公开(公告)号：US20170044394A1

公开(公告)日：2017-02-16

申请号：US15305780

申请日：2015-04-20

Applicant: SABIC Global Technologies B.V.

Inventor： Yuzhen Xu ,  Wei Feng ,  Zhe Chen ,  Hengjie Lai ,  Li Yang ,  Jing Chen

IPC: C09D135/02 ,  H01B1/22 ,  C09D5/24

Abstract: An ultraviolet curable transfer coating can comprise: a multifunctional acrylate oligomer; an acrylate monomer; and a photoinitiator; wherein the ultraviolet curable transfer coating includes a total weight, wherein 30% to 80% of the total weight comprises the multifunctional acrylate oligomer, wherein 15% to 65% of the total weight comprises the acrylate monomer, and wherein 3% to 7% of the total weight comprises the photoinitiator.

Abstract translation: 紫外线固化转移涂层可以包括：多官能丙烯酸酯低聚物; 丙烯酸酯单体; 和光引发剂; 其中所述紫外线固化转移涂层包括总重量，其中总重量的30％至80％包含多官能丙烯酸酯低聚物，其中总重量的15％至65％包含丙烯酸酯单体，并且其中3％至7％ 总重量包括光引发剂。

公开(公告)号：US20200253048A1

公开(公告)日：2020-08-06

申请号：US16838101

申请日：2020-04-02

Applicant: SABIC Global Technologies B.V.

Inventor： Zhe Chen ,  Jing Chen ,  Yonglei Xu ,  Yuzhen Xu

IPC: H05K1/09 ,  B29C51/14 ,  B32B27/16 ,  B32B27/08 ,  H05K3/00 ,  B32B27/26

Abstract: A method of thermoforming an article from an integrated transparent conductive film, comprising: applying an ultraviolet curable transfer coating to a first surface of a recipient substrate or to a first surface of a donor substrate, wherein the first surface of the donor substrate includes a conductive coating coupled thereto; pressing the first surface of the recipient substrate and the first surface of the donor substrate together to form a stack; heating the stack and activating the ultraviolet curable transfer coating with an ultraviolet radiation source; removing the donor substrate from the stack leaving a transparent conductive layer, wherein the ultraviolet curable transfer coating remains adhered to the first surface of the recipient substrate and to the conductive coating; laser etching an electrical circuit onto a transparent conductive layer second surface to form an integrated transparent conductive film; and thermoforming the integrated transparent conductive film to form the article.

公开(公告)号：US20180279471A1

公开(公告)日：2018-09-27

申请号：US15763547

申请日：2016-09-27

Applicant: SABIC Global Technologies B.V.

Inventor： Zhe Chen ,  Jing Chen ,  Yonglei Xu ,  Yuzhen Xu

IPC: H05K1/09 ,  B32B27/16 ,  B32B27/08 ,  B29C51/14

CPC classification number: H05K1/095 ,  B29C51/14 ,  B32B27/08 ,  B32B27/16 ,  B32B27/26 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2323/04 ,  B32B2323/10 ,  B32B2325/00 ,  B32B2327/12 ,  B32B2369/00 ,  B32B2457/08 ,  B32B2457/12 ,  B32B2457/20 ,  B32B2457/202 ,  B32B2457/206 ,  B32B2457/208 ,  H05K1/097 ,  H05K3/0014 ,  H05K2201/0108 ,  H05K2201/0129

Abstract: A method of thermoforming an article from an integrated transparent conductive film includes heating the integrated transparent conductive film to a formable temperature in a mold, wherein the integrated transparent conductive film comprises a substrate comprising a transparent thermoplastic material, wherein the substrate includes a substrate first surface and a substrate second surface; a transparent conductive layer disposed adjacent to the substrate, wherein the transparent conductive layer includes a transparent conductive layer first surfaced disposed on the substrate first surface; and an electrical circuit etched onto a transparent conductive layer second surface; thermoforming the integrated transparent conductive film to the article comprising the mold shape; cooling the formed article; and removing the formed article form the mold; wherein the formed article has a functional electrical circuit after thermoforming.

公开(公告)号：US20170066225A1

公开(公告)日：2017-03-09

申请号：US15305762

申请日：2015-04-20

Applicant: SABIC Global Technologies B.V.

Inventor： Zhe Chen ,  Jing Chen ,  Wei Feng ,  Yuzhen Xu

IPC: B32B27/08 ,  B32B5/16 ,  B29C47/06 ,  C08J7/04 ,  B32B27/30 ,  B32B37/00 ,  G06F3/041 ,  B32B27/36 ,  B29C47/00

CPC classification number: B32B27/08 ,  B29C48/0021 ,  B29C48/022 ,  B29C48/08 ,  B29C48/21 ,  B29K2033/12 ,  B29K2069/00 ,  B29K2995/0005 ,  B29K2995/0026 ,  B29L2031/3475 ,  B32B5/16 ,  B32B7/12 ,  B32B27/308 ,  B32B27/36 ,  B32B27/365 ,  B32B37/025 ,  B32B2255/10 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/51 ,  B32B2307/536 ,  B32B2307/554 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2369/00 ,  B32B2457/20 ,  B32B2457/208 ,  C08J7/047 ,  C08J2369/00 ,  C08J2433/06 ,  C08J2433/12 ,  G06F3/041 ,  G06F2203/04103

Abstract: An integrated conductive film can comprise: a first substrate including a first surface and a second surface, wherein the first substrate comprises a first polymer; a second substrate coupled to the second surface of the first substrate, wherein the second substrate comprises a second polymer, and wherein the chemical composition of the first polymer is different from the chemical composition of the second polymer; a transfer resin disposed adjacent to the first surface of the first substrate; a conductive coating disposed adjacent to the transfer resin, and wherein a change in electrical resistance of the integrated conductive film is less than or equal to 1 ohm when the film is bent to a bend radius of less than or equal to 126 millimeters as per ASTM D5023.

Abstract translation: 集成导电膜可​​以包括：包括第一表面和第二表面的第一基底，其中所述第一基底包括第一聚合物; 第二基板，其耦合到所述第一基板的第二表面，其中所述第二基板包括第二聚合物，并且其中所述第一聚合物的化学组成不同于所述第二聚合物的化学组成; 与第一基板的第一表面相邻设置的转印树脂; 导电涂层，其邻近转移树脂设置，并且其中当膜弯曲至小于或等于126毫米的弯曲半径时，整体导电膜的电阻变化小于或等于1欧姆，按照ASTM D5023。