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1.发明授权Structure and apparatus for cooling integrated circuits using cooper microchannels 有权使用铜芯微通道冷却集成电路的结构和装置公开(公告)号：US08210243B2
公开(公告)日：2012-07-03
申请号：US12177020
申请日：2008-07-21
申请人： Raschid Jose Bezama , Evan George Colgan , Madhusudan K. Iyengar , John Harold Magerlein , Roger Ray Schmidt
发明人： Raschid Jose Bezama , Evan George Colgan , Madhusudan K. Iyengar , John Harold Magerlein , Roger Ray Schmidt
CPC分类号： F28F3/12 , F28F2260/02 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
摘要翻译： 一种具有整体构造的冷却器，包括在基部上包括多个翅片的通道部分，所述多个翅片在其间限定多个微通道，形成在所述多个翅片的一组中的锥形开口， 所述歧管部分包括设置在所述多个翅片中的所述锥形开口上方的入口和出口，以及包括设置在所述通道部分和所述歧管部分之间的至少两个细长开口的隔离片。
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2.发明申请Structure and Apparatus for Cooling Integrated Circuits Using Cooper Microchannels 有权使用库珀微通道冷却集成电路的结构和装置公开(公告)号：US20100012294A1
公开(公告)日：2010-01-21
申请号：US12177020
申请日：2008-07-21
申请人： Raschid Jose Bezama , Evan George Colgan , Madhusudan K. Iyengar , John Harold Magerlein , Roger Ray Schmidt
发明人： Raschid Jose Bezama , Evan George Colgan , Madhusudan K. Iyengar , John Harold Magerlein , Roger Ray Schmidt
IPC分类号： F28F7/00
CPC分类号： F28F3/12 , F28F2260/02 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
摘要翻译： 一种具有整体构造的冷却器，包括在基部上包括多个翅片的通道部分，所述多个翅片在其间限定多个微通道，形成在所述多个翅片的一组中的锥形开口， 所述歧管部分包括设置在所述多个翅片中的所述锥形开口上方的入口和出口，以及包括设置在所述通道部分和所述歧管部分之间的至少两个细长开口的隔离片。
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公开(公告)号：US08418751B2
公开(公告)日：2013-04-16
申请号：US12120069
申请日：2008-05-13
CPC分类号： H01L23/473 , F28D9/0075 , F28F13/003 , H01L2924/0002 , H01L2924/00
摘要： A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet.
摘要翻译： 冷却器包括基层，冷却层，其包括至少一个入口槽和至少一个出口槽，用于使冷却剂流过包括排列成行和列的多个交错散热片的冷却结构，其中相邻列的翅片交错， 以及设置在所述冷却层上的至少一个歧管层，用于使冷却剂从冷却器入口流动到所述至少入口狭槽，并且从所述至少一个出口狭缝到冷却器出口，所述至少一个歧管层具有顶层， 冷却器入口和冷却器出口。
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4.发明申请Semiconductor Package Structures Having Liquid Cooler Integrated with First Level Chip Package Modules 有权具有与一级芯片封装模块集成的液体冷却器的半导体封装结构公开(公告)号：US20120049341A1
公开(公告)日：2012-03-01
申请号：US13290824
申请日：2011-11-07
申请人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
发明人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/3675 , H01L23/49833 , H01L23/4985 , H01L2023/4043 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/00
摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。
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5.发明申请Semiconductor Package Structures Having Liquid Coolers Integrated with First Level Chip Package Modules 有权具有与一级芯片封装模块集成的液体冷却器的半导体封装结构公开(公告)号：US20090283902A1
公开(公告)日：2009-11-19
申请号：US12120029
申请日：2008-05-13
申请人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
发明人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
IPC分类号： H01L23/473
CPC分类号： H01L23/473 , H01L23/3675 , H01L23/49833 , H01L23/4985 , H01L2023/4043 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/00
摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。
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6.发明授权Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages 有权用于半导体集成电路封装的微通道冷却的装置和方法公开(公告)号：US07139172B2
公开(公告)日：2006-11-21
申请号：US10883392
申请日：2004-07-01
IPC分类号： H05K7/20
CPC分类号： F28F3/04 , F28F3/12 , F28F2260/02 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.
摘要翻译： 提供了用于诸如IC芯片的电子器件的微通道冷却的装置和方法，其能够将具有不均匀功率密度分布的高功率密度电子器件的有效和低工作压力的微通道冷却面朝下安装在封装衬底上。 例如，用于冷却IC芯片的集成微通道冷却器装置（或微通道散热装置）被设计成提供冷却剂流体的均匀流动和分配并且使冷却剂流动路径上的压降最小化，并且为高功率密度提供可变的局部冷却能力 具有高于平均功率密度的IC芯片的区域（或“热点”）。
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7.发明授权Semiconductor package structures having liquid coolers integrated with first level chip package modules 有权具有与第一级芯片封装模块集成的液体冷却器的半导体封装结构公开(公告)号：US08115303B2
公开(公告)日：2012-02-14
申请号：US12120029
申请日：2008-05-13
申请人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
发明人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
IPC分类号： H01L23/40
CPC分类号： H01L23/473 , H01L23/3675 , H01L23/49833 , H01L23/4985 , H01L2023/4043 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/00
摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。
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公开(公告)号：US20090283244A1
公开(公告)日：2009-11-19
申请号：US12120069
申请日：2008-05-13
IPC分类号： F28F7/00
CPC分类号： H01L23/473 , F28D9/0075 , F28F13/003 , H01L2924/0002 , H01L2924/00
摘要： A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet.
摘要翻译： 冷却器包括基层，冷却层，其包括至少一个入口槽和至少一个出口槽，用于使冷却剂流过包括排列成行和列的多个交错散热片的冷却结构，其中相邻列的翅片交错， 以及设置在所述冷却层上的至少一个歧管层，用于使冷却剂从冷却器入口流动到所述至少入口狭槽，并且从所述至少一个出口狭缝到冷却器出口，所述至少一个歧管层具有顶层， 冷却器入口和冷却器出口。
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9.发明授权Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages 有权用于半导体集成电路封装的微通道冷却的装置和方法公开(公告)号：US07190580B2
公开(公告)日：2007-03-13
申请号：US10883534
申请日：2004-07-01
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , F28F3/12 , F28F9/028 , F28F13/06 , F28F2260/02 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.
摘要翻译： 提供了用于诸如IC芯片的电子器件的微通道冷却的装置和方法，其能够实现高功率密度电子器件的高效和低工作压力的微通道冷却。 用于微通道冷却的装置包括集成微通道散热装置和流体分配歧管结构，其被设计成提供冷却剂流体的均匀流动和分布并使沿着冷却剂流动路径的压降最小化。
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10.发明授权Semiconductor package structures having liquid cooler integrated with first level chip package modules 有权具有与第一级芯片封装模块集成的液体冷却器的半导体封装结构公开(公告)号：US08772927B2
公开(公告)日：2014-07-08
申请号：US13290824
申请日：2011-11-07
申请人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
发明人： Raschid Jose Bezama , Evan George Colgan , Michael Gaynes , John Harold Magerlein , Kenneth C. Marston , Xiaojin Wei
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L23/3675 , H01L23/49833 , H01L23/4985 , H01L2023/4043 , H01L2023/4087 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2924/10253 , H01L2924/15311 , H01L2924/19105 , H01L2924/00
摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。
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