公开(公告)号：US20150353349A1

公开(公告)日：2015-12-10

申请号：US14730912

申请日：2015-06-04

Applicant: Robert Bosch GmbH

Inventor： Mirko HATTASS ,  Heiko STAHL ,  Jochen REINMUTH ,  Julian GONSKA ,  Johannes CLASSEN

IPC: B81C1/00 ,  B81B7/00

CPC classification number: B81C1/00269 ,  B81B7/007 ,  B81C3/001 ,  B81C2203/0118 ,  B81C2203/035 ,  B81C2203/054

Abstract: Measures are provided for improving and simplifying metallic bonding processes which enable a reliable initiation of the bonding process and thus contribute to a uniform bonding. The present method provides a further option for using bonding layers. The method in the case of which the two semiconductor elements are bonded to one another via a bond of at least one metallic starting layer and at least one further starting layer provides that the two starting layers are structured in such a way that the layer areas which are assigned to one another have differently sized areal extents. Moreover, the layer thicknesses of the two starting layers should be selected in such a way that the layer areas which are assigned to one another meet the material ratio necessary for the bonding process.

Abstract translation: 提供了用于改进和简化金属接合方法的措施，其能够可靠地引发接合过程，并因此有助于均匀的接合。 本方法提供了使用结合层的另一选择。 在两个半导体元件通过至少一个金属起始层和至少一个另外的起始层的接合而彼此结合的情况下的方法提供了两个起始层的结构， 彼此分配具有不同大小的区域范围。 此外，两个起始层的层厚应该以这样的方式选择，使得彼此分配的层区域满足接合过程所需的材料比例。

公开(公告)号：US20130099382A1

公开(公告)日：2013-04-25

申请号：US13659030

申请日：2012-10-24

Applicant: Robert Bosch GmbH

Inventor： Jochen REINMUTH ,  Yvonne BERGMANN

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L21/76898 ,  B81B2207/096 ,  B81C1/00301 ,  G01L9/0045 ,  G01L9/0054 ,  G01L19/0076 ,  H01L21/7682 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for producing an electrical feedthrough in a substrate includes: forming a first printed conductor on a first side of a substrate which electrically connects a first contact area of the substrate on the first side; forming a second printed conductor on a second side of a substrate which electrically connects a second contact area of the substrate on the second side; forming an annular trench in the substrate, a substrate punch being formed which extends from the first contact area to the second contact area; and selectively depositing an electrically conductive layer on an inner surface of the annular trench, the substrate punch being coated with an electrically conductive layer and remaining electrically insulated from the surrounding substrate due to the annular trench.

Abstract translation: 一种用于在基板中制造电馈通的方法包括：在基板的第一侧上形成第一印刷导体，该第一印刷导体电连接第一侧上的基板的第一接触区域; 在基板的第二侧上形成第二印刷导体，所述第二印刷导体电连接所述第二侧上的所述基板的第二接触区域; 在所述衬底中形成环形沟槽，形成从所述第一接触区域延伸到所述第二接触区域的衬底冲头; 以及在所述环形沟槽的内表面上选择性地沉积导电层，所述衬底冲头涂覆有导电层，并且由于所述环形沟槽而与所述周围衬底保持电绝缘。

公开(公告)号：US20150232327A1

公开(公告)日：2015-08-20

申请号：US14609737

申请日：2015-01-30

Applicant: Robert Bosch GmbH

Inventor： Jochen REINMUTH

IPC: B81B7/00 ,  B81B5/00 ,  B81C1/00

CPC classification number: B81B7/0048 ,  B81B3/0048 ,  B81B3/0054 ,  B81B5/00 ,  B81B7/0006 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/0015 ,  B81C1/0019 ,  B81C1/00198 ,  B81C1/00325 ,  B81C1/00666

Abstract: A sensor includes: a substrate, a microelectromechanical structure, and a decoupling structure. The decoupling structure is anchored on the substrate, and the microelectromechanical structure is anchored on the decoupling structure. The microelectromechanical structure and the decoupling structure are movable in relation to the substrate. The decoupling structure is situated between the microelectromechanical structure and the substrate.

Abstract translation: 传感器包括：基板，微机电结构和解耦结构。 解耦结构锚定在基板上，微机电结构锚定在去耦结构上。 微机电结构和去耦结构可以相对于衬底移动。 解耦结构位于微机电结构和基片之间。

公开(公告)号：US20150123221A1

公开(公告)日：2015-05-07

申请号：US14534903

申请日：2014-11-06

Applicant: Robert Bosch GmbH

Inventor： Jochen REINMUTH ,  Julian GONSKA

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B3/0051 ,  B81C1/00238 ,  B81C1/00285 ,  B81C2203/0792 ,  H01L2924/16235

Abstract: A micromechanical sensor device and a corresponding manufacturing method are described. The micromechanical sensor device includes a CMOS wafer having a front side and a rear side, a rewiring device formed on the front side of the CMOS wafer including a plurality of stacked printed conductor levels and insulation layers, an MEMS wafer having a front side and a rear side, a micromechanical sensor device formed across the front side of the MEMS wafer, a bond connection between the MEMS wafer and the CMOS wafer, a cavern between the MEMS wafer and the CMOS wafer, in which the sensor device is hermetically enclosed, and an exposed getter layer area applied to at least one of the plurality of stacked printed conductor levels and insulation layers.

