发明授权
US08210243B2 Structure and apparatus for cooling integrated circuits using cooper microchannels 有权
使用铜芯微通道冷却集成电路的结构和装置

Structure and apparatus for cooling integrated circuits using cooper microchannels
摘要:
A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
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