公开(公告)号：US09297705B2

公开(公告)日：2016-03-29

申请号：US12436306

申请日：2009-05-06

Applicant: Ravinder K. Aggarwal ,  Rand Conner

Inventor： Ravinder K. Aggarwal ,  Rand Conner

IPC: G01K1/14 ,  G01K7/02 ,  G01K1/02 ,  G05D23/19 ,  G05D23/22

CPC classification number: G01K7/02 ,  G01K1/02 ,  G05D23/1931 ,  G05D23/22

Abstract: A temperature measuring device having a smart chip, or electronic circuit, integrated therein is provided. The smart chip, or electronic circuit, includes at least a unique identification number or data specific to the particular temperature measuring device stored thereon. The electronic circuit further includes calibration data of the temperature measuring device stored thereon. A module controller of a temperature control system is configured to verify the unique identification number of the thermocouple assembly prior to allowing data to be transferred between the temperature measuring device and a temperature controller. A graphical user interface allows an operator to enter the unique identification number or data to verify the temperature measuring device and display an error message if the number or data entered is not equivalent, or does not match, the unique identification number or data stored on the electronic circuit.

Abstract translation: 提供一种具有集成在其中的智能芯片或电子电路的温度测量装置。 智能芯片或电子电路至少包括唯一的识别号或特定于其上存储的特定温度测量装置的数据。 电子电路还包括存储在其上的温度测量装置的校准数据。 温度控制系统的模块控制器被配置为在允许在温度测量装置和温度控制器之间传送数据之前验证热电偶组件的唯一标识号。 图形用户界面允许操作员输入唯一的识别号码或数据来验证温度测量设备，并且如果所输入的数字或数据不等同于或不匹配存储在该存储器上的唯一标识号或数据，则显示错误消息 电子电路。

公开(公告)号：US20100282163A1

公开(公告)日：2010-11-11

申请号：US12436300

申请日：2009-05-06

Applicant: Ravinder K. Aggarwal ,  Robert C. Haro

Inventor： Ravinder K. Aggarwal ,  Robert C. Haro

IPC: C23C16/00 ,  G01K7/02

CPC classification number: G01K7/02 ,  G01K7/04

Abstract: An improved thermocouple assembly for providing a temperature measurement is provided. The thermocouple assembly includes a sheath having a measuring tip, a support member received within the sheath, and first and second wires disposed within the support member. An end of each of the first and second wires are fused together to form a thermocouple junction therebetween. A recessed region is formed in a distal end of the support member, and the thermocouple junction is fixedly located at the base of the recessed region such that the recessed region maintains the thermocouple junction in a substantially fixed position relative to the measuring tip of the sheath.

Abstract translation: 提供了一种用于提供温度测量的改进的热电偶组件。 热电偶组件包括具有测量尖端的壳体，容纳在护套内的支撑构件以及设置在支撑构件内的第一和第二导线。 第一和第二线中的每一个的端部熔合在一起以在它们之间形成热电偶连接。 凹槽区域形成在支撑构件的远端，并且热电偶接头固定地位于凹陷区域的底部，使得凹陷区域将热电偶接头保持在相对于护套的测量尖端的基本上固定的位置 。

公开(公告)号：US5091217A

公开(公告)日：1992-02-25

申请号：US587737

申请日：1990-09-25

Applicant: H. Peter W. Hey ,  William A. Mazak ,  Ravinder K. Aggarwal ,  John H. Curtin ,  Paul B. Brown ,  Joe R. Smith

Inventor： H. Peter W. Hey ,  William A. Mazak ,  Ravinder K. Aggarwal ,  John H. Curtin ,  Paul B. Brown ,  Joe R. Smith

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/54 ,  H01L21/00

CPC classification number: C23C16/45565 ,  C23C16/455 ,  C23C16/54 ,  H01L21/67103 ,  H01L21/67109

Abstract: Each of a plurality of individually heated circularly located susceptors supports and heats one of a plurality of wafers within a processing chamber. An overhead gas dispersion head, vertically aligned with each susceptor, directs, in combination with downstream flow control structure, flow of a reactant gas radially uniformly across the supported wafer. A spider sequentially relocates each of the wafers, as a group, to an adjacent susceptor. Wafer handling apparatus replaces each processed wafer to provide a high production rate throughput. A source of RF energy radiating essentially primarily between each gas dispersion head and its associated susceptor provides a plasma enhanced environment and the low level intensity elsewhere within the reactor reduces residual deposits.

