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    Filtered feedthrough assembly and method of manufacture
    1.
    发明授权
    Filtered feedthrough assembly and method of manufacture 有权
    过滤馈通组件及其制造方法

    公开(公告)号：US07748093B2

    公开(公告)日：2010-07-06

    申请号：US11872452

    申请日：2007-10-15

    申请人： Rajesh V. Iyer ,  Susan A. Tettemer ,  John P. Tardiff ,  Shawn D. Knowles

    发明人： Rajesh V. Iyer ,  Susan A. Tettemer ,  John P. Tardiff ,  Shawn D. Knowles

    IPC分类号： H01G7/00

    CPC分类号： H01G4/242 ,  H01G2/106 ,  H01G4/35 ,  Y10T29/42 ,  Y10T29/435 ,  Y10T29/49002 ,  Y10T29/49004 ,  Y10T29/49078 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T29/49171 ,  Y10T29/49176

    摘要： A filtered feedthrough assembly having at least one terminal pin therethrough is provided. The feedthrough assembly comprises a ferrule having a cavity therethrough for receiving the terminal pin, and insulating structure having an upper surface. The insulating structure is disposed within the cavity and around the terminal pin for electrically isolating the pin from the ferrule. A capacitor is disposed around the pin and electrically coupled thereto. The capacitor has a lower surface that is disposed proximate the upper surface, and at least one washer is disposed between the upper surface and the lower surface. To attach the capacitor to the insulating structure, a body of epoxy is substantially confined between the upper surface and the lower surface by the ferrule, the insulating structure, the capacitor, and the at least one washer.

    摘要翻译： 提供了具有穿过其中的至少一个端子销的经滤波的馈通组件。 馈通组件包括具有穿过其的用于接收端子销的空腔的套圈以及具有上表面的绝缘结构。 绝缘结构设置在空腔内并且围绕端子销以将引脚与套圈电隔离。 电容器设置在销周围并与其电耦合。 电容器具有靠近上表面设置的下表面，并且至少一个垫圈设置在上表面和下表面之间。 为了将电容器附接到绝缘结构，环氧树脂体通过套圈，绝缘结构，电容器和至少一个垫圈基本上限制在上表面和下表面之间。

    Filtered electrical interconnect assembly
    2.
    发明授权
    Filtered electrical interconnect assembly 有权
    过滤电气互连组件

    公开(公告)号：US07590450B2

    公开(公告)日：2009-09-15

    申请号：US11343174

    申请日：2006-01-30

    申请人： Rajesh V. Iyer ,  Shawn D. Knowles

    发明人： Rajesh V. Iyer ,  Shawn D. Knowles

    IPC分类号： A61N1/00

    CPC分类号： A61N1/3754

    摘要： An electronic module assembly for an implantable medical device includes a non-conductive block having an opening for accepting a feedthrough conductor. The block has opposite first and second ends and opposite first and second sides. A bond pad is located on the first end of the block for electrical connection to a feedthrough conductor, and the bond pad extends to the first side of the block to provide an electrical connection region there.

    摘要翻译： 用于可植入医疗装置的电子模块组件包括具有用于接受馈通导体的开口的非导电块。 该块具有相对的第一和第二端以及相对的第一和第二侧。 接合焊盘位于块的第一端上，用于电连接到馈通导体，并且接合焊盘延伸到块的第一侧以在其中提供电连接区域。

    Multipolar feedthrough assembly with customizable filter and method of manufacture
    4.
    发明授权
    Multipolar feedthrough assembly with customizable filter and method of manufacture 有权
    具有可定制滤波器和制造方法的多极馈通组件

    公开(公告)号：US07187535B1

    公开(公告)日：2007-03-06

    申请号：US11343109

    申请日：2006-01-30

    申请人： Rajesh V. Iyer ,  Daniel J. Koch ,  Shawn D. Knowles

    发明人： Rajesh V. Iyer ,  Daniel J. Koch ,  Shawn D. Knowles

    IPC分类号： H01G4/35 ,  H01G4/228

    CPC分类号： H01G4/35 ,  A61N1/3754 ,  H01G4/232 ,  H01G4/236

    摘要： A feedthrough assembly for guiding a plurality of terminal pins through the housing of an implantable medical device. The feedthrough assembly comprises a ferrule fixedly coupled to the housing and having an aperture therethrough, and a non-conductive supporting structure fixedly coupled to the plurality of terminal pins and disposed within the aperture. The supporting structure is configured to guide the plurality of terminal pins through the ferrule. A plurality of capacitors, which is fewer in number than the plurality of terminal pins, is fixedly coupled to the supporting structure and electrically coupled between the ferrule and selected ones of the plurality of terminal pins.

    摘要翻译： 馈通组件，用于将多个端子销引导通过可植入医疗装置的壳体。 馈通组件包括固定地联接到壳体并且具有穿过其中的孔的套圈，以及固定地联接到多个端子销并设置在孔内的非导电支撑结构。 支撑结构被配置为引导多个端子销穿过套圈。 与多个端子引脚相比，数量少的多个电容器固定地耦合到支撑结构并且电耦合在套圈和多个端子销中的选定端子之间。

    Implantable medical device feedthrough assembly including flange plate
    6.
    发明授权
    Implantable medical device feedthrough assembly including flange plate 有权
    植入式医疗器械馈通组件包括法兰盘

    公开(公告)号：US07725190B2

    公开(公告)日：2010-05-25

    申请号：US11343056

    申请日：2006-01-30

    申请人： Rajesh V. Iyer ,  Shawn D. Knowles

    发明人： Rajesh V. Iyer ,  Shawn D. Knowles

    IPC分类号： A61N1/375

    CPC分类号： A61N1/3754

    摘要： A medical device feedthrough assembly includes a flange plate formed with a plurality of receptacles. A feedthrough subassembly is mounted within each of the receptacles, and a ferrule of each subassembly is coupled to the flange plate.

