Abstract:
A thermoplastic multilayer article comprises: a polycarbonate substrate comprising a polycarbonate composition comprising at least one of a polycarbonate homopolymer, a copolycarbonate, or a polycarbonate copolymer, the polycarbonate substrate having a first surface and an opposing second surface; and a first polyurethane layer laminated or coextruded on at least a portion of the first surface of the polycarbonate substrate, the first polyurethane layer comprising a first aliphatic thermoplastic polyurethane and a polyurethane UV stabilizer, wherein the first aliphatic thermoplastic polyurethane comprises first segments formed via a reaction of caprolactone and an aliphatic isocyanate, and second segments formed via a reaction of a chain extender and the aliphatic isocyanate.
Abstract:
An ultraviolet curable transfer coating can comprise: a multifunctional acrylate oligomer; an acrylate monomer; and a photoinitiator; wherein the ultraviolet curable transfer coating includes a total weight, wherein 30% to 80% of the total weight comprises the multifunctional acrylate oligomer, wherein 15% to 65% of the total weight comprises the acrylate monomer, and wherein 3% to 7% of the total weight comprises the photoinitiator.
Abstract:
A method of making a multilayer sheet includes: forming a substrate including a substrate first surface and a substrate second surface; applying a conductive layer including a base and a conductive coating to the substrate first surface; and applying an ultraviolet cured coating layer to a surface of the conductive layer opposite that in contact with the substrate second surface, wherein the ultraviolet cured coating layer comprises a multifunctional acrylate oligomer and an acrylate monomer; pressing the substrate, conductive layer, and ultraviolet cured coating layer together to form a stack; heating the stack; activating the ultraviolet cured coating layer with an ultraviolet radiation source; and removing the base from the stack leaving a conductive multilayer sheet; wherein the ultraviolet cured coating layer remains adhered to the conductive layer.
Abstract:
An integrated conductive film can comprise: a first substrate including a first surface and a second surface, wherein the first substrate comprises a first polymer; a second substrate coupled to the second surface of the first substrate, wherein the second substrate comprises a second polymer, and wherein the chemical composition of the first polymer is different from the chemical composition of the second polymer; a transfer resin disposed adjacent to the first surface of the first substrate; a conductive coating disposed adjacent to the transfer resin, and wherein a change in electrical resistance of the integrated conductive film is less than or equal to 1 ohm when the film is bent to a bend radius of less than or equal to 126 millimeters as per ASTM D5023.
Abstract:
A thermoplastic composition including 40 to 70 weight percent of a polycarbonate; 15 to 50 weight percent of a polycarbonate-polysiloxane copolymer; 4 to 8 weight percent of a polyetherimide-polysiloxane copolymer; 1 to 8 weight percent of a mineral filler; and 2 to 5 weight percent of a phosphorous-containing flame retardant; wherein the weight percentages are based on the total weight of the thermoplastic composition.
Abstract:
A method of thermoforming an article from an integrated transparent conductive film, comprising: applying an ultraviolet curable transfer coating to a first surface of a recipient substrate or to a first surface of a donor substrate, wherein the first surface of the donor substrate includes a conductive coating coupled thereto; pressing the first surface of the recipient substrate and the first surface of the donor substrate together to form a stack; heating the stack and activating the ultraviolet curable transfer coating with an ultraviolet radiation source; removing the donor substrate from the stack leaving a transparent conductive layer, wherein the ultraviolet curable transfer coating remains adhered to the first surface of the recipient substrate and to the conductive coating; laser etching an electrical circuit onto a transparent conductive layer second surface to form an integrated transparent conductive film; and thermoforming the integrated transparent conductive film to form the article.
Abstract:
A method of forming an article of manufacture, comprising: forming a mold insert, comprising applying a conductive layer on a donor substrate second surface, wherein the conductive layer includes nanometer sized metal particles arranged in a network; applying an ultraviolet curable coating layer to a recipient substrate first surface; pressing the recipient substrate, the ultraviolet curable coating layer, and the donor substrate together to form a stack; heating the stack and activating the ultraviolet cured coating layer with an ultraviolet radiation source; removing the donor substrate from the stack, wherein the ultraviolet curable coating layer adheres to the recipient substrate first surface and the conductive layer; thermoforming the mold insert; and injection molding a polymeric resin layer around a portion of the recipient substrate second surface.
Abstract:
A method of making a multilayer sheet includes: forming a substrate including a substrate first surface and a substrate second surface; applying a conductive layer including a base and a conductive coating to the substrate first surface; and applying an ultraviolet cured coating layer to a surface of the conductive layer opposite that in contact with the substrate second surface, wherein the ultraviolet cured coating layer comprises a multifunctional acrylate oligomer and an acrylate monomer; pressing the substrate, conductive layer, and ultraviolet cured coating layer together to form a stack; heating the stack; activating the ultraviolet cured coating layer with an ultraviolet radiation source; and removing the base from the stack leaving a conductive multilayer sheet; wherein the ultraviolet cured coating layer remains adhered to the conductive layer.
Abstract:
A method of thermoforming an article from an integrated transparent conductive film includes heating the integrated transparent conductive film to a formable temperature in a mold, wherein the integrated transparent conductive film comprises a substrate comprising a transparent thermoplastic material, wherein the substrate includes a substrate first surface and a substrate second surface; a transparent conductive layer disposed adjacent to the substrate, wherein the transparent conductive layer includes a transparent conductive layer first surfaced disposed on the substrate first surface; and an electrical circuit etched onto a transparent conductive layer second surface; thermoforming the integrated transparent conductive film to the article comprising the mold shape; cooling the formed article; and removing the formed article form the mold; wherein the formed article has a functional electrical circuit after thermoforming.