Abstract translation: 多个单独加热的圆形位置的基座中的每一个支撑并加热处理室内的多个晶片中的一个。 与每个基座垂直对准的顶部气体分散头与下游流动控制结构一起引导反应气体径向均匀地流过所支撑的晶片。 一个蜘蛛按顺序将每个晶片作为一组重新定位到相邻的基座。 晶片处理装置取代了每个经处理的晶片以提供高生产率的生产率。 基本上主要在每个气体分散头与其相关联的基座之间辐射的RF能量源提供等离子体增强的环境，并且在反应器内其他地方的低水平强度减少了残余沉积物。

公开(公告)号：US08382370B2

公开(公告)日：2013-02-26

申请号：US12436300

申请日：2009-05-06

Applicant: Ravinder K. Aggarwal ,  Robert C. Haro

Inventor： Ravinder K. Aggarwal ,  Robert C. Haro

IPC: G01K7/02 ,  G01K1/14 ,  H01L35/04

CPC classification number: G01K7/02 ,  G01K7/04

Abstract: An improved thermocouple assembly for providing a temperature measurement is provided. The thermocouple assembly includes a sheath having a measuring tip, a support member received within the sheath, and first and second wires disposed within the support member. An end of each of the first and second wires are fused together to form a thermocouple junction therebetween. A recessed region is formed in a distal end of the support member, and the thermocouple junction is fixedly located at the base of the recessed region such that the recessed region maintains the thermocouple junction in a substantially fixed position relative to the measuring tip of the sheath.

Abstract translation: 提供了一种用于提供温度测量的改进的热电偶组件。 热电偶组件包括具有测量尖端的壳体，容纳在护套内的支撑构件以及设置在支撑构件内的第一和第二导线。 第一和第二线中的每一个的端部熔合在一起以在它们之间形成热电偶连接。 凹槽区域形成在支撑构件的远端，并且热电偶接头固定地位于凹陷区域的底部，使得凹陷区域将热电偶接头保持在相对于护套的测量尖端的基本上固定的位置 。

公开(公告)号：US08100583B2

公开(公告)日：2012-01-24

申请号：US12436315

申请日：2009-05-06

Applicant: Rand Conner ,  Ravinder K. Aggarwal

Inventor： Rand Conner ,  Ravinder K. Aggarwal

IPC: G01K7/02 ,  G01K1/00 ,  H01L35/02

CPC classification number: H01L21/67248 ,  C23C16/4586 ,  G01K1/14 ,  G01K7/02

Abstract: A thermocouple having at least one inner alignment feature or at least one outer alignment feature, or a combination thereof for positively positioning and aligning at least one thermocouple junction within a bore formed in a susceptor ring of a semiconductor substrate processing reactor. The outer alignment feature is configured to positively align the junction(s) longitudinally within the bore. The inner alignment feature configured to positively position the junction(s) rotationally within the sheath of the thermocouple relative to the bore.

Abstract translation: 具有至少一个内部对准特征或至少一个外部对准特征或其组合的热电偶用于在半导体衬底处理反应器的基座环内形成的孔内积极地定位和对准至少一个热电偶结。 外部对准特征构造成在孔内纵向对准接头。 所述内部对准特征构造成相对于所述孔将所述接合部在所述热电偶的护套内旋转地定位。

公开(公告)号：US06592318B2

公开(公告)日：2003-07-15

申请号：US09905578

申请日：2001-07-13

Applicant: Ravinder K. Aggarwal

Inventor： Ravinder K. Aggarwal

IPC: B65G4907

CPC classification number: H01L21/67775 ,  Y10S414/139 ,  Y10S414/14

Abstract: An integrated wafer transport and transfer device is disclosed, which includes a vehicle with an integrated docking platform for holding a wafer carrier such as a FOUP (front opening unified pod). The docking platform is positioned at the correct height for sealing the FOUP to the load lock of a process tool. Vertical and/or horizontal movement is required in some cases. Methods for delivering wafers to process tools are also described. In a preferred embodiment, wafers are carried inside a FOUP on a cart, such as an automatically guided vehicle or a personally guided vehicle. The cart is docked at a process tool and the FOUP is sealed to the load lock of the tool without removing the FOUP from the cart. After processing on one tool, the cart along with the FOUP can be moved to the next process tool for further processing. The FOUP can stay on the same cart until all processing is completed. This is especially useful for moving priority lots through the fabrication facility quickly.

