公开(公告)号：US20200255657A1

公开(公告)日：2020-08-13

申请号：US16497087

申请日：2018-03-29

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Zhenke WEI ,  Yuanqing HE ,  Bing GUAN ,  Norio OZAWA

IPC: C08L69/00 ,  C08K5/103 ,  C08K3/40

Abstract: The disclosure relates to a thermoplastic blend comprising a polycarbonate, an inorganic filler, an impact modifier, and a heat stabilizer; and wherein a molded specimen of the thermoplastic blend exhibits an improved bonding strength, high melt flow rate, and high impact strength.

公开(公告)号：US20190177519A1

公开(公告)日：2019-06-13

申请号：US16300991

申请日：2017-05-25

Applicant: SABIC Global Technologies B.V.

Inventor： Jian WANG ,  Shijie SONG ,  Zhenke WEI ,  Qin WANG ,  Mian DAI

IPC: C08L23/12 ,  C08L71/12 ,  C08L69/00 ,  C08K7/14 ,  C08L67/02 ,  C08L23/08 ,  C08L25/08

Abstract: A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.

公开(公告)号：US20190322861A1

公开(公告)日：2019-10-24

申请号：US16095887

申请日：2017-04-27

Applicant: SABIC Global Technologies B.V.

Inventor： Zhenke WEI ,  Tong WU ,  Yunan CHENG ,  Qin WANG

IPC: C08L67/02 ,  C08K7/14 ,  C08K3/32 ,  C08K3/22 ,  C08L69/00 ,  C08L77/00

Abstract: A thermoplastic composition includes a polymeric base resin, a glass fiber component, and a laser direct structuring additive. The laser direct structuring additive includes copper chromite black, copper hydroxide phosphate, tin-antimony cassiterite grey or a combination thereof. In some aspects the polymeric base resin includes polybutylene terephthalate (PBT), polyamide (PA), polycarbonate (PC), poly(p-phenylene oxide) (PPO), or combinations thereof. In certain aspects the thermoplastic composition has a nano molding technology (NMT) bonding strength of at least about 20 MPa when bonded to aluminum alloy. In further aspects the thermoplastic composition includes a plating index of at least a about 0.25. The disclosed thermoplastic compositions can be used to form articles such as NMT bonded covers of consumer electronics devices.

公开(公告)号：US20170029615A1

公开(公告)日：2017-02-02

申请号：US15303567

申请日：2015-06-23

Applicant: SABIC Global Technologies B.V.

Inventor： Yuanqing HE ,  Zhenke WEI ,  Hongtao SHI ,  Xiaoyu SUN ,  Bing GUAN

IPC: C08L67/02

CPC classification number: C08L67/02 ,  C08K3/013 ,  C08L67/00 ,  C08L69/00 ,  C08L79/08 ,  C08L2205/025 ,  C08L2205/03 ,  C08L2205/035 ,  C08L2205/06

Abstract: Disclosed herein are blended thermoplastic compositions and methods relating to the same. In an aspect, a composition can comprise from about 20 wt % to about 90 wt % of a polybutylene terephthalate component; a second component comprising one or more of: from greater than about 0 wt % to about 40 wt % of a polyester component, from greater than about 0 wt % to about 30 wt % of a resorcinol-based aryl polyester component having greater than or equal to 40 mole % of its moieties derived from resorcinol, from greater than about 0 wt % to about 30 wt % of a polyetherimide component, and from greater than about 0 wt % to about 30 wt % of a polycarbonate component; from about 10 wt % to about 60 wt % of a filler component.

Abstract translation: 本文公开了混合的热塑性组合物和与其相关的方法。 在一方面，组合物可以包含约20重量％至约90重量％的聚对苯二甲酸丁二醇酯组分; 第二组分，其包含以下组分中的一种或多种：大于约0重量％至约40重量％的聚酯组分，大于约0重量％至约30重量％的间苯二酚基芳基聚酯组分，其具有大于或 等于其间
苯二酚部分的40摩尔％，聚醚酰亚胺组分大于约0重量％至约30重量％，聚碳酸酯组分大于约0重量％至约30重量％ 约10重量％至约60重量％的填料组分。