发明授权
- 专利标题： Structure and apparatus for cooling integrated circuits using cooper microchannels
- 专利标题（中）： 使用铜芯微通道冷却集成电路的结构和装置
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申请号： US12177020申请日： 2008-07-21
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公开(公告)号： US08210243B2公开(公告)日： 2012-07-03
- 发明人: Raschid Jose Bezama , Evan George Colgan , Madhusudan K. Iyengar , John Harold Magerlein , Roger Ray Schmidt
- 申请人： Raschid Jose Bezama , Evan George Colgan , Madhusudan K. Iyengar , John Harold Magerlein , Roger Ray Schmidt
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理机构： F. Chau & Associates, LLC
- 代理商 Louis J. Percello, Esq.
- 主分类号： F28F7/00
- IPC分类号： F28F7/00 ; H05K7/20
摘要：
A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
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