Abstract translation: 公开了一种集成的晶片传送和传送装置，其包括具有用于保持诸如FOUP（前开口统一盒）的晶片载体的集成对接平台的车辆。 对接平台位于正确的高度，用于将FOUP密封到加工工具的加载锁。 在某些情况下需要垂直和/或水平移动。 还描述了将晶片递送到加工工具的方法。 在优选实施例中，晶片被携带在诸如自动导向的车辆或个人引导车辆的推车上的FOUP内部。 手推车对接在加工工具上，并且FOUP被密封到工具的装载锁上，而不需要将FOUP从推车中取出。 在一个工具上进行处理后，可以将推车与FOUP一起移动到下一个加工工具中进一步处理。 FOUP可以保持在同一个购物车，直到所有的处理完成。 这对于通过制造设施快速移动优先权很有用。

公开(公告)号：US07449071B2

公开(公告)日：2008-11-11

申请号：US10903083

申请日：2004-07-30

Applicant: Ravinder K. Aggarwal ,  Tony J. Keeton ,  Matthew G. Goodman

Inventor： Ravinder K. Aggarwal ,  Tony J. Keeton ,  Matthew G. Goodman

IPC: C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC classification number: H01L21/68735 ,  C23C16/4584 ,  C23C16/4585 ,  C23C16/481 ,  H01L21/68742

Abstract: A wafer holder for supporting a wafer within a CVD processing chamber includes a vertically moveable lift ring configured to support the bottom peripheral surface of the wafer, and an inner plug having a top flat surface configured to support the wafer during wafer processing. The lift ring has a central aperture configured to closely surround the inner plug. When a wafer is to be loaded onto the wafer holder, the lift ring is elevated above the inner plug. The wafer is loaded onto the lift ring in the elevated position. Then, the lift ring is maintained in the elevated position for a time period sufficient to allow the wafer temperature to rise to a level that is sufficient to significantly reduce or even substantially prevent thermal shock to the wafer when the wafer is brought into contact with the inner plug. The lift ring is then lowered into surrounding engagement with the inner plug. This is the wafer processing position of the wafer holder.

Abstract translation: 用于在CVD处理室内支撑晶片的晶片保持器包括构造成支撑晶片的底部周边表面的可垂直移动的提升环，以及配置成在晶片处理期间支撑晶片的顶部平坦表面的内部插塞。 提升环具有构造成紧密围绕内塞的中心孔。 当将晶片装载到晶片保持器上时，升降环升高到内塞上方。 晶片在提升位置被装载到提升环上。 然后，提升环保持在升高位置一段足以允许晶片温度上升至足以显着降低甚至基本上防止晶片对晶片的热冲击的水平的时间，当晶片与 内塞 然后升降环下降到与内塞的周围接合。 这是晶片保持器的晶片加工位置。

公开(公告)号：US4987856A

公开(公告)日：1991-01-29

申请号：US354922

申请日：1989-05-22

Applicant: H. Peter W. Hey ,  William A. Mazak ,  Ravinder K. Aggarwal ,  John H. Curtin

Inventor： H. Peter W. Hey ,  William A. Mazak ,  Ravinder K. Aggarwal ,  John H. Curtin

IPC: H01L21/205 ,  C23C16/44 ,  C23C16/455 ,  C23C16/54 ,  H01L21/00 ,  H01L21/31

CPC classification number: C23C16/45565 ,  C23C16/455 ,  C23C16/54 ,  H01L21/67103 ,  H01L21/67109

Abstract: Each of a plurality of individually heated circularly located susceptors supports and heats one of a plurality of wafers within a processing chamber. An overhead gas dispersion head, vertically aligned with each susceptor, directs, in combination with downstream flow control structure, flow of a reactant gas radially uniformly across the supported wafer. A spider sequentially relocates each of the wafers, as a group, to an adjacent susceptor. Wafer handling apparatus replaces each processed wafer to provide a high production rate throughput. A source of RF energy radiating essentially primarily between each gas dispersion head and its associated susceptor provides a plasma enhanced environment and the low level intensity elsewhere within the reactor reduces residual deposits.

