公开(公告)号：US20100255658A1

公开(公告)日：2010-10-07

申请号：US12420010

申请日：2009-04-07

Applicant: Ravinder Aggarwal ,  Rand Conner ,  John Disanto ,  James A. Alexander

Inventor： Ravinder Aggarwal ,  Rand Conner ,  John Disanto ,  James A. Alexander

IPC: H01L21/20 ,  C23C16/455

CPC classification number: C23C16/45574 ,  C23C16/04 ,  C23C16/45504 ,  C23C16/45563

Abstract: Methods and apparatuses for separately injecting gases into a reactor for a substrate processing system. The flow profiles of the gases are controlled with two or more sets of adjustable gas flow injectors. The methods are particularly useful for selective deposition of gases in a CVD system using volatile combinations of precursors and etchants. In either case, the gases are provided along separate flow paths that intersect in a relatively open reaction space, rather than in more confined upstream locations.

Abstract translation: 将气体分别注入用于基板处理系统的反应器的方法和装置。 气体的流量分布由两组或多组可调气流注入器控制。 该方法对于使用前体和蚀刻剂的易失性组合在CVD系统中选择性沉积气体特别有用。 在任一情况下，气体沿着在相对开放的反应空间中相交的分开的流动路径而不是在更限制的上游位置中提供。

公开(公告)号：US08486191B2

公开(公告)日：2013-07-16

申请号：US12420010

申请日：2009-04-07

Applicant: Ravinder Aggarwal ,  Rand Conner ,  John Disanto ,  James A. Alexander

Inventor： Ravinder Aggarwal ,  Rand Conner ,  John Disanto ,  James A. Alexander

IPC: C23C16/455 ,  C23C16/52 ,  C23F1/00 ,  H01L21/306 ,  C23C16/06 ,  C23C16/22

CPC classification number: C23C16/45574 ,  C23C16/04 ,  C23C16/45504 ,  C23C16/45563

Abstract: Methods and apparatuses for separately injecting gases into a reactor for a substrate processing system. The flow profiles of the gases are controlled with two or more sets of adjustable gas flow injectors. The methods are particularly useful for selective deposition of gases in a CVD system using volatile combinations of precursors and etchants. In either case, the gases are provided along separate flow paths that intersect in a relatively open reaction space, rather than in more confined upstream locations.

Abstract translation: 将气体分别注入用于基板处理系统的反应器的方法和装置。 气体的流量分布由两组或多组可调气流注入器控制。 该方法对于使用前体和蚀刻剂的易失性组合在CVD系统中选择性沉积气体特别有用。 在任一情况下，气体沿着在相对开放的反应空间中相交的分开的流动路径而不是在更限制的上游位置中提供。

公开(公告)号：US20100284438A1

公开(公告)日：2010-11-11

申请号：US12436315

申请日：2009-05-06

Applicant: Ravinder Aggarwal ,  Rand Conner

Inventor： Ravinder Aggarwal ,  Rand Conner

IPC: G01K7/02

CPC classification number: H01L21/67248 ,  C23C16/4586 ,  G01K1/14 ,  G01K7/02

Abstract: A thermocouple having at least one inner alignment feature or at least one outer alignment feature, or a combination thereof for positively positioning and aligning at least one thermocouple junction within a bore formed in a susceptor ring of a semiconductor substrate processing reactor. The outer alignment feature is configured to positively align the junction(s) longitudinally within the bore. The inner alignment feature configured to positively position the junction(s) rotationally within the sheath of the thermocouple relative to the bore.

Abstract translation: 具有至少一个内部对准特征或至少一个外部对准特征或其组合的热电偶用于在半导体衬底处理反应器的基座环内形成的孔内积极地定位和对准至少一个热电偶结。 外部对准特征构造成在孔内纵向对准接头。 所述内部对准特征构造成相对于所述孔将所述接合部在所述热电偶的护套内旋转地定位。

公开(公告)号：US08262287B2

公开(公告)日：2012-09-11

申请号：US12330096

申请日：2008-12-08

Applicant: Buz Darabnia ,  Andy Yednak ,  Mike Halpin ,  Loren Jacobs ,  Ravinder Aggarwal

Inventor： Buz Darabnia ,  Andy Yednak ,  Mike Halpin ,  Loren Jacobs ,  Ravinder Aggarwal

IPC: G05D23/00 ,  G01K7/02

CPC classification number: G01K7/04 ,  C23C16/46 ,  G01K13/00

Abstract: A thermocouple for use in a semiconductor processing reaction is described. The thermocouple includes a sheath having a measuring tip and an opening at the opposing end. A support member that receives a portion of a first wire and a second wire is received within the sheath. The first and second wires form a junction that contacts the inner surface of the sheath at the measuring tip. A spacing member is secured at the opening of the sheath and receives the support member. The spacing member allows the support member, first wire, and second wire to freely thermally expand relative to each other without introducing compression or tension stresses therein.