Abstract translation: 描述了微机械传感器装置和相应的制造方法。 微机械传感器装置包括具有前侧和后侧的CMOS晶片，形成在包括多个堆叠的印刷导体层和绝缘层的CMOS晶片的前侧上的再布线装置，具有前侧和 背面，跨越MEMS晶片的前侧形成的微机械传感器装置，MEMS晶片和CMOS晶片之间的接合连接，MEMS晶片和CMOS晶片之间的密封，传感器装置密封在其中;以及 暴露的吸气剂层区域应用于多个堆叠的印刷导体层和绝缘层中的至少一个。

公开(公告)号：US20150123217A1

公开(公告)日：2015-05-07

申请号：US14530437

申请日：2014-10-31

Applicant: Robert Bosch GmbH

Inventor： Jochen REINMUTH ,  Julian GONSKA

IPC: B81B3/00 ,  G01R33/028 ,  G01P15/00 ,  B81C1/00

CPC classification number: B81B3/00 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00 ,  B81C1/00293 ,  B81C2203/0145 ,  G01P15/00 ,  G01P15/0802 ,  G01R33/0286

Abstract: A method for manufacturing a micromechanical sensor unit, the micromechanical sensor unit including a substrate and a sealing cap, in the first method step the substrate and the sealing cap being configured and joined in such a way that, as a result of bonding the sealing cap and the substrate, a first cavity, which has a first pressure and in which a first sensor element is situated, and a second cavity, which has a second pressure and in which a second sensor element is situated, are manufactured, in a second method step a sealable channel leading into the first cavity being created, in a third method step the first pressure in the first cavity being established via the sealable channel.

Abstract translation: 一种用于制造微机电传感器单元的方法，所述微机械传感器单元包括基板和密封盖，在所述第一方法步骤中，所述基板和所述密封盖被构造和接合，使得由于所述密封盖 并且以第二方法制造具有第一压力并且其中设置有第一传感器元件的基板和具有第二压力并且其中设置有第二传感器元件的第二空腔的第一空腔 步进通向引入第一腔的可密封通道，在第三方法步骤中，通过可密封通道建立第一腔中的第一压力。

公开(公告)号：US20190277717A1

公开(公告)日：2019-09-12

申请号：US16302467

申请日：2017-05-10

Applicant: Robert Bosch GmbH

Inventor： Jochen REINMUTH

IPC: G01L9/00

Abstract: A micromechanical component for a pressure sensor device, including a diaphragm, which separates a reference pressure from an external pressure, at least one first stator electrode, at least one second stator electrode, and a rocker-arm structure, which is tiltable about an axis of rotation and has at least one first actuator electrode and at least one second actuator electrode; the rocker-arm structure being joined to the diaphragm so that when the external pressure and the reference pressure are equal, the rocker-arm structure and its actuator electrodes are present in their starting positions; if the rocker-arm structure and its actuator electrodes are in their starting positions, a first capacitance between the at least one first actuator electrode and the at least one first stator electrode differing from a second capacitance between the at least one second actuator electrode and the at least one second stator electrode.

公开(公告)号：US20150160455A1

公开(公告)日：2015-06-11

申请号：US14565034

申请日：2014-12-09

Applicant: Robert Bosch GmbH

Inventor： Hans ARTMAN ,  Jochen REINMUTH ,  Peter SUDY

IPC: G02B26/08

CPC classification number: G02B26/0841 ,  G02B26/0816

Abstract: A comb drive includes a pivotable mirror element, a first and a second comb electrode, the second comb electrode being movable along an offset direction relative to the first electrode from a minimum into a maximum offset position, the second electrode being connected to the mirror element via a lever arm pivotable about a pivot axis, the first and second comb electrodes being interlockingly engaged so that a first comb tooth of the first electrode and a second comb tooth of the second electrode are situated adjacent to one another along a projection direction extending perpendicularly to the offset direction, the first comb tooth and/or the second comb tooth being configured so that an average distance between the first comb tooth and the second comb tooth along the projection direction extending perpendicularly to the offset direction decreases when moving the second electrode from the minimum into the maximum offset position.

