Stacked and redundant chip coolers
    3.
    发明授权
    Stacked and redundant chip coolers 失效
    堆叠冗余芯片冷却器

    公开(公告)号:US08418751B2

    公开(公告)日:2013-04-16

    申请号:US12120069

    申请日:2008-05-13

    IPC分类号: F28F7/00 H05K7/20

    摘要: A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet.

    摘要翻译: 冷却器包括基层,冷却层,其包括至少一个入口槽和至少一个出口槽,用于使冷却剂流过包括排列成行和列的多个交错散热片的冷却结构,其中相邻列的翅片交错, 以及设置在所述冷却层上的至少一个歧管层,用于使冷却剂从冷却器入口流动到所述至少入口狭槽,并且从所述至少一个出口狭缝到冷却器出口,所述至少一个歧管层具有顶层, 冷却器入口和冷却器出口。

    Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
    6.
    发明授权
    Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages 有权
    用于半导体集成电路封装的微通道冷却的装置和方法

    公开(公告)号:US07139172B2

    公开(公告)日:2006-11-21

    申请号:US10883392

    申请日:2004-07-01

    IPC分类号: H05K7/20

    摘要: Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices having a non-uniform power density distribution, which are mounted face down on a package substrate. For example, integrated microchannel cooler devices (or microchannel heat sink devices) for cooling IC chips are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths, as well as provide variable localized cooling capabilities for high power density regions (or “hot spots”) of IC chips with higher than average power densities.

    摘要翻译: 提供了用于诸如IC芯片的电子器件的微通道冷却的装置和方法,其能够将具有不均匀功率密度分布的高功率密度电子器件的有效和低工作压力的微通道冷却面朝下安装在封装衬底上。 例如,用于冷却IC芯片的集成微通道冷却器装置(或微通道散热装置)被设计成提供冷却剂流体的均匀流动和分配并且使冷却剂流动路径上的压降最小化,并且为高功率密度提供可变的局部冷却能力 具有高于平均功率密度的IC芯片的区域(或“热点”)。

    Stacked and Redundant Chip Coolers
    8.
    发明申请
    Stacked and Redundant Chip Coolers 失效
    堆叠和冗余芯片冷却器

    公开(公告)号:US20090283244A1

    公开(公告)日:2009-11-19

    申请号:US12120069

    申请日:2008-05-13

    IPC分类号: F28F7/00

    摘要: A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet.

    摘要翻译: 冷却器包括基层,冷却层,其包括至少一个入口槽和至少一个出口槽,用于使冷却剂流过包括排列成行和列的多个交错散热片的冷却结构,其中相邻列的翅片交错, 以及设置在所述冷却层上的至少一个歧管层,用于使冷却剂从冷却器入口流动到所述至少入口狭槽,并且从所述至少一个出口狭缝到冷却器出口,所述至少一个歧管层具有顶层, 冷却器入口和冷却器出口。