发明授权
US07190580B2 Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
有权
用于半导体集成电路封装的微通道冷却的装置和方法
- 专利标题： Apparatus and methods for microchannel cooling of semiconductor integrated circuit packages
- 专利标题（中）： 用于半导体集成电路封装的微通道冷却的装置和方法
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申请号： US10883534申请日： 2004-07-01
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公开(公告)号： US07190580B2公开(公告)日： 2007-03-13
- 发明人: Raschid Jose Bezama , Evan George Colgan , John Harold Magerlein , Roger Ray Schmidt
- 申请人： Raschid Jose Bezama , Evan George Colgan , John Harold Magerlein , Roger Ray Schmidt
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： F. Chau & Associates LLC
- 代理商 Frank V. DeRosa
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
Apparatus and methods are provided for microchannel cooling of electronic devices such as IC chips, which enable efficient and low operating pressure microchannel cooling of high power density electronic devices. Apparatus for microchannel cooling include integrated microchannel heat sink devices and fluid distribution manifold structures that are designed to provide uniform flow and distribution of coolant fluid and minimize pressure drops along coolant flow paths.
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