Abstract translation: 梳子驱动器包括可枢转镜元件，第一和第二梳状电极，第二梳状电极可以相对于第一电极的偏移方向从最小偏移位置移动到最大偏移位置，第二电极连接到镜子元件 通过可围绕枢转轴线枢转的杠杆臂，所述第一和第二梳状电极被互锁地接合，使得所述第一电极的第一梳齿和所述第二电极的第二梳齿沿着垂直延伸的突出方向彼此相邻地定位 所述第一梳齿和/或所述第二梳齿构造成使得当沿着所述偏移方向垂直延伸的沿着所述突出方向的所述第一梳齿和所述第二梳齿之间的平均距离减小， 最小进入最大偏移位置。

公开(公告)号：US20190185316A1

公开(公告)日：2019-06-20

申请号：US16309181

申请日：2017-05-17

Applicant: Robert Bosch GmbH

Inventor： Jochen REINMUTH

IPC: B81B3/00 ,  G01L9/00

CPC classification number: B81B3/0043 ,  B81B3/0021 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0154 ,  B81B2203/04 ,  G01L9/0072

Abstract: A micromechanical component for a pressure sensor device, including a diaphragm that is stretched on a substrate and that is warpable via a pressure difference between a first side of the substrate and a second side of the substrate, and a rocker structure that is connected to the diaphragm in such a way that the rocker structure is movable about a first rotational axis via warping of the diaphragm. The rocker structure is connected to the diaphragm via a lever structure in such a way that the warping of the diaphragm triggers a rotational movement of the lever structure about a second rotational axis oriented in parallel to the first rotational axis and spaced apart from same, and the rotational movement of the lever structure about the second rotational axis triggers a further rotational movement of the rocker structure about the first rotational axis.

公开(公告)号：US20150360937A1

公开(公告)日：2015-12-17

申请号：US14734791

申请日：2015-06-09

Applicant: Robert Bosch GmbH

Inventor： Jochen REINMUTH ,  Johannes Classen

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0038 ,  B81B7/007 ,  B81B2201/025 ,  B81B2207/092

Abstract: A micromechanical component includes a sensor chip and a cap chip connected to the sensor chip. A cavity is formed between the sensor chip and the cap chip. The sensor chip has a movable element situated in the cavity. The cap chip has a wiring level containing an electrically conductive electrode. The cap chip has a getter element situated in the cavity.

Abstract translation: 微机械部件包括连接到传感器芯片的传感器芯片和盖芯片。 在传感器芯片和盖芯片之间形成腔体。 传感器芯片具有位于空腔中的可移动元件。 盖芯片具有包含导电电极的布线层。 盖芯片具有位于空腔中的吸气元件。

公开(公告)号：US20150353345A1

公开(公告)日：2015-12-10

申请号：US14731695

申请日：2015-06-05

Applicant: Robert Bosch GmbH

Inventor： Friedjof HEUCK ,  Ralf REICHENBACH ,  Daniel Christoph MEISEL ,  Lars TEBJE ,  Mirko HATTASS ,  Jochen REINMUTH ,  Torsten KRAMER ,  Johannes CLASSEN ,  Reinhard NEUL ,  Antoine PUYGRANIER

IPC: B81B7/00

CPC classification number: B81B7/0016 ,  B81B7/0054 ,  B81B2207/017 ,  B81C2203/0785 ,  H01L2224/16225 ,  H01L2224/73253

Abstract: Method for on-chip stress decoupling to reduce stresses in a vertical hybrid integrated component including MEMS and ASIC elements and to mechanical decoupling of the MEMS structure. The MEMS/ASIC elements are mounted above each other via at least one connection layer and form a chip stack. On the assembly side, at least one connection area is formed for the second level assembly and for external electrical contacting of the component on a component support. At least one flexible stress decoupling structure is formed in one element surface between the assembly side and the MEMS layered structure including the stress-sensitive MEMS structure, in at least one connection area to the adjacent element component of the chip stack or to the component support, the stress decoupling structure being configured so that the connection material does not penetrate into the stress decoupling structure and flexibility of the stress decoupling structure is ensured.

Abstract translation: 用于片上应力去耦的方法，以减少包括MEMS和ASIC元件在内的垂直混合集成组件中的应力以及MEMS结构的机械解耦。 MEMS / ASIC元件经由至少一个连接层彼此上方安装并形成芯片堆叠。 在组装侧上，形成用于第二级组件的至少一个连接区域以及用于部件支撑件上的部件的外部电接触。 至少一个柔性应力解耦结构形成在组件侧和MEMS分层结构之间的一个元件表面中，包括应力敏感MEMS结构，至少与芯片堆叠的相邻元件部件的连接区域或组件支撑件 应力解耦结构被构造成使得连接材料不会渗透到应力解耦结构中，并且确保了应力解耦结构的柔性。