公开(公告)号：US20100286842A1

公开(公告)日：2010-11-11

申请号：US12436306

申请日：2009-05-06

Applicant: Ravinder K. Aggarwal ,  Rand Conner

Inventor： Ravinder K. Aggarwal ,  Rand Conner

IPC: G05D23/19 ,  G01K7/02 ,  G06F11/07 ,  G06F12/00

CPC classification number: G01K7/02 ,  G01K1/02 ,  G05D23/1931 ,  G05D23/22

Abstract: A temperature measuring device having a smart chip, or electronic circuit, integrated therein is provided. The smart chip, or electronic circuit, includes at least a unique identification number or data specific to the particular temperature measuring device stored thereon. The electronic circuit further includes calibration data of the temperature measuring device stored thereon. A module controller of a temperature control system is configured to verify the unique identification number of the thermocouple assembly prior to allowing data to be transferred between the temperature measuring device and a temperature controller. A graphical user interface allows an operator to enter the unique identification number or data to verify the temperature measuring device and display an error message if the number or data entered is not equivalent, or does not match, the unique identification number or data stored on the electronic circuit.

Abstract translation: 提供一种具有集成在其中的智能芯片或电子电路的温度测量装置。 智能芯片或电子电路至少包括唯一的识别号或特定于其上存储的特定温度测量装置的数据。 电子电路还包括存储在其上的温度测量装置的校准数据。 温度控制系统的模块控制器被配置为在允许在温度测量装置和温度控制器之间传送数据之前验证热电偶组件的唯一标识号。 图形用户界面允许操作员输入唯一的识别号码或数据来验证温度测量设备，并且如果所输入的数字或数据不等同于或不匹配存储在该存储器上的唯一标识号或数据，则显示错误消息 电子电路。

公开(公告)号：US06776849B2

公开(公告)日：2004-08-17

申请号：US10100308

申请日：2002-03-15

Applicant: Ravinder K. Aggarwal ,  Tony J. Keeton ,  Matthew G. Goodman

Inventor： Ravinder K. Aggarwal ,  Tony J. Keeton ,  Matthew G. Goodman

IPC: H01L2100

CPC classification number: H01L21/68735 ,  C23C16/4584 ,  C23C16/4585 ,  C23C16/481 ,  H01L21/68742

Abstract: A wafer holder for supporting a wafer within a CVD processing chamber includes a vertically moveable lift ring configured to support the bottom peripheral surface of the wafer, and an inner plug having a top flat surface configured to support the wafer during wafer processing. The lift ring has a central aperture configured to closely surround the inner plug. When a wafer is to be loaded onto the wafer holder, the lift ring is elevated above the inner plug. The wafer is loaded onto the lift ring in the elevated position. Then, the lift ring is maintained in the elevated position for a time period sufficient to allow the wafer temperature to rise to a level that is sufficient to significantly reduce or even substantially prevent thermal shock to the wafer when the wafer is brought into contact with the inner plug. The lift ring is then lowered into surrounding engagement with the inner plug. This is the wafer processing position of the wafer holder.

Abstract translation: 用于在CVD处理室内支撑晶片的晶片保持器包括构造成支撑晶片的底部周边表面的可垂直移动的提升环，以及配置成在晶片处理期间支撑晶片的顶部平坦表面的内部插塞。 提升环具有构造成紧密围绕内塞的中心孔。 当将晶片装载到晶片保持器上时，升降环升高到内塞上方。 晶片在提升位置被装载到提升环上。 然后，提升环保持在升高位置一段足以允许晶片温度上升至足以显着降低甚至基本上防止晶片对晶片的热冲击的水平的时间，当晶片与 内塞 然后升降环下降到与内塞的周围接合。 这是晶片保持器的晶片加工位置。