Abstract translation: 描述了用于半导体加工反应的热电偶。 热电偶包括具有测量尖端和在相对端的开口的护套。 接收第一线和第二线的一部分的支撑构件被容纳在护套内。 第一和第二线形成在测量尖端处接触鞘的内表面的接合点。 间隔构件固定在护套的开口处并接收支撑构件。 间隔构件允许支撑构件，第一线和第二线自由地相对于彼此热膨胀而不在其中引入压缩或拉伸应力。

公开(公告)号：US20120031340A1

公开(公告)日：2012-02-09

申请号：US13276515

申请日：2011-10-19

Applicant: Ravinder Aggarwal ,  Jeroen Stoutjesdijk

Inventor： Ravinder Aggarwal ,  Jeroen Stoutjesdijk

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/52 ,  B01J19/00

CPC classification number: C23C16/4412 ,  C23C16/455 ,  C23C16/45502 ,  C23C16/45504 ,  C23C16/45563 ,  C23C16/458 ,  C23C16/4582 ,  C23C16/4583 ,  C23C16/4584

Abstract: A reaction apparatus for a semiconductor fabrication apparatus, wherein the reaction apparatus includes at least two adjustable outlet ports for withdrawing reactant gases from the reaction chamber. Adjustment of the flow rate through each of the outlet ports selectively modifies the flow pattern of the reactant gases within the reaction chamber to maintain a desired flow pattern therewithin, such as a substantially uniform flow over the surface of a substrate being processed, and/or minimization of turbulence within the reactor.

Abstract translation: 一种用于半导体制造装置的反应装置，其中反应装置包括至少两个可调节的出口，用于从反应室中抽出反应气体。 通过每个出口端口的流量的调节选择性地修改反应室内的反应气体的流动模式，以在其中维持所需的流动模式，例如在正被处理的基底的表面上的基本均匀的流动，和/或 反应器内湍流的最小化。

公开(公告)号：US08088225B2

公开(公告)日：2012-01-03

申请号：US12641712

申请日：2009-12-18

Applicant: Matt G. Goodman ,  Jereon Stoutyesdijk ,  Ravinder Aggarwal ,  Mike Halpin ,  Tony Keeton ,  Mark Hawkins ,  Lee Haen ,  Armand Ferro ,  Paul Brabant ,  Robert Vyne ,  Gregory M. Bartlett ,  Joseph P. Italiano ,  Bob Haro

Inventor： Matt G. Goodman ,  Jereon Stoutyesdijk ,  Ravinder Aggarwal ,  Mike Halpin ,  Tony Keeton ,  Mark Hawkins ,  Lee Haen ,  Armand Ferro ,  Paul Brabant ,  Robert Vyne ,  Gregory M. Bartlett ,  Joseph P. Italiano ,  Bob Haro

IPC: C23C16/458 ,  C23C16/00 ,  H01L21/306

CPC classification number: H01L21/68735 ,  H01J37/32871 ,  H01L21/67028

Abstract: A substrate support system comprises a substrate holder having a plurality of passages extending between top and bottom surfaces thereof. The substrate holder supports a peripheral portion of the substrate backside so that a thin gap is formed between the substrate and the substrate holder. A hollow support member provides support to an underside of, and is configured to convey gas upward into one or more of the passages of, the substrate holder. The upwardly conveyed gas flows into the gap between the substrate and the substrate holder. Depending upon the embodiment, the gas then flows either outward and upward around the substrate edge (to inhibit backside deposition of reactant gases above the substrate) or downward through passages of the substrate holder, if any, that do not lead back into the hollow support member (to inhibit autodoping by sweeping out-diffused dopant atoms away from the substrate backside).

Abstract translation: 衬底支撑系统包括具有在其顶表面和底表面之间延伸的多个通道的衬底保持器。 衬底保持器支撑衬底背面的周边部分，使得在衬底和衬底保持器之间形成薄的间隙。 中空的支撑构件为衬底的下侧提供支撑，并且构造成将气体向上输送到衬底保持器的一个或多个通道中。 向上输送的气体流入基板和基板支架之间的间隙。 根据实施例，气体然后围绕衬底边缘向外和向上流动（以阻止反应物气体在衬底上方的背面沉积）或向下穿过衬底保持器的通道（如果有的话），其不会引回到中空支撑件 （通过从扩散的掺杂​​剂原子远离衬底背面来抑制自掺杂）。

公开(公告)号：US20070209593A1

公开(公告)日：2007-09-13

申请号：US11369773

申请日：2006-03-07

Applicant: Ravinder Aggarwal ,  Jim Kusbel

Inventor： Ravinder Aggarwal ,  Jim Kusbel

IPC: H01L21/677 ,  C23C16/00

CPC classification number: C23C16/54 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/68707

Abstract: This invention relates to an apparatus and a method for cooling a semiconductor wafer while it is being transferred from one station to another. More particularly, the invention relates to an active cooling system in the end effecter of a robot used for moving a semiconductor wafer from one process station to another.

Abstract translation: 本发明涉及一种半导体晶片在从一个工位转移到另一个工位时进行冷却的装置和方法。 更具体地，本发明涉及用于将半导体晶片从一个处理站移动到另一个处理站的机器人的末端执行器中的主动冷却系统。

公开(公告)号：US20060154385A1

公开(公告)日：2006-07-13

申请号：US11031479

申请日：2005-01-07

Applicant: Ravinder Aggarwal

Inventor： Ravinder Aggarwal

IPC: H01L21/66

CPC classification number: H01L21/67253 ,  H01L21/67167 ,  H01L21/67724 ,  H01L21/67775 ,  H01L22/20

Abstract: An in-line, non-freestanding substrate measurement system is integrated into the substrate fabrication pathway. One embodiment includes a metrology device integrated into a guided vehicle. Another embodiment provides a system for simultaneously measuring both sides of a substrate. A metrology device may be integrated into the front handling chamber of a process tool. Other embodiments provide methods for the measurement of substrates using pathway integrated metrology devices.

Abstract translation: 在衬底制造途径中集成了一种在线非独立式衬底测量系统。 一个实施例包括集成到引导车辆中的计量装置。 另一实施例提供一种用于同时测量衬底的两侧的系统。 计量装置可以集成到处理工具的前处理室中。 其他实施例提供了使用路径集成测量装置来测量衬底的方法。

公开(公告)号：US20060045663A1

公开(公告)日：2006-03-02

申请号：US10912299

申请日：2004-08-05

Applicant: Ravinder Aggarwal ,  James Kusbel

Inventor： Ravinder Aggarwal ,  James Kusbel

IPC: H01L21/677

CPC classification number: H01L21/67772 ,  H01L21/67775

Abstract: A load port comprises a platform for receiving a FOUP. The platform includes features for manually removing a FOUP door. The platform also includes features for placing the FOUP in operative relation to a wafer transfer robot configured to transfer wafers between first and second containers.

Abstract translation: 负载端口包括用于接收FOUP的平台。 该平台包括手动取出FOUP门的功能。 平台还包括用于将FOUP放置在操作关系中的功能，该晶片传送机器人被配置为在第一和第二容器之间传送晶片。

公开(公告)号：US20050184270A1

公开(公告)日：2005-08-25

申请号：US11112166

申请日：2005-04-22

Applicant: Ravinder Aggarwal ,  Jim Kusbel ,  Jerry Davis

Inventor： Ravinder Aggarwal ,  Jim Kusbel ,  Jerry Davis

IPC: F16K3/02 ,  F16K51/00 ,  F16K3/00

CPC classification number: F16K51/00 ,  F16K3/0209

Abstract: A slit valve for a semiconductor processing apparatus, for fluidly sealing a passage connecting two chambers of the apparatus, such as a substrate reaction chamber and a region outside the reaction chamber. The slit valve comprises an actuator plate movable within a slot in one wall of the passage, the actuator plate and the slot oriented generally transverse to the passage. The actuator plate has a first position in which the valve is open, permitting the transfer of a substrate through the passage. The actuator plate also has a second position in which the valve is closed, and in which the actuator plate fluidly seals the passage such that fluid cannot flow through the passage across the actuator plate. A protective cover is configured to prevent debris within the passage (e.g., broken wafers, shards, particulate contaminants, etc.) from flowing into the slot when the actuator plate occupies its second position. In one embodiment, the cover is pivotably secured to the first wall of the passage, proximate the slot. In another embodiment, the cover is secured to the actuator plate, proximate an end thereof. In a preferred embodiment, the cover comprises a plate.