公开(公告)号：US20120049341A1

公开(公告)日：2012-03-01

申请号：US13290824

申请日：2011-11-07

申请人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

发明人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L23/3675 ,  H01L23/49833 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/4087 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

公开(公告)号：US20090283902A1

公开(公告)日：2009-11-19

申请号：US12120029

申请日：2008-05-13

申请人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

发明人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

IPC分类号： H01L23/473

CPC分类号： H01L23/473 ,  H01L23/3675 ,  H01L23/49833 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/4087 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

公开(公告)号：US08115303B2

公开(公告)日：2012-02-14

申请号：US12120029

申请日：2008-05-13

申请人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

发明人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

IPC分类号： H01L23/40

CPC分类号： H01L23/473 ,  H01L23/3675 ,  H01L23/49833 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/4087 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

公开(公告)号：US08772927B2

公开(公告)日：2014-07-08

申请号：US13290824

申请日：2011-11-07

申请人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

发明人： Raschid Jose Bezama ,  Evan George Colgan ,  Michael Gaynes ,  John Harold Magerlein ,  Kenneth C. Marston ,  Xiaojin Wei

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L23/3675 ,  H01L23/49833 ,  H01L23/4985 ,  H01L2023/4043 ,  H01L2023/4087 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/00

摘要： Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

摘要翻译： 提供半导体封装结构，其被设计成具有与第一级芯片模块整体封装的液体冷却器。 特别地，用于将第一级芯片封装结构中的液体冷却器装置整体封装的装置包括其中液体冷却器装置直接热耦合到安装在柔性芯片载体衬底上的集成电路芯片倒装芯片的背面的结构。 液体冷却器装置通过金属加强结构机械耦合到封装基板，金属加强结构结合到柔性封装基板上，以向柔性封装基板提供机械刚性。

公开(公告)号：US07928562B2

公开(公告)日：2011-04-19

申请号：US12177194

申请日：2008-07-22

申请人： Amilcar R. Arvelo ,  Evan G. Colgan ,  John H. Magerlein ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Jamil A. Wakil ,  Xiaojin Wei ,  Jeffrey A. Zitz

发明人： Amilcar R. Arvelo ,  Evan G. Colgan ,  John H. Magerlein ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Jamil A. Wakil ,  Xiaojin Wei ,  Jeffrey A. Zitz

IPC分类号： H01L23/36

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L23/10 ,  H01L23/42 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2924/00

摘要： An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.

摘要翻译： 提供了一种用于减少在计算环境中使用的三维（3D）裸片堆栈的热惩罚的装置，并且包括安装在计算环境内的基板，执行计算环境的操作的第一部件，其耦合到 所述基板在堆叠方向上，一组第二部件，用于执行所述计算环境的操作，每个部件耦合到所述第一部件并相对于彼此分割以形成空出的区域;布置在所述热界面材料（TIM） 在第一和第二部件的暴露的表面上，以及包括突起的盖，其连接到基板以覆盖第一和第二部件，使得突起延伸到空出的区域中，并且使得盖和突起的表面热连通 第一和第二组件通过TIM。

公开(公告)号：US20100019377A1

公开(公告)日：2010-01-28

申请号：US12177194

申请日：2008-07-22

申请人： Amilcar R. Arvelo ,  Evan G. Colgan ,  John H. Magerlein ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Jamil A. Wakil ,  Xiaojin Wei ,  Jeffrey A. Zitz

发明人： Amilcar R. Arvelo ,  Evan G. Colgan ,  John H. Magerlein ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Jamil A. Wakil ,  Xiaojin Wei ,  Jeffrey A. Zitz

IPC分类号： H01L23/36

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L23/10 ,  H01L23/42 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2924/00

摘要： An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.

摘要翻译： 提供了一种用于减少在计算环境中使用的三维（3D）裸片堆栈的热惩罚的装置，并且包括安装在计算环境内的基板，执行计算环境的操作的第一部件，其耦合到 所述基板在堆叠方向上，一组第二部件，用于执行所述计算环境的操作，每个部件耦合到所述第一部件并相对于彼此分割以形成空出的区域;布置在所述热界面材料（TIM） 在第一和第二部件的暴露的表面上，以及包括突起的盖，其连接到基板以覆盖第一和第二部件，使得突起延伸到空出的区域中，并且使得盖和突起的表面热连通 第一和第二组件通过TIM。

公开(公告)号：US07917328B2

公开(公告)日：2011-03-29

申请号：US12194606

申请日：2008-08-20

申请人： Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcom S. Ware ,  Roger D. Weekly

发明人： Jon A. Casey ,  Michael S. Floyd ,  Soraya Ghiasi ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Malcom S. Ware ,  Roger D. Weekly

IPC分类号： G06F19/00

CPC分类号： G06F11/3058

摘要： Monitoring temperature excursions an assembly experiences over a life of the assembly is provided. A determination is made as to whether the assembly has been in service beyond a predetermined end of life objective. Responsive to the assembly failing to be in service beyond the predetermined end of life objective, a new temperature value associated with the assembly is read. A modifier value for a figure of merit (FOM) value is computed and added to a cumulative figure of merit value. The cumulative figure of merit value is compared to a cumulative stress figure of merit budget. Responsive to the cumulative figure of merit value exceeding the cumulative stress figure of merit budget, an identified stress management solution is implemented.

