发明公开
- 专利标题: SUBSTRATE SUPPORT DEVICE
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申请号: US18609067申请日: 2024-03-19
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公开(公告)号: US20240318314A1公开(公告)日: 2024-09-26
- 发明人: Yonjoo KANG , Yunjae Lee , Junhyung Kim , Youngbok Lee , Sangchul Han , Minsung Kim , Inhwan Park , Sangyeon Oh
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR 20230039249 2023.03.24 KR 20230064562 2023.05.18
- 主分类号: C23C16/458
- IPC分类号: C23C16/458 ; C23C16/46
摘要:
A substrate support device includes a chuck plate, a shaft connected to a center lower end of the chuck plate, a heater unit provided inside the chuck plate, an electrode unit provided inside the chuck plate, and provided on the heater unit, a jumper unit provided inside the chuck plate, arranged between the electrode unit and the heater unit, and electrically connected to the electrode unit to supply power to the electrode unit, and a power control unit, wherein the electrode unit includes a center electrode and a first electrode arranged in a ring shape around the center electrode, wherein the jumper unit includes a first jumper connected to the first electrode and a center jumper connected to the center electrode, and wherein the first jumper includes a first connection jumper, and a first inclined jumper electrically connecting the first jumper.
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IPC分类: