公开(公告)号：US08486191B2

公开(公告)日：2013-07-16

申请号：US12420010

申请日：2009-04-07

Applicant: Ravinder Aggarwal ,  Rand Conner ,  John Disanto ,  James A. Alexander

Inventor： Ravinder Aggarwal ,  Rand Conner ,  John Disanto ,  James A. Alexander

IPC: C23C16/455 ,  C23C16/52 ,  C23F1/00 ,  H01L21/306 ,  C23C16/06 ,  C23C16/22

CPC classification number: C23C16/45574 ,  C23C16/04 ,  C23C16/45504 ,  C23C16/45563

Abstract: Methods and apparatuses for separately injecting gases into a reactor for a substrate processing system. The flow profiles of the gases are controlled with two or more sets of adjustable gas flow injectors. The methods are particularly useful for selective deposition of gases in a CVD system using volatile combinations of precursors and etchants. In either case, the gases are provided along separate flow paths that intersect in a relatively open reaction space, rather than in more confined upstream locations.

Abstract translation: 将气体分别注入用于基板处理系统的反应器的方法和装置。 气体的流量分布由两组或多组可调气流注入器控制。 该方法对于使用前体和蚀刻剂的易失性组合在CVD系统中选择性沉积气体特别有用。 在任一情况下，气体沿着在相对开放的反应空间中相交的分开的流动路径而不是在更限制的上游位置中提供。

公开(公告)号：US20100284438A1

公开(公告)日：2010-11-11

申请号：US12436315

申请日：2009-05-06

Applicant: Ravinder Aggarwal ,  Rand Conner

Inventor： Ravinder Aggarwal ,  Rand Conner

IPC: G01K7/02

CPC classification number: H01L21/67248 ,  C23C16/4586 ,  G01K1/14 ,  G01K7/02

Abstract: A thermocouple having at least one inner alignment feature or at least one outer alignment feature, or a combination thereof for positively positioning and aligning at least one thermocouple junction within a bore formed in a susceptor ring of a semiconductor substrate processing reactor. The outer alignment feature is configured to positively align the junction(s) longitudinally within the bore. The inner alignment feature configured to positively position the junction(s) rotationally within the sheath of the thermocouple relative to the bore.

Abstract translation: 具有至少一个内部对准特征或至少一个外部对准特征或其组合的热电偶用于在半导体衬底处理反应器的基座环内形成的孔内积极地定位和对准至少一个热电偶结。 外部对准特征构造成在孔内纵向对准接头。 所述内部对准特征构造成相对于所述孔将所述接合部在所述热电偶的护套内旋转地定位。

公开(公告)号：US09297705B2

公开(公告)日：2016-03-29

申请号：US12436306

申请日：2009-05-06

Applicant: Ravinder K. Aggarwal ,  Rand Conner

Inventor： Ravinder K. Aggarwal ,  Rand Conner

IPC: G01K1/14 ,  G01K7/02 ,  G01K1/02 ,  G05D23/19 ,  G05D23/22

CPC classification number: G01K7/02 ,  G01K1/02 ,  G05D23/1931 ,  G05D23/22

Abstract: A temperature measuring device having a smart chip, or electronic circuit, integrated therein is provided. The smart chip, or electronic circuit, includes at least a unique identification number or data specific to the particular temperature measuring device stored thereon. The electronic circuit further includes calibration data of the temperature measuring device stored thereon. A module controller of a temperature control system is configured to verify the unique identification number of the thermocouple assembly prior to allowing data to be transferred between the temperature measuring device and a temperature controller. A graphical user interface allows an operator to enter the unique identification number or data to verify the temperature measuring device and display an error message if the number or data entered is not equivalent, or does not match, the unique identification number or data stored on the electronic circuit.

Abstract translation: 提供一种具有集成在其中的智能芯片或电子电路的温度测量装置。 智能芯片或电子电路至少包括唯一的识别号或特定于其上存储的特定温度测量装置的数据。 电子电路还包括存储在其上的温度测量装置的校准数据。 温度控制系统的模块控制器被配置为在允许在温度测量装置和温度控制器之间传送数据之前验证热电偶组件的唯一标识号。 图形用户界面允许操作员输入唯一的识别号码或数据来验证温度测量设备，并且如果所输入的数字或数据不等同于或不匹配存储在该存储器上的唯一标识号或数据，则显示错误消息 电子电路。

公开(公告)号：US20060003671A1

公开(公告)日：2006-01-05

申请号：US10884371

申请日：2004-07-02

Applicant: John Stumpf ,  Franklin Root ,  Brian Severson ,  David Marquardt ,  John Herb ,  James Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Stowell ,  Edmund Minshall ,  Timothy Cleary

Inventor： John Stumpf ,  Franklin Root ,  Brian Severson ,  David Marquardt ,  John Herb ,  James Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Stowell ,  Edmund Minshall ,  Timothy Cleary

IPC: B24B49/00

CPC classification number: B24B37/345

Abstract: Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

Abstract translation: 提供了用于工件表面的化学机械平坦化（CMP）的方法和装置。 根据本发明的一个实施例，该装置包括多个CMP系统，用于将未处理的工件装载到多个CMP系统中并从其卸载加工的工件的多个装载杯;多个用于清洁加工件的清洁站 从CMP系统卸载的单个机器人和被配置为将未处理的工件传送到多个装载杯并将加工的工件从加载杯传送到多个清洁站的单个机器人。