摘要翻译： 提供了组装过程中组装体验的温度偏移。 确定组件是否已经超出预定寿命目标的使用。 响应于组装不能超过预定寿命目标的服务，读取与组件相关联的新的温度值。 计算品质因数（FOM）值的修饰符值，并将其添加到累积品质因数值。 将累积的绩效值与累积压力的绩效预算进行比较。 响应累积绩效值超过累积压力的绩效预算数量，实施了一个确定的压力管理解决方案。

公开(公告)号：US08268389B2

公开(公告)日：2012-09-18

申请号：US12684174

申请日：2010-01-08

申请人： Evan G. Colgan ,  Paul W. Coteus ,  Michael A. Gaynes ,  Kenneth C. Marston ,  Steven P. Ostrander

发明人： Evan G. Colgan ,  Paul W. Coteus ,  Michael A. Gaynes ,  Kenneth C. Marston ,  Steven P. Ostrander

IPC分类号： B05D5/10

CPC分类号： B32B37/1207 ,  B32B37/26 ,  B32B2037/243 ,  B32B2037/268 ,  B32B2309/02 ,  B32B2311/12 ,  B32B2311/24 ,  B32B2457/08 ,  Y10T156/11 ,  Y10T156/1195 ,  Y10T428/2804 ,  Y10T428/2813 ,  Y10T428/2861

摘要： Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.

摘要翻译： 预制的可固化热界面粘合剂便于在其热界面处容易且可重复地分离和保留电子部件，以及用于通过使用这种粘合剂在组件的热界面处实现上述可重复分离和重新化的方法。

公开(公告)号：US07239516B2

公开(公告)日：2007-07-03

申请号：US10939230

申请日：2004-09-10

申请人： David C. Long ,  Glenn G. Daves ,  David L. Edwards ,  Ronald L. Hering ,  Sushumna Iruvanti ,  Kenneth C. Marston ,  Jason S. Miller

发明人： David C. Long ,  Glenn G. Daves ,  David L. Edwards ,  Ronald L. Hering ,  Sushumna Iruvanti ,  Kenneth C. Marston ,  Jason S. Miller

IPC分类号： H05K7/20

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A flexible plate for securing a microchip surface to the surface of a cooling device. The flexible plate allows for z-directional movement between the microchip subassembly having a circuit board and a semiconductor substrate, and the cooling device. The flexible plate is a compact, single piece design that provides constraints in alignment in the x-, y-, and theta-directions, while allowing for z-direction compliance and tilt compliance. The flexible plate has tabs for mounting the microchip subassembly and tabs for mounting the cooling device. The microchip tabs are opposite one another and the cooling device mounting tabs are opposite one another. The flexible plate is a one-piece construction made from sheet metal, plastic, or metal castings. The flexible plate has a band with all the tabs mounted on the inside of the band, or one set of tabs mounted on the outside of the band.

摘要翻译： 用于将微芯片表面固定到冷却装置的表面的柔性板。 柔性板允许具有电路板的微芯片组件和半导体衬底之间的z方向运动以及冷却装置。 柔性板是一种紧凑的单件设计，可在x轴，y轴和θ轴方向上对齐，同时允许z方向顺应性和倾斜顺应性。 柔性板具有用于安装用于安装冷却装置的微芯片组件和突出部的突片。 微芯片接头彼此相对，并且冷却装置安装接头彼此相对。 柔性板是由金属板，塑料或金属铸件制成的一体式结构。 柔性板具有带子，其中所有突片安装在带的内部，或者一组安装在带的外侧上的突片。

公开(公告)号：US08421217B2

公开(公告)日：2013-04-16

申请号：US13419949

申请日：2012-03-14

申请人： Jon A. Casey ,  John S. Corbin, Jr. ,  David Danovitch ,  Isabelle Depatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

发明人： Jon A. Casey ,  John S. Corbin, Jr. ,  David Danovitch ,  Isabelle Depatie ,  Virendra R. Jadhav ,  Roger A. Liptak ,  Kenneth C. Marston ,  Jennifer V. Muncy ,  Sylvain Ouimet ,  Eric Salvas

IPC分类号： H01L23/12 ,  H01L23/34

CPC分类号： H01L23/04 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/28 ,  H01L24/31 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/0401

摘要： A system and method system for achieving mechanical and thermal stability in a multi-chip package. The system utilizes a lid and multiple thermal interface materials. The method includes utilizing a lid on a multi-chip package and utilizing multiple thermal interface materials on the multi-chip package.

摘要翻译： 一种用于在多芯片封装中实现机械和热稳定性的系统和方法系统。 该系统采用盖子和多个热界面材料。 该方法包括在多芯片封装上利用盖子，并在多芯片封装上利用多个热界面材料。