METHOD FOR PRODUCING AN ELECTRICAL FEEDTHROUGH IN A SUBSTRATE, AND A SUBSTRATE HAVING AN ELECTRICAL FEEDTHROUGH
    2.
    发明申请
    METHOD FOR PRODUCING AN ELECTRICAL FEEDTHROUGH IN A SUBSTRATE, AND A SUBSTRATE HAVING AN ELECTRICAL FEEDTHROUGH 有权
    用于在基板中生产电气的方法,以及具有电力供应的基板

    公开(公告)号:US20130099382A1

    公开(公告)日:2013-04-25

    申请号:US13659030

    申请日:2012-10-24

    Abstract: A method for producing an electrical feedthrough in a substrate includes: forming a first printed conductor on a first side of a substrate which electrically connects a first contact area of the substrate on the first side; forming a second printed conductor on a second side of a substrate which electrically connects a second contact area of the substrate on the second side; forming an annular trench in the substrate, a substrate punch being formed which extends from the first contact area to the second contact area; and selectively depositing an electrically conductive layer on an inner surface of the annular trench, the substrate punch being coated with an electrically conductive layer and remaining electrically insulated from the surrounding substrate due to the annular trench.

    Abstract translation: 一种用于在基板中制造电馈通的方法包括:在基板的第一侧上形成第一印刷导体,该第一印刷导体电连接第一侧上的基板的第一接触区域; 在基板的第二侧上形成第二印刷导体,所述第二印刷导体电连接所述第二侧上的所述基板的第二接触区域; 在所述衬底中形成环形沟槽,形成从所述第一接触区域延伸到所述第二接触区域的衬底冲头; 以及在所述环形沟槽的内表面上选择性地沉积导电层,所述衬底冲头涂覆有导电层,并且由于所述环形沟槽而与所述周围衬底保持电绝缘。

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