公开(公告)号：US20100255658A1

公开(公告)日：2010-10-07

申请号：US12420010

申请日：2009-04-07

Applicant: Ravinder Aggarwal ,  Rand Conner ,  John Disanto ,  James A. Alexander

Inventor： Ravinder Aggarwal ,  Rand Conner ,  John Disanto ,  James A. Alexander

IPC: H01L21/20 ,  C23C16/455

CPC classification number: C23C16/45574 ,  C23C16/04 ,  C23C16/45504 ,  C23C16/45563

Abstract: Methods and apparatuses for separately injecting gases into a reactor for a substrate processing system. The flow profiles of the gases are controlled with two or more sets of adjustable gas flow injectors. The methods are particularly useful for selective deposition of gases in a CVD system using volatile combinations of precursors and etchants. In either case, the gases are provided along separate flow paths that intersect in a relatively open reaction space, rather than in more confined upstream locations.

Abstract translation: 将气体分别注入用于基板处理系统的反应器的方法和装置。 气体的流量分布由两组或多组可调气流注入器控制。 该方法对于使用前体和蚀刻剂的易失性组合在CVD系统中选择性沉积气体特别有用。 在任一情况下，气体沿着在相对开放的反应空间中相交的分开的流动路径而不是在更限制的上游位置中提供。

公开(公告)号：US20100286842A1

公开(公告)日：2010-11-11

申请号：US12436306

申请日：2009-05-06

Applicant: Ravinder K. Aggarwal ,  Rand Conner

Inventor： Ravinder K. Aggarwal ,  Rand Conner

IPC: G05D23/19 ,  G01K7/02 ,  G06F11/07 ,  G06F12/00

CPC classification number: G01K7/02 ,  G01K1/02 ,  G05D23/1931 ,  G05D23/22

Abstract: A temperature measuring device having a smart chip, or electronic circuit, integrated therein is provided. The smart chip, or electronic circuit, includes at least a unique identification number or data specific to the particular temperature measuring device stored thereon. The electronic circuit further includes calibration data of the temperature measuring device stored thereon. A module controller of a temperature control system is configured to verify the unique identification number of the thermocouple assembly prior to allowing data to be transferred between the temperature measuring device and a temperature controller. A graphical user interface allows an operator to enter the unique identification number or data to verify the temperature measuring device and display an error message if the number or data entered is not equivalent, or does not match, the unique identification number or data stored on the electronic circuit.

Abstract translation: 提供一种具有集成在其中的智能芯片或电子电路的温度测量装置。 智能芯片或电子电路至少包括唯一的识别号或特定于其上存储的特定温度测量装置的数据。 电子电路还包括存储在其上的温度测量装置的校准数据。 温度控制系统的模块控制器被配置为在允许在温度测量装置和温度控制器之间传送数据之前验证热电偶组件的唯一标识号。 图形用户界面允许操作员输入唯一的识别号码或数据来验证温度测量设备，并且如果所输入的数字或数据不等同于或不匹配存储在该存储器上的唯一标识号或数据，则显示错误消息 电子电路。

公开(公告)号：US08100583B2

公开(公告)日：2012-01-24

申请号：US12436315

申请日：2009-05-06

Applicant: Rand Conner ,  Ravinder K. Aggarwal

Inventor： Rand Conner ,  Ravinder K. Aggarwal

IPC: G01K7/02 ,  G01K1/00 ,  H01L35/02

CPC classification number: H01L21/67248 ,  C23C16/4586 ,  G01K1/14 ,  G01K7/02

Abstract: A thermocouple having at least one inner alignment feature or at least one outer alignment feature, or a combination thereof for positively positioning and aligning at least one thermocouple junction within a bore formed in a susceptor ring of a semiconductor substrate processing reactor. The outer alignment feature is configured to positively align the junction(s) longitudinally within the bore. The inner alignment feature configured to positively position the junction(s) rotationally within the sheath of the thermocouple relative to the bore.

Abstract translation: 具有至少一个内部对准特征或至少一个外部对准特征或其组合的热电偶用于在半导体衬底处理反应器的基座环内形成的孔内积极地定位和对准至少一个热电偶结。 外部对准特征构造成在孔内纵向对准接头。 所述内部对准特征构造成相对于所述孔将所述接合部在所述热电偶的护套内旋转地定位。

公开(公告)号：US07229339B2

公开(公告)日：2007-06-12

申请号：US10884371

申请日：2004-07-02

Applicant: John F. Stumpf ,  Franklin D. Root ,  Brian Severson ,  David Marquardt ,  John Derwood Herb ,  James Jed Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Marshall Stowell ,  Edmund Minshall ,  Timothy Cleary

Inventor： John F. Stumpf ,  Franklin D. Root ,  Brian Severson ,  David Marquardt ,  John Derwood Herb ,  James Jed Crawford ,  Rand Conner ,  Jasent Montano ,  Kevin Bertsch ,  Robert Marshall Stowell ,  Edmund Minshall ,  Timothy Cleary

IPC: B24B5/00

CPC classification number: B24B37/345

Abstract: Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.

Abstract translation: 提供了用于工件表面的化学机械平坦化（CMP）的方法和装置。 根据本发明的一个实施例，该装置包括多个CMP系统，用于将未处理的工件装载到多个CMP系统中并从其卸载加工的工件的多个装载杯;多个用于清洁加工件的清洁站 从CMP系统卸载的单个机器人和被配置为将未处理的工件传送到多个装载杯并将加工的工件从加载杯传送到多个清洁站的单个机器人。