    摘要翻译： 医疗装置馈通组件包括形成有多个容器的凸缘板。 馈通子组件安装在每个插座内，并且每个子组件的套圈联接到凸缘板。

    Filtering capacitor feedthrough assembly
    8.
    发明授权
    Filtering capacitor feedthrough assembly 有权
    过滤电容器馈通组件

    公开(公告)号：US07706124B2

    公开(公告)日：2010-04-27

    申请号：US12360882

    申请日：2009-01-28

    申请人： Jennifer J. Zhao ,  Micah A. Litow ,  Rajesh Iyer ,  Dawit Y. Belete ,  Simon E. Goldman ,  Shawn D. Knowles

    发明人： Jennifer J. Zhao ,  Micah A. Litow ,  Rajesh Iyer ,  Dawit Y. Belete ,  Simon E. Goldman ,  Shawn D. Knowles

    IPC分类号： H01G4/236 ,  H01G4/228 ,  A61N1/00

    CPC分类号： H01G4/35 ,  A61N1/3754 ,  H01G2/10 ,  Y10T29/435 ,  Y10T29/49002

    摘要： A filtering capacitor feedthrough assembly for an implantable active medical device is disclosed. The filtering capacitor feedthrough assembly includes a capacitor having an aperture, the capacitor is electrically grounded to an electrically conductive feedthrough ferrule or housing of the implantable active medical device. A terminal pin extends into the aperture and an electrically conductive continuous coil is disposed within the aperture and between the terminal pin and the capacitor. The electrically conductive continuous coil mechanically secures and electrically couples the terminal pin to the capacitor.

    摘要翻译： 公开了一种用于可植入有源医疗装置的滤波电容器馈通组件。 滤波电容器馈通组件包括具有孔的电容器，电容器电接地到可植入有源医疗装置的导电馈通插芯或壳体。 端子销延伸到孔中，并且导电连续线圈设置在孔内并且在端子引脚和电容器之间。 导电连续线圈将端子引脚机械地固定和电耦合到电容器。

    Method of coating the interior surface of hollow objects with a diffusion coating
    9.
    发明授权
    Method of coating the interior surface of hollow objects with a diffusion coating 失效
    用扩散涂层涂覆中空物体的内表面的方法

    公开(公告)号：US06866886B2

    公开(公告)日：2005-03-15

    申请号：US10406766

    申请日：2003-04-02

    申请人： Shawn D. Knowles ,  David J. Senor ,  Steven V. Forbes ,  Roger N. Johnson ,  Glenn W. Hollenberg

    发明人： Shawn D. Knowles ,  David J. Senor ,  Steven V. Forbes ,  Roger N. Johnson ,  Glenn W. Hollenberg

    IPC分类号： C23C10/04 ,  C23C10/06 ,  C23C14/04 ,  C23C14/24 ,  C23C14/26 ,  C23C14/58 ,  B05D7/22

    CPC分类号： C23C14/26 ,  C23C10/06 ,  C23C14/046 ,  C23C14/24 ,  C23C14/5893 ,  Y10S118/10 ,  Y10S118/13

    摘要： A method for forming a diffusion coating on the interior of surface of a hollow object wherein a filament, extending through a hollow object and adjacent to the interior surface of the object, is provided, with a coating material, in a vacuum. An electrical current is then applied to the filament to resistively heat the filament to a temperature sufficient to transfer the coating material from the filament to the interior surface of the object. The filament is electrically isolated from the object while the filament is being resistively heated. Preferably, the filament is provided as a tungsten filament or molybdenum filament. Preferably, the coating materials are selected from the group consisting of Ag, Al, As, Au, Ba, Be, Bi, Ca, Cd, Co, Cr, Cu, Dy, Er, Eu, Fe, Ga, Ge, Hg, In, K, Li, Mg, Mn, Na, Ni P, Pb, Pd, Pr, S, Sb, Sc, Se, Si, Sn, Sr, Te, Tl, Y, Yb, Zn, and combinations thereof. The invention additionally allows for the formation of nitrides, hydrides, or carbides of all the possible coating materials, where such compounds exist, by providing a partial pressure of nitrogen, hydrogen, hydrocarbons, or combination thereof, within the vacuum.

    摘要翻译： 一种在中空物体的表面内部形成扩散涂层的方法，其中通过中空物体延伸并与物体的内表面相邻的细丝在真空中被提供有涂层材料。 然后将电流施加到灯丝​​上以将灯丝电阻加热到足以将涂层材料从灯丝转移到物体的内表面的温度。 当灯丝被电阻加热时，灯丝与物体电隔离。 优选地，丝被提供为钨丝或钼丝。 优选地，涂层材料选自Ag，Al，As，Au，Ba，Be，Bi，Ca，Cd，Co，Cr，Cu，Dy，Er，Eu，Fe，Ga，Ge，Hg， In，K，Li，Mg，Mn，Na，Ni P，Pb，Pd，Pr，S，Sb，Sc，Se，Si，Sn，Sr，Te，Tl，Y，Yb，Zn及其组合。 本发明还允许通过在真空中提供氮，氢，烃或其组合的分压，形成所有可能的涂覆材料的氮化物，氢化物或碳化物，其中存在这些化合物。