrate, a plasma induction electrode used to generate plasma and located in the stage, a first power source configured to supply RF power to the plasma induction electrode, a heater located in the stage and used to heat the stage, a second power source configured to supply AC power to the heater, and a monitoring unit electrically connected to the plasma induction electrode. The checking of the fixed state of the substrate includes measuring AC-2 power of the AC power, which is transferred to the monitoring unit through the heater and the plasma induction electrode.

公开(公告)号：US20240318314A1

公开(公告)日：2024-09-26

申请号：US18609067

申请日：2024-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonjoo KANG ,  Yunjae Lee ,  Junhyung Kim ,  Youngbok Lee ,  Sangchul Han ,  Minsung Kim ,  Inhwan Park ,  Sangyeon Oh

IPC: C23C16/458 ,  C23C16/46

CPC classification number: C23C16/4586 ,  C23C16/46

Abstract: A substrate support device includes a chuck plate, a shaft connected to a center lower end of the chuck plate, a heater unit provided inside the chuck plate, an electrode unit provided inside the chuck plate, and provided on the heater unit, a jumper unit provided inside the chuck plate, arranged between the electrode unit and the heater unit, and electrically connected to the electrode unit to supply power to the electrode unit, and a power control unit, wherein the electrode unit includes a center electrode and a first electrode arranged in a ring shape around the center electrode, wherein the jumper unit includes a first jumper connected to the first electrode and a center jumper connected to the center electrode, and wherein the first jumper includes a first connection jumper, and a first inclined jumper electrically connecting the first jumper.

公开(公告)号：US12016109B2

公开(公告)日：2024-06-18

申请号：US17748152

申请日：2022-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changyun Lee ,  Myoungsoo Kim ,  Sangchul Han ,  Daeman Seo

IPC: H05H1/46

CPC classification number: H05H1/466

Abstract: A plasma generator includes a coaxial tube assembly, a radio frequency (RF) electrode, and a feed including an inner circumferential surface that defines a first and second recesses at opposite, first and second ends of the feed. A first protrusion of the coaxial tube assembly is coupled to the first recess of the feed. A second protrusion of the coaxial tube assembly is coupled to the second recess of the feed. The feed includes first and second inner surfaces that define first and second insertion grooves in the inner circumferential surface at the first and second ends of the feed, respectively. First and second coil springs are at least partially within the first and second insertion grooves, respectively. The coaxial tube assembly, the RF electrode, and the feed provide an RF power transmission path based on the feed being coupled between the coaxial tube assembly and the RF electrode.